| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 02/11/2004 | CN1473963A Iron-manganese alloy plating liquid and method for plating parts |
| 02/11/2004 | CN1138022C Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| 02/10/2004 | US6689686 System and method for electroplating fine geometries |
| 02/05/2004 | WO2004011698A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 02/05/2004 | WO2004011689A2 Polymeric coating formulations and steel substrate composites |
| 02/05/2004 | WO2004011189A1 Brazing product and method of its manufacture |
| 02/05/2004 | WO2004011188A1 Brazing product and method of manufacturing a brazing product |
| 02/05/2004 | US20040023057 Patterned thin film and method of forming same |
| 02/05/2004 | US20040022940 Can reinforce the thin portion of the seed layer and ensures complete filling with copper of the fine recesses, and which is so stable that its performance is not lowered after a long-term continuous use thereof. |
| 02/05/2004 | US20040022604 Polymeric coating formulations and steel substrate composites |
| 02/05/2004 | US20040020783 Copper bath and methods of depositing a matt copper coating |
| 02/05/2004 | US20040020781 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 02/05/2004 | US20040020780 Connecting a power supply between a conductive layer on substrate and an electrode positioned in processing solution; immersing substrate into the processing solution; applying a forward electrical bias to conductive layer during immersion |
| 02/05/2004 | US20040020779 Method and device for producing a galvanic layer on a substrate surface |
| 02/05/2004 | US20040020778 Providing apart having an upper surface and coating surface a first layer of photoresist; patterning; electroless depositing a layer of conductive material; electrodepositing a first layer of metal; depositing and patterning layer of photoresist |
| 02/05/2004 | US20040020767 Locally-distributed electrode and method of fabrication |
| 02/05/2004 | US20040020567 For in-situ conversion coating to the surface of the substantially metallic coating |
| 02/05/2004 | DE10234136A1 Process for the electrochemical micro-processing of a workpiece comprises changing the current field formed by electrodes in an electrolytic liquid by changing the current |
| 02/05/2004 | CA2505829A1 Polymeric coating formulations and steel substrate composites |
| 02/05/2004 | CA2493038A1 Brazing product and method of its manufacture |
| 02/05/2004 | CA2493037A1 Brazing product and method of manufacturing a brazing product |
| 02/04/2004 | EP1228266B1 Method for electrochemically metallising an insulating substrate |
| 02/04/2004 | EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/04/2004 | CN1473357A Substrate processing method |
| 02/04/2004 | CN1473284A Mask forming and removing method, and semiconductor device, electric circuit, display module, color filter and emissive device manufactured by the same method |
| 02/04/2004 | CN1473206A Plasma electroplating |
| 02/04/2004 | CN1473089A Brazing product having low melting point |
| 02/04/2004 | CN1472794A Method for forming copper teading wires in semiconductor device |
| 02/04/2004 | CN1137511C Method for galvanically forming conductor structures of high-purity copper in production of integrated circuits |
| 02/04/2004 | CN1137510C Method for making semiconductor device |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685814 Baffles, shields |
| 01/29/2004 | WO2004009877A2 Electrolytic reactor |
| 01/29/2004 | WO2004009871A1 Multilayer plated fuel line parts for automobile |
| 01/29/2004 | WO2004008825A2 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 01/29/2004 | US20040018726 Patterned thin film and method of forming same |
| 01/29/2004 | US20040018724 Plating method |
| 01/29/2004 | US20040018660 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 01/29/2004 | US20040018376 Multilayer coating; corrosion resistance |
| 01/29/2004 | US20040016646 Utilizing self assembly of surfactant-inorganic aggregates at solid-liquid interfaces wherein working electrode serves as a solid-liquid interface in a plating solution containing surfactant |
| 01/29/2004 | US20040016645 Providing the component; placing the component in an electrolyte solution; and applying a plurality of pulses to the solution and component, wherein pulses have a pattern comprised of differentmagnitude portions |
| 01/29/2004 | DE10229166A1 Verfahren zur Herstellung galvanisch abgeschiedener Antennen für RF-ID-Etiketten mittels selektiv eingebrachtem Kleber A process for producing electrodeposited antennas for RF-ID tags by means of selectively incorporated of adhesive |
| 01/29/2004 | DE10229001A1 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface |
| 01/29/2004 | DE10228323A1 Verfahren zum Elektroplattieren von metallischen und Metallmatrix-Komposit Folien, Beschichtungen und Mikrokomponenten Method for electroplating of metal and metal matrix composite films, coatings and micro components |
| 01/28/2004 | EP1383943A1 Method of plating and pretreating aluminium workpieces |
| 01/28/2004 | CN1470677A Plastic surface laser-carving and electroplating method |
| 01/28/2004 | CN1470676A Apparatus for removing fir-tree crystal of metal strip edge |
| 01/27/2004 | US6682642 Seed repair and electroplating bath |
