| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 07/14/2004 | CN1157499C Article with coated layer |
| 07/13/2004 | US6762011 Small-scale structure; more particularly, a narrow pole tip in the write portion of a magnetic read/write head. |
| 07/13/2004 | US6761814 Superior filling properties and superior planarization of the deposited metal layer is provided. this is achieved by a method having a f/r ratio, the ratio of the electric current densities between the forward electrolysis and the reverse |
| 07/08/2004 | WO2004057067A1 Method for removing at least one surface area of a component |
| 07/08/2004 | WO2004057066A1 Method for removing at least one surface area of at least two components |
| 07/08/2004 | WO2004057063A1 Method for improving the interaction between electrolyte and component |
| 07/08/2004 | WO2004057062A2 Method and device for filling material separations on a surface |
| 07/08/2004 | WO2002004712A3 Flow diffuser to be used in electro-chemical plating system |
| 07/08/2004 | US20040132300 Procedure for activation of substrates for plastic galvanizing |
| 07/08/2004 | US20040132299 Method for depositing lead-free tin alloy |
| 07/08/2004 | US20040132285 Polymer film metalization |
| 07/08/2004 | US20040129576 improves the flatness of a plated film on a substrate even when fine grooves and large grooves are co-present in the surface of the substrate, enabling a later CMP processing to be carried out in a short time while preventing dishing |
| 07/08/2004 | US20040129573 cells of the mask comprise independently controllable electrodes; pattern of dielectric material extends beyond the electrodes for contacting the substrate and for forming electrochemical process pockets when contacted ; deposition selectivity |
| 07/08/2004 | US20040129572 low-resistance; improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) |
| 07/08/2004 | US20040129571 Method for manufacturing metal-coated optical fiber |
| 07/08/2004 | US20040129384 Chemical treatment apparatus and chemical treatment method |
| 07/08/2004 | DE10260863A1 Closed reactor for surface electroplating, especially chromium plating of a workpiece, includes a reactor housing and a reactor space containing the workpiece |
| 07/08/2004 | DE10259367A1 Verfahren zur Verbesserung der Wechselwirkung zwischen einem Medium und einem Bauteil A method of improving the interaction between a medium and a component |
| 07/08/2004 | DE10259363A1 Verfahren zum Entfernen von zumindest einem Oberflächenbereich eines Bauteils A method for removing at least a surface region of a component |
| 07/08/2004 | DE10259362A1 Verfahren zum Abscheiden einer Legierung auf ein Substrat A method for depositing an alloy on a substrate |
| 07/08/2004 | DE10259361A1 Verfahren und Vorrichtung zum Auffüllen von Materialtrennungen an einer Oberfläche Method and device for filling material separations on a surface |
| 07/08/2004 | DE10259360A1 Verfahren zur Verbesserung der Wechselwirkung zwischen einer Flüssigkeit und einem Bauteil A method of improving the interaction between a liquid and a component |
| 07/07/2004 | EP1435193A2 Nickel coated copper as electrodes for embedded passive devices |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/07/2004 | CN1510450A Manufacturing method for fibre-optical with metal coating |
| 07/07/2004 | CN1510174A Method for depositing non-lead tin alloy |
| 07/07/2004 | CN1156613C Process of controlling grain growth in metal films |
| 07/06/2004 | US6759142 Plated copper alloy material and process for production thereof |
| 07/06/2004 | US6758958 System and a method for plating of a conductive pattern |
| 07/06/2004 | US6758387 Electroplating difficult to solder material with easier to solder one; hot dipping; applying ultrasonic waves; adhesion to plated portions |
| 07/01/2004 | WO2004055247A1 Electro-plating apparatus and method |
| 07/01/2004 | WO2004055245A2 Method for the deposition of an alloy on a substrate |
| 07/01/2004 | WO2004054750A1 Brazing sheet product having a clad layer and a coated layer of iron alloy and method of its manufacture |
| 07/01/2004 | WO2004054699A2 Method for improving the interaction between a medium and a structural component |
| 07/01/2004 | WO2004038070A3 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 07/01/2004 | WO2004034421A3 Method for electric field assisted deposition of films of nanoparticles |
| 07/01/2004 | US20040126649 Simple procedure for growing highly-ordered nanofibers by self-catalytic growth |
| 07/01/2004 | US20040124090 Wafer electroplating apparatus and method |
| 07/01/2004 | US20040124089 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 07/01/2004 | DE10259187A1 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung A process for the activation of substrates for plating on plastics |
| 06/30/2004 | EP1433544A1 A method for manufacturing a multiple walled tube |
| 06/30/2004 | EP1432851A1 Method for the coating of electrically conducting support materials |
| 06/30/2004 | EP1278899B1 Method and device for the electrolytic coating of a metal strip |
| 06/30/2004 | EP1070325B1 Device for activating conductivity in porous structures |
| 06/30/2004 | CN1508289A Photo permeable character electroplated button preparing process |
| 06/30/2004 | CN1508287A Method for activating substrate for plating on plastic |
| 06/30/2004 | CN1508285A Metal-film formation processing method, semiconductor device and wiring substrate board |
