| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 06/09/2004 | CN1502724A Method for working rotary axle holder |
| 06/09/2004 | CN1152983C Device for segregating metal from electrolytic solution containing metal |
| 06/09/2004 | CN1152982C Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof |
| 06/08/2004 | US6746591 ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
| 06/08/2004 | US6746590 Ultrasonically-enhanced electroplating apparatus and methods |
| 06/08/2004 | US6746589 Plating method and plating apparatus |
| 06/08/2004 | US6746578 Selective shield/material flow mechanism |
| 06/06/2004 | CA2448969A1 Electroplating anode assembly |
| 06/03/2004 | WO2004046426A1 Integrated plating and planarization process and apparatus therefor |
| 06/03/2004 | WO2004046419A1 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin |
| 06/03/2004 | US20040105959 Edge sharpener |
| 06/03/2004 | US20040104111 Micro lens molding piece, micro lens molding piece producing method, micro lens stamper, micro lens stamper producing method, micro lens mold member, plastic lens array sheet, and projector |
| 06/03/2004 | US20040103921 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 06/02/2004 | EP1424407A1 Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer |
| 06/02/2004 | CN1501989A Improvements relating to metal finishes |
| 06/02/2004 | CN1500916A Gradient composite deposite for continuous casting crystallizer copper plate and production method thereof |
| 06/02/2004 | CN1152444C Indium plating method for copper nail as negative pole current collector of mercury-free alkali Zn-Mn battery |
| 06/01/2004 | US6743719 Method for forming a conductive copper structure |
| 06/01/2004 | US6743532 Multi-layer coating, nickel basecoat layer, and a layers of carbon- rich refractory metal or refractory metal alloy carbonitride alternating with layers of nitrogen-rich refractory metal or refractory metal alloy carbonitride. |
| 06/01/2004 | US6743501 Porous structures having a pre-metallization conductive polymer coating and method of manufacture |
| 05/27/2004 | WO2004044273A1 Electropolishing system and process |
| 05/27/2004 | US20040101708 Coated article |
| 05/27/2004 | US20040099533 Microelectronics; positioning contactors; concentric anodes; nozzles; electroplating |
| 05/27/2004 | DE10253180A1 Process for metallizing plastics used in the production of sanitary products, e.g. shower heads, comprises using a plastic and particles located together within a moving container |
| 05/27/2004 | DE10130333B4 Galvanische Vorrichtung zur Abscheidung von Edelmetall Electroplating apparatus for separating noble metal |
| 05/26/2004 | EP1301655B1 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 05/26/2004 | EP1228267B1 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 05/26/2004 | EP0859877B1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
| 05/26/2004 | CN1500296A Electrically conductive patterns, antennas and methods of manufacture |
| 05/26/2004 | CN1500157A Method for forming electroplated coating on surface of article |
| 05/26/2004 | CN1498749A Super-thin copper foil with carrier, its mfg. method and printed wiring base plate |
| 05/26/2004 | CN1151317C Electrochemical nano method for treating surface of polycrystal golf film |
| 05/26/2004 | CN1151315C Article having coating |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740221 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 05/25/2004 | US6740220 Electrocatalytic cathode device of palladium and iridium on a high density or porous carbon support and a method for making such a cathode |
| 05/21/2004 | WO2004042790A2 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 05/21/2004 | WO2004042344A2 Fabrication of a high resolution biological molecule detection device with gold electrical conductors |
| 05/21/2004 | WO2002050342A3 Composite plating film and a process for forming the same |
| 05/20/2004 | US20040097070 Method of producing metal film |
| 05/20/2004 | US20040096584 Process for metallizing a plastic surface |
| 05/20/2004 | US20040094511 Method of forming planar Cu interconnects without chemical mechanical polishing |
| 05/20/2004 | US20040094427 Includes a table with a polishing pad; the table and pad have holes forming channels for dispensing electroplating solution; plurality of electroplating anodes disposed in the channels and in contact with the electroplating solution |
| 05/20/2004 | US20040094424 Graphite metal coating |
| 05/20/2004 | US20040094423 Hinge holder treated by this process has an attractive, hard surface which is not easily scratched |
| 05/20/2004 | US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 05/19/2004 | EP1420621A1 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
| 05/19/2004 | EP1420084A1 MEMBER EXCELLENT IN ANTIBACTERIAL AND/OR ANTIALGAE EFFECTS AND PROCESS FOR PRODUCING THE SAME |
| 05/19/2004 | EP1420082A1 Electroconductive structure and electroplating method using the structure |