| 01/22/2004 | WO2004007810A1 Electromagnetic wave shield material and process for producing the same |
| 01/22/2004 | US20040013793 High aspect ratio; photoresists |
| 01/22/2004 | US20040011658 Surface of a member is subjected to degreasing or oxide film removing treatment using pressurized carbon dioxide is dissolved in a predetermined quantity of water to prepare an oxide film removing solution having a predetermined acidity |
| 01/22/2004 | US20040011655 For performing plating on a long conductive substrate |
| 01/22/2004 | US20040011654 Performing the regular electrolysis in a range of current density of 1 to 2 A/dm2 |
| 01/22/2004 | US20040011432 Metal alloy electrodeposited microstructures |
| 01/22/2004 | DE10326337A1 Vorrichtung zum Entfernen von Dendriten an den Kanten eines Metall-Bandes An apparatus for removing dendrites at the edges of a metal band |
| 01/21/2004 | EP1382065A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 01/21/2004 | EP1381474A1 Internal heat spreader plating methods and devices |
| 01/21/2004 | CN1469460A Thin film bearing belt for assembling electronic parts |
| 01/21/2004 | CN1468982A Gold-plating apparatus and gold-plating method |
| 01/20/2004 | US6680092 Coating method and products obtained by same |
| 01/20/2004 | US6679983 Bath, source of metal ions, an electrolyte comprising two or more acids and optional additive(s); fill of small features with less overplate; copper electroplating |
| 01/15/2004 | WO2004005579A1 Precoat metal plate excellent in press workability and method for production thereof |
| 01/15/2004 | WO2003090257A3 Method for the production of thin metal-containing layers having low electrical resistance |
| 01/15/2004 | WO2003033779B1 Coating method for light metal alloys |
| 01/15/2004 | WO2002047139A3 Methode of forming a copper film on a substrate |
| 01/15/2004 | US20040009659 Method of forming copper wiring in a semiconductor device |
| 01/15/2004 | US20040007611 Asymmetric plating |
| 01/15/2004 | US20040007478 Electroetching system and process |
| 01/15/2004 | US20040007471 Method of locally plating a part |
| 01/15/2004 | US20040007467 A vessel surface is shaped to provide a uniform current density at a microfeature semiconductor workpiece; electrodeposition, electroplating |
| 01/15/2004 | US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same |
| 01/15/2004 | DE10228998A1 Vorrichtung und Verfahren zum elektrochemischen behandeln eines Substrats bei reduzierter Metallkorrosion An apparatus and method for electrochemically treating a substrate with reduced metal corrosion |
| 01/14/2004 | EP1379357A2 Method and apparatus for avoiding particle accumulation during an electrochemical mechanical process |
| 01/14/2004 | EP1141443B1 A method of metallizing the surface of a solid polymer substrate and the product obtained |
| 01/14/2004 | CN2599018Y Improved continuous terminal electroplating |
| 01/14/2004 | CN2599017Y Improved continuous terminal electroplating device |
| 01/14/2004 | CN1468327A Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/14/2004 | CN1467512A Process for preparation of optical element, electrolytic solution used for the same and apparatus for preparation of optical element |
| 01/14/2004 | CN1134557C Zinc plated steel plate and its producing method |
| 01/13/2004 | US6677057 Zinc(zn)-cobalt(co)-tungsten(w); tungsten plating is carried out with metallic tungsten; nonsludging electrolyte comprising zinc chloride, cobalt chloride, tungsten, citric acid, polyoxyethylene glycol, and an electroconductive aid |
| 01/13/2004 | US6677056 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 01/13/2004 | US6677055 Preventing the formation of whiskers and recess cavities on lead surfaces |
| 01/13/2004 | US6676822 Method for electro chemical mechanical deposition |
| 01/13/2004 | US6675472 Preventing burrs wherein the copper plating is performed prior to making the routing of one or more slots by a thin plating; improved castellation via process |
| 01/08/2004 | WO2004004418A1 Metal based resistance heating element and method for preparation thereof |
| 01/08/2004 | WO2004003935A2 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps |
| 01/08/2004 | WO2004003663A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 01/08/2004 | WO2004003258A2 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied |
| 01/08/2004 | US20040005499 Surface-treated steel plate for battery case and battery case |
| 01/08/2004 | US20040004004 Method for reducing cu surface defects following cu ECP |
| 01/08/2004 | US20040004002 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures |
| 01/08/2004 | US20040003894 Method and apparatus for electro-chemical processing |
| 01/07/2004 | EP1377696A1 Back-end metallisation process |
| 01/07/2004 | EP1377441A2 Coated article having a stainless steel color |
| 01/07/2004 | CN1466517A Copper foil for high-density ultrafine wiring board |
| 01/06/2004 | US6673470 Surface treated tin-plated steel sheet and surface treatment solution |
| 01/06/2004 | US6673227 Seeding; solvent selective removal |
| 01/02/2004 | EP1375334A1 A plated component with a hybrid surface and method for manufacturing same |
| 01/01/2004 | US20040001914 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 01/01/2004 | US20040000492 Metallic substrate overcoated with solid sulfide lubricant |