| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 08/12/2004 | WO2004067804A2 Coating method |
| 08/12/2004 | WO2004067796A1 Pre-plating surface treatments for enhanced galvanic-corrosion resistance |
| 08/12/2004 | WO2004042790A3 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 08/12/2004 | US20040157128 Metal foil for current collector of secondary battery and method for producing the same |
| 08/12/2004 | US20040154930 Copper foil for high frequency circuit and method of production of same |
| 08/12/2004 | US20040154927 Internal heat spreader plating methods and devices |
| 08/12/2004 | US20040154926 Multiple chemistry electrochemical plating method |
| 08/12/2004 | US20040154925 Electrodeposition plating bath; smooth surfaces |
| 08/12/2004 | US20040154828 Method and electrode for defining and replicating structures in conducting materials |
| 08/12/2004 | DE10304533A1 Bead single-crystal with provision for electrical heating, ease of cleaning and electroplating applications, as supply wires |
| 08/12/2004 | DE10303835A1 Nordic gold alloy for mirror-finish coinage striking, used to produce collectors series, has surface coated with stamping enhancement agent |
| 08/12/2004 | CA2514265A1 Stencil manufacture |
| 08/12/2004 | CA2513691A1 Pre-plating surface treatments for enhanced galvanic-corrosion resistance |
| 08/11/2004 | EP1445353A1 Method and device for surface treatment of treated object |
| 08/11/2004 | EP1444386A1 Elemental silicon nanoparticle plating and method for the same |
| 08/11/2004 | EP1444385A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 08/11/2004 | CN1520340A Masking article for use in vehicle structure |
| 08/11/2004 | CN1520334A Vibratingly stirring appts., and device and method for processing using stirring appts. |
| 08/11/2004 | CN1161495C Coated article |
| 08/10/2004 | US6774021 Pattern forming method and pattern forming device |
| 08/10/2004 | US6773828 A lead frame, for example, made of a copper alloy may be plated with a layer of solder to facilitate soldering or wire bonding to the lead frame during an integrated circuit packaging process |
| 08/10/2004 | US6773827 Multilayer exterior electrodes |
| 08/10/2004 | US6773572 Overcoating porous resin; plating; semiconductor |
| 08/10/2004 | US6773570 An electroplating solution, an electroetching solution, and a nonabrasive slurry dispensed on a polishing pad and in a sequence of process steps the substrate is held against the pad with a variable force; chemical mechanical polishing |
| 08/10/2004 | US6773560 Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
| 08/10/2004 | US6773559 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 08/10/2004 | US6773217 Polymeric coating formulations and steel substrate composites |
| 08/05/2004 | WO2004065664A1 Plating device and plating method |
| 08/05/2004 | WO2004050937A3 Method for coating piston rings for internal combustion engines |
| 08/05/2004 | US20040152808 Resin composition for plating substrate and resin molding using the same, and metal plated parts |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/05/2004 | US20040149585 Electroplating copper bottom layer, depositing insulation pattern and forming permeable core; adding polyimide vias and insulation then filling; forming top metal lines staggered with bottom lines and topping with protective layer |
| 08/05/2004 | US20040149584 Completely embedding conductive interconnects in high aspect ratio recesses; covering narrow and broad trenches; flatness; rapid chemical mechanical polishing without dishing; growing film while controlling current density |
| 08/05/2004 | US20040149358 Method of manufacturing a chromed bumper |
| 08/04/2004 | EP1443063A1 New polymers and objects, mouldings or the like prepared therefrom, their preparation process and process for the preparation of metallized objects or the like therefrom |
| 08/04/2004 | EP1442161A1 Method of eliminating voids in w plugs |
| 08/04/2004 | EP1390568B1 Direct electrolytic metallization of non-conducting substrates |
| 08/04/2004 | EP1363683B1 Implant and process of modifying an implant surface |
| 08/04/2004 | EP1114209B1 Hard-chrome plated layer |
| 08/04/2004 | EP1064656B1 Thick complex porous structures made electrically conductive, and corresponding method for conductive activation |
| 08/04/2004 | EP0792462B1 Probe card assembly and method of using the same |
| 08/04/2004 | CN1160487C Process for plating flexible graphite products with thick silver layer |
| 08/04/2004 | CN1160163C Ultra-thin steel sheet and mfg. method therefor |
| 08/03/2004 | US6769160 Sn plating layer as the outermost layer of an outer electrode; avoid the formation of whiskers |
| 08/03/2004 | CA2327810C Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/29/2004 | WO2004063426A1 Metal plating coating film having sliding function and article coated therewith |
| 07/29/2004 | WO2004063405A2 Magnesium containing aluminum alloys and anodizing process |
| 07/29/2004 | US20040144654 Recording, detection; carbide is heat sensitive element |
| 07/29/2004 | DE10303650A1 Coating of objects such as plastic sprays comprises application of a layer of copper, nickel or a copper-nickel alloy, mechanical surface treatment of at least the outer applied layer and application of a palladium-nickel layer |
