Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
03/2004
03/25/2004US20040058143 Resin composition, process for producing the same and electrophotographic fixing member
03/25/2004US20040058139 Seed layer treatment
03/25/2004US20040058088 Preparing a substrate of a polymer material; surface-modifying the substrate; forming a seed layer on the substrate; and forming the thick film on the seed layer
03/25/2004US20040055892 Deposition method for nanostructure materials
03/25/2004US20040055890 ProvideS a film having a highly uniform thickness by plating; electric current limiting member limits horizontal flow of an electric current in the plating liquid between second electrode and substrate within plating vessel during plating
03/25/2004US20040055889 Using ultraviolet light; joining semiconductor die to substrate; prevent short circuiting
03/25/2004US20040055888 Monitoring plating bath; quantitative, qualitative analysis
03/25/2004US20040055877 Workpiece processor having processing chamber with improved processing fluid flow
03/25/2004US20040055873 Apparatus and method for improved electroforming
03/25/2004US20040055503 Method and solution for treating fluorocarbon surfaces
03/25/2004DE10242555A1 Process for coating vehicle wheel rims made from light metal comprises providing the rim with a primer made from powder or wet lacquer, and coating the primer with a galvanizable layer by PVD or by thermal spraying on the primer
03/24/2004EP1400613A2 Tin plating method
03/24/2004EP1399385A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
03/24/2004CN1484714A Ni-plated steel plate for alkali-manganese dry cell anode can and alkali manganese dry cell anode can
03/24/2004CN1483857A Method for plating dense chromium
03/23/2004US6710259 Overcoating nonconductor with carbon; pretreating for electroplating; printed circuits
03/23/2004US6709719 Multilayer stacks of tin and zinc; applying laser radiation
03/23/2004US6709563 Copper-plating liquid, plating method and plating apparatus
03/23/2004CA2441718A1 Zinc-diffused alloy coating for corrosion/heat protection
03/18/2004WO2004022815A1 Plated polyester resin article and method for production thereof
03/18/2004US20040053077 Magnetic film and thin film magnetic head using this magnetic film
03/18/2004US20040051999 Soft magnetic film and thin film magnetic head using the same
03/18/2004US20040050711 Substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution
03/18/2004US20040050708 Capable of forming a plated layer on a circuit board without a power supply line for gold-plating at a pad
03/18/2004US20040050703 Metallization of polymer parts for painting
03/18/2004DE202004000597U1 Decorative metal material, e.g. for a fountain pen cap, has a black chrome layer which is plated to the metal surface and forms a bond between the substrate surface and the paint layer
03/18/2004DE19502988B4 Verfahren zur galvanischen Beschichtung von Polymeroberflächen A method for the electrolytic coating of polymer surfaces
03/18/2004DE10241137A1 Process for metallizing plastics comprises impinging the surface of the plastic with metal particles, covering the surface with microbes, metallizing without using an external current and reinforcing using a galvanizing method
03/17/2004EP1397530A2 Apparatus and methods for electrochemical processing of microelectronic workpieces
03/17/2004CN1482285A Method of copper galvanization on superbig cement surface
03/17/2004CN1482284A New process of topical galvanization
03/16/2004US6707612 Radiating with light region of photo-semiconductor thin film to apply voltage between counterelectrode; precipitation
03/16/2004US6706166 Method for improving an electrodeposition process through use of a multi-electrode assembly
03/11/2004WO2004020697A1 Method of producing jewelry
03/11/2004WO2004020696A2 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam
03/11/2004US20040048003 Method for coating a substrate having holes
03/11/2004US20040047899 Member excellent in antibacterial and/or antialgae effects and process for producing the same
03/11/2004US20040045837 Method for treating the surface of object and apparatus thereof
03/11/2004US20040045831 Apparatus for electro-chemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode. The apparatus further includes a process kit disposed
03/11/2004US20040045813 Wafer processing apparatus, wafer stage, and wafer processing method
03/11/2004US20040045578 Selective preparation (cleaning and modification) of a critical substrate surface prior to, during, or following manufacturing and assembly operations such as coating, bonding, patterning, sealing, dicing, cutting, drilling,
03/11/2004DE10238284A1 Verfahren zum Herstellen einer schaumförmigen Metallstruktur, Metallschaum sowie Anordnung aus einem Trägersubstrat und einem Metallschaum A method of manufacturing a foam-like metal structure, metal foam as well as arrangement of a supporting substrate and a metal foam
03/10/2004CN1481448A Plating method of metal film on surface of polymer
03/10/2004CN1480988A Filming method of substrate and filming appts.
