| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 01/01/2004 | US20040000489 Electrochemistry; forming three-dimensional multilayer structures; measurement voltage profile |
| 01/01/2004 | US20040000488 Plating substrate; preconditioning surface; controlling thickness; reducing electrolyte leakage; multilayer integrated circuit |
| 01/01/2004 | US20040000487 Adjust pattern configuration of passageway; fluid flow of electrolyte |
| 01/01/2004 | US20040000486 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 12/31/2003 | WO2004001178A2 Method and apparatus for downhole pipe or casing repair |
| 12/31/2003 | WO2004001102A1 Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| 12/31/2003 | WO2004001100A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 12/31/2003 | WO2003088316A3 Electropolishing and electroplating methods |
| 12/31/2003 | WO2003077258A3 Magnetic flux concentrating cladding material on conductive lines of mram |
| 12/31/2003 | CN1465216A Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| 12/30/2003 | US6670308 Electrochemistry; electromagnetism; superconductivity; biaxially orientented films |
| 12/30/2003 | US6669997 Acousto-immersion coating and process for magnesium and its alloy |
| 12/30/2003 | US6669833 Agitating electrolyte inside tank with suspended, reciprocating paddle |
| 12/30/2003 | US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same |
| 12/25/2003 | US20030234183 Electroplating metal with thin dense chromium by immersing the metal in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics |
| 12/25/2003 | US20030234181 Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| 12/25/2003 | US20030234180 Optical and electro-optical apparatus in the form of thin films which changes in color and refractive index along its length and thickness; waveguides |
| 12/25/2003 | US20030234179 Methods of and apparatus for molding structures using sacrificial metal patterns |
| 12/24/2003 | WO2003048427A3 Pretreatment process for coating of aluminium materials |
| 12/24/2003 | WO2003033771A3 Method and system for selective electro-coating of the surfaces of metals |
| 12/24/2003 | WO2002070144A8 Internal heat spreader plating methods and devices |
| 12/24/2003 | CN1463224A Coated article |
| 12/24/2003 | CN1132239C Method of mfg. semiconductor device |
| 12/23/2003 | US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics |
| 12/23/2003 | US6666960 Electroplating current supply system |
| 12/23/2003 | US6666959 Semiconductor workpiece proximity plating methods and apparatus |
| 12/18/2003 | WO2003105545A1 Flexible printed circuit board and process for producing the same |
| 12/18/2003 | WO2003027011B1 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 12/18/2003 | WO2003009361A3 Planar metal electroprocessing |
| 12/18/2003 | US20030232146 Galvanizing the surfaces of iron based materials, by plating, then chromating and embrittlement; corrosion resistance |
| 12/17/2003 | EP1371758A1 Aluminium deposition process on a piece made of plastic |
| 12/17/2003 | EP1371754A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 12/17/2003 | CN1462330A Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 12/16/2003 | US6664633 Alkaline copper plating |
| 12/16/2003 | US6663761 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same |
| 12/16/2003 | US6663759 Coating copper alloys with inks stripes from rolls, exposing to ultraviolet radiation, then plating the uncoated surfaces and stripping the inks to form narrow metal stripes on the alloy; preferential electrodeposition of metals |
| 12/16/2003 | US6662673 Linear motion apparatus and associated method |
| 12/11/2003 | WO2003102277A1 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 12/11/2003 | US20030228743 Pattern forming method and pattern forming device |
| 12/11/2003 | US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/10/2003 | EP1368827A2 Electrochemical methods for polishing copper films on semiconductor substrates |
| 12/10/2003 | CN1461358A Porous nickel foil for alkaline battery cathode, production method and device therefor |
| 12/10/2003 | CN1461258A Coated article having stainless steel colour |
| 12/09/2003 | US6661642 Dielectric structure |
| 12/09/2003 | US6660633 Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed |
| 12/09/2003 | US6660154 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 12/09/2003 | US6660153 Seed layer repair bath |
| 12/09/2003 | US6660152 Elemental silicon nanoparticle plating and method for the same |
| 12/09/2003 | US6660139 Plating apparatus and method |
| 12/09/2003 | US6660137 System for electrochemically processing a workpiece |
| 12/04/2003 | WO2003099490A1 Method for the galvanic coating of a continuous casting mould |
| 12/04/2003 | WO2003083175A3 Method and apparatus for electrochemical processing |
