| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 04/29/2004 | US20040080053 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 04/29/2004 | US20040079646 Pretreatment; removal bubbles adsorbed on substrate; rotation, immersion in plating solution |
| 04/29/2004 | US20040079645 Method for manufacturing personal digital assistant |
| 04/29/2004 | US20040079644 Uniform thickness; applying electricity |
| 04/29/2004 | US20040079643 Immersion substrate with apertures in electroplating solution; conductors |
| 04/29/2004 | US20040078968 Printed circuit board manufacturing method |
| 04/29/2004 | DE10248279A1 Power supply, for an electroplating assembly, has a pulse generator which can have large integrated capacities at the semiconductor power switches to generate a pulsed current with rectangular pulses |
| 04/29/2004 | CA2503159A1 Metal resin composite and process for producing the same |
| 04/28/2004 | EP1051544B1 Process chamber and method for depositing and/or removing material on a substrate |
| 04/28/2004 | CN1492946A Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker |
| 04/28/2004 | CN1492944A Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 04/28/2004 | CN1148092C 同轴连接器 Coaxial Connectors |
| 04/27/2004 | US6727680 Extended range power supply system |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6726823 Assembly for holding wafer comprising wafer chuck having bottom section and spring member configured to apply electric charge to wafer disposed between bottom section and wafer, and actuator assembly configured to move wafer chuck |
| 04/22/2004 | WO2004034421A2 Method for electric field assisted deposition of films of nanoparticles |
| 04/22/2004 | WO2004033762A1 Method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys |
| 04/22/2004 | WO2002059398A3 Plating apparatus and method |
| 04/22/2004 | US20040076876 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can |
| 04/22/2004 | US20040074776 Method and device for the electrolytic coating of a metal strip |
| 04/22/2004 | US20040074775 Acid copper solutions is used for applying copper to decorative articles, such as aluminium alloy automotive wheels and plastic parts for automotive use. The benefits include an improved thickness distribution of the copper |
| 04/21/2004 | EP1410430A2 Planar metal electroprocessing |
| 04/21/2004 | EP1409772A2 Method for selectively electroplating a strip-shaped, metal support material |
| 04/21/2004 | CN2613125Y 板件冷却装置 Plate cooling device |
| 04/21/2004 | CN1490434A Method for micro-arc depositing ceramic layer onto positive and negative bipolarities on magnesium alloy |
| 04/21/2004 | CN1146484C Structure and method for jointing metal members |
| 04/20/2004 | US6724571 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
| 04/20/2004 | US6723219 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith |
| 04/20/2004 | US6723177 Life extension of chromium coating and chromium alloys |
| 04/15/2004 | WO2004031454A2 Cathode design for use in electrodeposition cell |
| 04/15/2004 | WO2004031447A1 Method of electroless plating |
| 04/15/2004 | WO2004008825A3 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072419 Method for applying metal features onto barrier layers using electrochemical deposition |
| 04/15/2004 | US20040072012 Lead-free |
| 04/15/2004 | US20040071880 Method of plating on surface of plastic post to printing |
| 04/15/2004 | US20040070873 Self-aligned void filling for mushroomed plating |
| 04/15/2004 | US20040069651 Oxide treatment and pressure control for electrodeposition |
| 04/15/2004 | US20040069650 Coating with a resin containing dispersed metal powder; electroless deposition from solution containing ions of a second metal having an ionization potential nobler than that of first metal; electroplating film of third metal |
| 04/15/2004 | US20040069648 Method for electroplating on resistive substrates |
| 04/15/2004 | US20040069644 Spin, rinse and dry process performed on the wafer prior to electroplating either in a standalone tool or in a preclean module integrated into an electroplating tool; for semiconductors |
| 04/15/2004 | US20040069643 Plating a nonferrous object; removing plate irregularities and smoothing the surface by moving dry abrasive media over the plated object; and chrome plating |
| 04/15/2004 | US20040069319 Method and apparatus for cleaning a substrate using megasonic power |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | DE10246695A1 Manufacture of display zone e.g. of illuminated transparent plastic touch key uses galvanizable plastic base layer to which non-galvanizable and galvanic layers are applied |