| 05/19/2004 | EP1419523A1 Dummy structures to reduce metal recess in electropolishing process |
| 05/19/2004 | EP1419289A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 05/19/2004 | EP1341951B1 Copper bath and method of depositing a matt copper coating |
| 05/19/2004 | CN1498289A Method of plating and pretreating aluminium workpieces |
| 05/19/2004 | CN1498288A ELectroplated aluminium parts and process of production thereof |
| 05/19/2004 | CN1497065A Anti-corrosion heat-resistant zine diffusion alloy claddiy material |
| 05/19/2004 | CN1150353C Method for forming zinc-oxide film and method of preparing semiconductor element matrix and photoelectric elements |
| 05/18/2004 | US6736953 High frequency electrochemical deposition |
| 05/18/2004 | US6736945 Wafer plating apparatus |
| 05/18/2004 | US6736204 Heat transfer surface with a microstructure of projections galvanized onto it |
| 05/13/2004 | US20040091385 Wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating |
| 05/13/2004 | US20040090380 Electrically conductive patterns, antennas and methods of manufacture |
| 05/13/2004 | US20040089555 Continuous metal plating and supplemental processing in one housing; substrate stage between cassette stage and pre-treatment unit; cleaning with pure water; drying |
| 05/13/2004 | US20040089554 Apparatus and method for electroplating a metallic film on a rocket engine combustion chamber component |
| 05/13/2004 | US20040089260 Cylinder for internal combustion engine and method of treating inner surface of the cylinder |
| 05/13/2004 | DE10228998B4 Vorrichtung und Verfahren zum elektrochemischen Behandeln eines Substrats bei reduzierter Metallkorrosion An apparatus and method for electrochemically treating a substrate with reduced metal corrosion |
| 05/13/2004 | DE10153544B4 Vorrichtung zur Steuerung des Durchflusses in einem Galvanisierungsprozeß Apparatus for controlling the flow in a galvanizing |
| 05/13/2004 | DE10103445B4 Stahlwerkstoff mit hoher Ermüdungsfestigkeit sowie Verfahren zur Herstellung des Stahlmaterials Steel material having high fatigue resistance as well as methods for producing the steel material |
| 05/12/2004 | EP1418254A2 Process and apparatus for the preparation of materials to be subjected to finishing treatments |
| 05/12/2004 | EP1417706A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495296A Electroplating method and device for wire stock, and electroplate wire stock |
| 05/12/2004 | CN1495291A Coated steel plate having electro-deposited coated paint with good appearance |
| 05/12/2004 | CN1149813C Honeycomb telephone shell |
| 05/06/2004 | WO2004039137A1 Plasma display panel-use copper foil and production method therefor |
| 05/06/2004 | WO2004038070A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 05/06/2004 | WO2004038065A1 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
| 05/06/2004 | WO2004009877A3 Electrolytic reactor |
| 05/06/2004 | US20040086739 Film carrier tape for mounting electronic part |
| 05/06/2004 | US20040084321 Electroconductive carbon is coated on nonconductor surface; conditioning; dispersion of graphite and binder is applied to conditioned surface; fixing; low electrical resistance; removable from copper by microetching |
| 05/06/2004 | US20040084320 Electroplating silicon wafer; free of seeding or chemical mechanical polishing; integrated circuits |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | US20040084318 Electrofilling; immersing substrate in wetting solution; applying ultrasonic or megasonic vibrations; applying high pressure electrolyte jets of metal or alloy; electroplating |
| 05/06/2004 | US20040084316 Voltage applied between cathode electrode in contact with edge of substrate and vertically moveable anode; copper films of uniform thickness |
| 05/06/2004 | US20040084315 Plating apparatus and plating method |
| 05/06/2004 | US20040084301 Electro-chemical deposition system |
| 05/06/2004 | EP1415365A1 Polymer electrolyte membrane for electrochemical and other applications |
| 05/06/2004 | EP1415021A1 Copper on invar composite and method of making |
| 05/05/2004 | CN1494606A Bath for galvanic deposition of gold and gold alloys, and use thereof |
| 05/05/2004 | CN1494462A Internal heat spreader plating methods and devices |
| 05/05/2004 | CN1494369A Electroplating method of printed circuit board |
| 05/05/2004 | CN1148471C Electroplating machine |
| 05/05/2004 | CN1148470C Method for plating insulating base material and plated attacher produced thereby |
| 05/05/2004 | CN1148469C Vulcanized elastic material product, article and its reinforcing structure |
| 05/05/2004 | CN1148465C Method for preparing composite conductive material |
| 05/05/2004 | CN1148463C Roll forming structure steel profiles with galvanised coating |
| 05/04/2004 | US6730208 Biological or chemical sensors; dna chips |
| 05/04/2004 | CA2222759C Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof |
| 04/29/2004 | WO2004035860A1 Metal resin composite and process for producing the same |