| 06/29/2004 | US6756134 Into nickel metal or alloy electrodeposited layer; gas turbine engines |
| 06/29/2004 | US6755958 For a copper alloy surface; electroplated barrier layer consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, or rhodium. |
| 06/29/2004 | US6755957 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 06/29/2004 | US6755956 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 06/29/2004 | US6755955 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 06/24/2004 | WO2004053203A2 Method for the electrolytic deposition of magnesium or magnesium-zinc on galvanised sheet metal |
| 06/24/2004 | WO2002092872A3 Honeycomb structure thermal barrier coating |
| 06/24/2004 | US20040121178 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
| 06/24/2004 | US20040118699 Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| 06/24/2004 | US20040118698 electrodepositing and annealing a metallic composition within the pores of a mesoporous silica film to form a metal-containing silica nanocomposite; silica is dissolved to leave a self-supporting article |
| 06/24/2004 | US20040118697 Metal deposition process with pre-cleaning before electrochemical deposition |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118692 Plating-rinse-plating process for fabricating copper interconnects |
| 06/24/2004 | US20040118691 Electroplating method |
| 06/24/2004 | US20040118690 successive conditioning, Pd activation, electroless copper plating, and electrolytic copper plating treatments; irradiation with ultraviolet light in the presence of treatment solution; resin is activated to improve copper adhesion |
| 06/24/2004 | DE10257643A1 Fabrication of membrane-electrode assembly for fuel cell, by introducing ions of catalytic component into membrane and/or ionomer, applying electron conductor membrane, and electrochemically depositing ions on electron conductor |
| 06/24/2004 | DE10256832A1 Sicherheitsfolie und Verfahren zur Herstellung derselben Security film and method for manufacturing the same |
| 06/23/2004 | EP1432016A2 A plating-rinse-plating process for fabricating copper interconnects |
| 06/23/2004 | EP1430167A2 Plating apparatus and method |
| 06/23/2004 | EP1430166A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 06/23/2004 | CN1506502A Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/23/2004 | CN1155111C Method for producing solar cell precursor thin film and solar cell |
| 06/22/2004 | US6753251 Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| 06/22/2004 | CA2201448C Copper or copper alloy surface preparation process for continuous casting elements, comprising nickel plating and nickel removal |
| 06/22/2004 | CA2174637C A surface treated steel sheet for battery containers, a battery container, and a battery produced thereof |
| 06/17/2004 | WO2004050951A2 Security film and method for the production thereof |
| 06/17/2004 | WO2004050937A2 Method for coating piston rings for internal combustion engines |
| 06/17/2004 | WO2004050931A1 Cold rolled steel sheet for gasket material, method for production thereof and gasket material produced by the method |
| 06/17/2004 | US20040115932 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 06/17/2004 | US20040115468 Core sheet overcoated with aluminum alloy |
| 06/17/2004 | US20040112868 Etchant solution for removing a thin metallic layer |
| 06/17/2004 | US20040112755 Contacting surface with water soluble polymer ; oxidation with permanganate solutions; plating with copper |
| 06/17/2004 | US20040112754 Fuel cells; multilayer; polymer electroyte membranes; gas distribution layer; metallic catalyst |
| 06/17/2004 | US20040112634 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 06/17/2004 | US20040112476 Friction resistant; hardness; joint replacement; medical equipment |
| 06/17/2004 | DE10256063A1 Verfahren zum Beschichten von Kolbenringen für Verbrennungsmotoren A process for coating of piston rings for internal combustion engines |
| 06/16/2004 | EP1428982A1 A method of depositing a local MCrAIY-coating |
| 06/16/2004 | EP0954385B1 Fluid delivery apparatus and method |
| 06/16/2004 | CN1505461A A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| 06/16/2004 | CN1504584A Laser strengthening and toughening method for interface between ground-mass and coating |
| 06/16/2004 | CN1153597C Metal golf club head preparation method and its products |
| 06/15/2004 | US6750144 Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes |
| 06/15/2004 | US6749952 Tin-plated steel sheet |
| 06/10/2004 | WO2004048645A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 06/10/2004 | US20040108215 Electroplating anode assembly |
| 06/10/2004 | US20040108212 Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| 06/10/2004 | US20040108211 Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB) |
| 06/10/2004 | CA2506355A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 06/09/2004 | EP1426978A1 CONDUCTIVE PASTE AND CONDUCTIVE FILM USING IT, PLATING METHOD AND PRODUCTION METHOD FOR FINE METAL COMPONENT |
| 06/09/2004 | EP1425067A2 Radioactive implantable devices and methods and apparatuses for their production and use |
| 06/09/2004 | EP1070159A4 Electrodeposition of metals in small recesses using modulated electric fields |
| 06/09/2004 | CN1503345A Method of forming planar Cu interconnects without chemical mechanical polishing |
| 06/09/2004 | CN1502725A Wafer electroplating device and method |