| 04/15/2004 | DE10246467A1 Deposition of alloys by electroplating, varies conditions under computer control to achieve homogenous deposit or deposit exhibiting concentration gradient in its thickness |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1408197A1 Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 04/14/2004 | EP1407810A1 VIBRATINGLY STIRRING APPARATUS, AND DEVICE AND METHOD FOR PROCESSING USING THE STIRRING APPARATUS |
| 04/14/2004 | EP1407062A1 Composite foil and its manufacturing process |
| 04/14/2004 | EP1406739A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 04/14/2004 | CN1489505A 硬钎焊产品 Brazing Products |
| 04/14/2004 | CN1488783A Rare earth chromium composite electroplating layer and preparing method and use thereof |
| 04/14/2004 | CN1145718C Producing technology for copper-clad panel |
| 04/08/2004 | WO2004029327A1 Method for pretreating a surface of a non-conducting material to be plated |
| 04/08/2004 | WO2004001178A3 Method and apparatus for downhole pipe or casing repair |
| 04/08/2004 | WO2003044248A8 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 04/08/2004 | WO2002072923A3 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 04/08/2004 | US20040068323 Implant and process of modifying an implant surface |
| 04/08/2004 | US20040067314 Aqueous alkaline zincate solutions and methods |
| 04/08/2004 | US20040065558 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 04/08/2004 | US20040065556 Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle |
| 04/08/2004 | US20040065555 Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate |
| 04/08/2004 | US20040065554 Multilayer three-dimensional structure; barrier layer prevent damage due to copper diffusion |
| 04/08/2004 | US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues |
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | US20040065551 Multilayer three-dimensional structures; using copper pyrophosphate; low temperature plating baths |
| 04/08/2004 | US20040065550 Electrochemical fabrication methods with enhanced post deposition processing |
| 04/08/2004 | US20040065549 Cleaning apparatus for ECMD anode pad |
| 04/08/2004 | US20040065225 Electrodeposition; using gold sulfite complex; dental molding |
| 04/07/2004 | EP1405934A2 Zinc-diffused alloy coating for corrosion/heat protection |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1404899A1 Method and electrode for defining and replicating structures in conducting materials |
| 04/07/2004 | EP1404460A1 Masking article for use in vehicle manufacturing |
| 04/07/2004 | CN1487543A Sol-gel enclosed treatment process for electronic element and device |
| 04/07/2004 | CN1487123A Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation |
| 04/07/2004 | CN1144901C Zinc oxide thin film, and process for producing substrate and photoelectric converter using the same film |
| 04/06/2004 | US6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 04/06/2004 | US6716606 For use in hematopoietic therapy; for arresting proliferation of leukemic cells |
| 04/06/2004 | US6716332 Plating method and apparatus |
| 04/01/2004 | WO2004027115A1 Method and solution for treating fluorocarbon surfaces |
| 04/01/2004 | WO2004027106A1 Method for coating motor vehicle rims |
| 04/01/2004 | WO2004003935A3 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps |
| 04/01/2004 | US20040062945 Index tunable thin film interference coatings |
| 04/01/2004 | US20040060825 Copper-plating liquid, plating method and plating apparatus |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060581 Vertical proximity processor |
| 04/01/2004 | US20040060580 Meniscus, vacuum, IPA vapor, drying manifold |
| 04/01/2004 | US20040060573 Proximity head for drying a substrate; and a cleaning system for cleaning wafers |
| 04/01/2004 | US20040060195 Methods and systems for processing a substrate using a dynamic Liquid meniscus |
| 03/31/2004 | EP1403469A2 Method for selective surface protection of a gas turbine blade |
| 03/31/2004 | EP1403402A1 Process for the electrolytic deposition of materials with aluminium, magnesium or alloys of aluminium and magnesium |
| 03/31/2004 | EP1403401A2 Precious alloyed metal solder plating process |
| 03/31/2004 | CN2608518Y Rotary electric brush paper machine net cage device |
| 03/31/2004 | CN1143906C Process for depositing layer of material on substrate |
| 03/30/2004 | US6712948 Etching plastic surface under mild conditions, treating with solution containing cobalt, silver, tin, and/or lead salts having ph from about 7.5 to about 12.5, treating with sulfide solution, metallizing |
| 03/25/2004 | WO2004025758A1 Metal foil for current collector of secondary battery and method for producing the same |
| 03/25/2004 | WO2003060959A3 Method for applying metal features onto barrier layers using electrochemical deposition |
| 03/25/2004 | US20040058189 Zinc-diffused alloy coating for corrosion/heat protection |