| 12/04/2003 | WO2003030186A3 Nickel coated copper as electrodes for embedded passive devices |
| 12/04/2003 | US20030224196 Metal hydride composite materials |
| 12/04/2003 | US20030222667 Probe card assembly |
| 12/04/2003 | US20030221969 Copper sulfate plating bath is used which contains a polyether containing at least five ether oxygen atoms in molecule, and a compound represented by formula of R1-S-(CH2O)n-R2-SO3M (wherein, R1 is a hydrogen atom, -(S)n-(CH2O)n-R2-SO3M, or |
| 12/04/2003 | US20030221968 Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish |
| 12/04/2003 | US20030221967 Filling is provided, wherein after flash plating, a PPR current is applied for a cycle of 1 to 50 msec positive electrolysis time and 0.2 to 5 msec reverse electrolysis time until an F/R ratio representing the ratio of positive |
| 12/04/2003 | US20030221966 A patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC |
| 12/04/2003 | US20030221953 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 12/03/2003 | EP1366219A2 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 12/03/2003 | EP1366207A1 Plating method of metal film on the surface of polymer |
| 12/03/2003 | EP0966556B1 Graded metal hardware component for an electrochemical cell |
| 12/03/2003 | CN2589490Y Pitch adjustable galvanizing cup of anode, cathode and even flow plate in disk stage packaging |
| 12/03/2003 | CN1460135A Back-end metallisation process |
| 12/03/2003 | CN1460134A Copper-plating solution, plating method and plating apparatus |
| 12/02/2003 | US6656606 Layer of zincate encasing substrate, layer of strike metal covering zincate |
| 12/02/2003 | US6656294 Method of reducing elution of lead in lead-containing copper alloy, and drinking water service fittings made of lead-containing copper alloy |
| 12/02/2003 | US6656275 Partial plating system |
| 12/02/2003 | US6655023 Method and apparatus for burning-in semiconductor devices in wafer form |
| 11/27/2003 | WO2003096859A2 Method for producing galvanised sanitary objects made of plastic |
| 11/27/2003 | US20030219609 Plated component with a hybrid surface and method for manufacturing same |
| 11/27/2003 | US20030219608 Metal transfer sheet, producing method thereof, and producing method of ceramic condenser |
| 11/27/2003 | US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
| 11/27/2003 | US20030217929 Valve for controlling fluid flow |
| 11/27/2003 | US20030217457 Method for preparing composite materials of a positive temperature coefficient thermistor |
| 11/26/2003 | EP1364079A1 A process for electrochemical deposition of tantalum and an article having a surface modification |
| 11/26/2003 | EP1363683A1 Implant and process of modifying an implant surface |
| 11/26/2003 | EP1142041B1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
| 11/25/2003 | US6652993 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer |
| 11/25/2003 | US6652914 Method for selective surface protection of a gas turbine blade which has previously been in service |
| 11/25/2003 | US6652727 Hydrodynamically inaccessible recesses of printed circuits are plated using a pulsed reversing current with cathodic pulses having a duty cycle <50%; plating hydrodynamically accessible recesses using a pulsed reversing current of <50% |
| 11/25/2003 | US6652657 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 11/20/2003 | WO2003096776A1 Flexible printed wiring board for chip-on-film |
| 11/20/2003 | WO2003095715A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plasting operations |
| 11/20/2003 | WO2003095713A1 Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate |
| 11/20/2003 | WO2003095712A2 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry |
| 11/20/2003 | WO2003095711A2 Electrochemically fabricated structures having dielectric or active bases |
| 11/20/2003 | WO2003095708A2 Methods of and apparatus for molding structures |
| 11/20/2003 | WO2003033779A3 Coating method for light metal alloys |
| 11/20/2003 | US20030213699 Nickel electroplating solution |
| 11/19/2003 | EP1362932A1 Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker |
| 11/19/2003 | EP1361837A1 Endoprothesis with galvanised silver layer |
| 11/19/2003 | EP1257693B1 Composite copper foil and manufacturing method thereof |
| 11/19/2003 | CN1456712A Electroplated component and its making method |
| 11/19/2003 | CN1456711A Electroplating method |
| 11/13/2003 | WO2003094246A1 Method for making thin-film semiconductors based on i-iii-vi2 compounds, for photovoltaic applications |
| 11/13/2003 | WO2003093539A1 Metallization of polymer parts for painting |
| 11/13/2003 | WO2003093521A1 Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus |
| 11/13/2003 | WO2003092891A1 Device and method for increasing mass transport at liquid-solid diffusion boundary layer |