03/10/2004CN1480564A Method for preparing rare earth alloy through sweeping electric potential sedimentation
03/10/2004CN1141420C Process for electroplating Cr onto surface of thin steel sheet
03/09/2004US6703145 Process for electrolytic coating of a substrate and product produced
03/04/2004WO2004018740A1 Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case
03/04/2004WO2004018739A1 Surface treated steel plate for battery cases and battery case using same
03/04/2004WO2003090257B1 Method for the production of thin metal-containing layers having low electrical resistance
03/04/2004US20040040859 Electrodeposition of chromium; pretreatment with silver, or alloy thereof; corrosion resistance finish
03/04/2004US20040040856 Method for making plastic packages
03/03/2004EP1392889A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
03/03/2004CN1479391A Surface treatment steel plate for battery case, battery case and battery using the case
03/03/2004CN1478926A Titanium base material platinum coating method
03/02/2004US6699590 Hot-dip galvanized steel sheet
03/02/2004US6699397 Method of producing transfer stickers with metal powder and transfer stickers produced by the method
03/02/2004US6699396 Methods for electroplating large copper interconnects
03/02/2004US6699379 Method for reducing stress in nickel-based alloy plating
03/02/2004US6699373 Apparatus for processing the surface of a microelectronic workpiece
02/2004
02/26/2004US20040038148 Positive type radiation-sensitive resin composition for producing product formed by plating and process for producing product formed by plating
02/26/2004US20040038070 Fluxless brazing
02/26/2004US20040038049 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits
02/26/2004US20040035911 Fluxless brazing
02/26/2004US20040035910 Low temperature fluxless brazing
02/26/2004US20040035713 Method of producing transfer stickers with metal powder and transfer stickers produced by the method
02/26/2004US20040035712 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution
02/26/2004US20040035711 Method of manufacturing printed circuit board and multi-layered PCB
02/26/2004US20040035707 For plating copper onto semiconductor wafer; methods apply to patterned metal layers plated onto seed layer partially protected by overlying photoresist; sealing performed by engaging seal against photoresist to prevent corrosion
02/26/2004US20040035706 Method for manufacturing probes of a probe card
02/26/2004US20040035695 Flow diffuser to be used in electro-chemical plating system
02/26/2004US20040035694 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
02/26/2004DE10257737B3 Electrolytic magnesium deposition on a substrate made from sheet metal with a zinc (alloy) coating, used in the automobile industry, using a solvent for the deposition and heat treating the coated substrate
02/26/2004DE10240605A1 Coating thermoplastic foam mouldings with metallic layers, comprises controlling the thermal capacity of the particles or droplets that are used for coating
02/26/2004DE10237480A1 Process for coating a thermo-bimetal with a coating material comprises degreasing the surface of the bimetal to be coated, pickling the degreased surface, and depositing the coating material
02/25/2004EP1392092A1 COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET
02/25/2004EP1391540A2 Methods and apparatus for improved current density and feature fill control in ECD reactors
02/25/2004EP1391539A2 Coated steel sheet provided with electrodeposition painting having superior appearance
02/25/2004EP1390568A2 Direct electrolytic metallization of non-conducting substrates
02/25/2004EP1390567A1 Method, apparatus and system for electro-deposition of a plurality of thin layers on a substrate
02/25/2004CN2604765Y Full-automatic oxygen-free copper-wire surface silver plating apparatus
02/24/2004US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate
02/24/2004US6695587 Gas turbine airfoil protected by aluminide and platinum aluminide coatings, and its preparation
02/19/2004US20040033904 Electrodepositing the metal layer on a biaxially textured metal substrate such that the surface of the metal layer has the same texture as that of the substrate.
02/19/2004US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
02/19/2004US20040031691 Process for the electrodeposition of low stress nickel-manganese alloys
02/18/2004CN1476492A Method of copper-plating small-diameter holes
02/17/2004US6692630 Electroplated aluminum parts and process for production
02/17/2004US6692588 Rinsing with mineral acids and deionized water; plated semiconductors
02/17/2004US6691912 Methods of avoiding blowhole formation by conditioning through holes and glass
02/17/2004CA2290761C Coated article
02/12/2004WO2003056072A3 Method for fixing by electrodeposition reagents on a substrate planar surface
02/12/2004WO2003053621A3 Wire for high-speed electrical discharge machining
02/12/2004US20040027715 Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process
02/12/2004US20040026259 Plating crushable zinc alloy; alkaline pH
02/12/2004US20040026254 Covering dielectric with electroconductive polymer active material; laser ablation
02/12/2004US20040025639 Reduction of metal compound; mixing with cationic polymer; corrosion, oxidation and chemical resistance; stretching to allow penetration of metal particles
02/12/2004DE20317535U1 Two color rust-resistant barrier layer for tool heads has a surface with a strip of a surrounding recess which is galvanized or colored
02/11/2004EP1388186A1 Electrically conductive patterns, antennas and methods of manufacture
02/11/2004CN1473964A Anti-corrosion process for pure iron