| 07/29/2004 | DE10303649A1 Coating of objects such as plastic sprays comprises application of a layer of copper, nickel or a copper-nickel alloy, mechanical surface treatment of at least the outer applied layer and application of a nickel-tungsten layer |
| 07/29/2004 | DE10303648A1 Surface coating of the metal surfaces of sanitary fittings, for protection against corrosion, uses an initial layer of copper/nickel which is brushed/sand blasted, for a further layer of nickel-tungsten or palladium-nickel |
| 07/29/2004 | DE10302107A1 Zylinderoberfläche Cylinder surface |
| 07/29/2004 | DE10301135A1 To coat a workpiece with a wear-resistant layer, without current or an electrolyte, the metal contains a proportion of non-metallic particles with the required hardness and low-friction non-stick characteristics |
| 07/29/2004 | DE10296936T5 Verfahren zur Herstellung von elektroleitfähigen Teilchen A process for producing electro-conductive particles |
| 07/28/2004 | EP1441390A2 A method for forming a conductive copper structure |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441157A1 Cylinder surface |
| 07/28/2004 | EP1441047A1 Method for forming electroplated coating on surface of article |
| 07/28/2004 | EP1441045A2 Process for activating a plastic substrate to be electroplated |
| 07/28/2004 | EP1440185A1 Platable engineered polyolefin alloys |
| 07/28/2004 | EP1439935A2 Electrochemical mechanical processing with advancible sweeper |
| 07/28/2004 | CN1516243A Crystalline grain in metal film growth control method |
| 07/28/2004 | CN1159756C Lead wire frame and its producing method |
| 07/27/2004 | US6767817 Asymmetric plating |
| 07/27/2004 | US6767437 Electroplating apparatus and electroplating method |
| 07/27/2004 | US6767392 Adhesion properties and high solderability |
| 07/27/2004 | US6766811 Method of removing smear from via holes |
| 07/22/2004 | WO2004061163A1 Metal-coated carbon surfaces for use in fuel cells |
| 07/22/2004 | WO2004061157A1 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same |
| 07/22/2004 | WO2003044248A9 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 07/22/2004 | US20040141299 Burrless castellation via process and product for plastic chip carrier |
| 07/22/2004 | US20040140219 Electroplating; electrical current is passed through solution and substrate to cause electroconductive material to deposit on substrate under electromotive force caused by electrical current; alloys on semiconductors |
| 07/22/2004 | US20040140203 Liquid isolation of contact rings |
| 07/22/2004 | DE10300476A1 Partial coating on a plastic component, is formed by exposing the area which is not to be coated to laser light, and roughening the surface |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439240A1 METHOD FOR PRESS WORKING, PLATED STEEL PRODUCT FOR USE THEREIN AND METHOD FOR PRODUCING THE STEEL PRODUCT |
| 07/21/2004 | EP1439018A1 Process for chrome plating a vehicle wheel surface |
| 07/21/2004 | EP1438446A2 System and method for electrolytic plating |
| 07/21/2004 | CN1514889A Copper plating solution and method for copper plating |
| 07/21/2004 | CN1158412C Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| 07/20/2004 | US6765757 Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
| 07/20/2004 | US6764626 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material |
| 07/20/2004 | US6764586 Method for electrochemically metallizing an insulating substrate |
| 07/20/2004 | US6764585 Electronic device manufacturing method |
| 07/20/2004 | CA2315177C Component of printed circuit boards |
| 07/15/2004 | WO2004059044A1 Spatially-selective deposition of polysaccharide layer onto patterned template |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | WO2004059041A1 Electrodeposition of biaxial textured films |
| 07/15/2004 | US20040137261 Electrodeposited nickel coatings comprising abrasion resistant particles, metal oxides, metal carbides or metal nitrides, and additives of Teflon/PTFE; wear resistance; uniform deposition by controlling current density, positioning |
| 07/15/2004 | US20040137162 Copper plating solution and method for copper plating |
| 07/15/2004 | US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits |
| 07/15/2004 | US20040134790 Endoprothesis with galvanised silver layer |
| 07/15/2004 | US20040134788 electrochemistry; etching; electroplating; photoresists |
| 07/15/2004 | US20040134774 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
| 07/15/2004 | US20040134682 Printed wiring board and its manufacturing method |
| 07/15/2004 | DE19512196B4 Kupferfolien für Basismaterial von gedruckten Schaltungen sowie Verfahren zur Oberflächenbehandlung der Kupferfolien Copper foil for the base material of printed circuits as well as method for surface treatment of the copper foils |
| 07/14/2004 | EP1437787A2 Process of manufacturing a membrane-electrode unit |
| 07/14/2004 | CN1513028A Resin composition for plating substrate and resin moldings using the same, and metal plated parts |
| 07/14/2004 | CN1511977A Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 07/14/2004 | CN1157502C Gold electroplatic method for flowers |