Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
---|
09/16/2004 | WO2003038158A3 Electroplating device and electroplating system for coating already conductive structures |
09/16/2004 | US20040180143 Paint ball gun having permanent lubricated surfaces |
09/16/2004 | US20040179309 magnetoresistance at room temperature; spintronics device; very fast film growth speed in the electrodepositing method, and a thickness of a Bi thin film can be controlled easily in the sputtering method |
09/16/2004 | US20040178078 Electroplated copper interconnection structure, process for making and electroplating bath |
09/16/2004 | US20040178077 providing a highly reliable copper interconnect structure suitable for wiring in integrated circuit chips with at least substantially, if not entirely, void-free seamless conductors |
09/16/2004 | US20040178060 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
09/16/2004 | US20040178058 Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film |
09/16/2004 | US20040177498 Electronic device and manufacturing same |
09/16/2004 | DE10206494B4 Vorrichtung zum Abdecken eines Werkstücks Device for covering a work piece |
09/15/2004 | EP1455981A2 Wire for high-speed electrical discharge machining |
09/15/2004 | EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
09/15/2004 | CN2640634Y Thermol soaking and dewaxing groove for hub |
09/15/2004 | CN1529772A Electrochemical co-deposition of metals for electronic device manufacture |
09/15/2004 | CN1529771A Composite foil and its manufacturing process |
09/15/2004 | CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte |
09/15/2004 | CN1529642A Continuous casting roll for casting molten baths and method for producing same |
09/15/2004 | CN1529545A Selective electroplating method |
09/15/2004 | CN1528953A Product coating method and its coating structure and glue-extruding gun pushrod |
09/15/2004 | CN1166820C Method for making metal-plastic compoiste article |
09/15/2004 | CN1166814C Process for manufacturing frame for color picture tubes |
09/15/2004 | CN1166459C Manufacture method of integral dies of metal spraying and brush plating |
09/14/2004 | US6790776 Barrier layer for electroplating processes |
09/14/2004 | US6790763 Substrate processing method |
09/14/2004 | US6790377 Method for electrochemical fabrication |
09/14/2004 | US6790334 Combined adhesion promotion and direct metallization process |
09/14/2004 | US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
09/14/2004 | US6790332 Ia/ic ratio is 1-1.5, and wherein a charge ratio qa/qc=taia/tcic of charge qa, transported during an anode pulse of duration ta, to a charge qc, transported during a cathode pulse of duration tc, is 30-45. |
09/14/2004 | US6790295 Carburizing slide surfaces of iron or steel, plating with chromium, and impulsing by shot peening for lubricant retaining cavities; wear resistance |
09/14/2004 | US6790265 Aqueous alkaline zincate solutions and methods |
09/14/2004 | CA2352929C Method of forming chromium coated copper for printed circuit boards |
09/14/2004 | CA2322363C Method of forming chromium coated copper for printed circuit boards |
09/14/2004 | CA2225825C Roll forming structural steel profiles with galvanised coating |
09/14/2004 | CA2167074C Method for metallising non-conductive substrates |
09/10/2004 | WO2004076724A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
09/10/2004 | WO2003083181A3 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process |
09/09/2004 | US20040174633 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
09/09/2004 | US20040173467 Immersing aluminum or aluminum alloy substrate in zincate solution comprising hydroxide, zinc, nickel, cobalt, iron, and/or copper ions; in presence of nitrogen and/or sulfur compound |
09/09/2004 | US20040173466 Titanium-containing metals with adherent coatings and methods for producing same |
09/09/2004 | US20040173465 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
09/09/2004 | US20040173461 Method and apparatus for local polishing control |
09/09/2004 | US20040173454 Apparatus and method for electro chemical plating using backsid electrical contacte |
09/09/2004 | US20040173375 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
09/08/2004 | EP1455005A2 Copper foil for high frequency circuit and method of producing of same |
09/08/2004 | CN1527892A Method for producing plated molded product |
09/08/2004 | CN1526856A Continuous nickel plating process for stainless steel wire |
09/07/2004 | US6787460 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed |
09/07/2004 | US6787248 Structure on a bi-color rust-proof barrier layer of a tool head |
09/03/2004 | CA2458078A1 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
09/03/2004 | CA2458076A1 Titanium-containing metals with adherent coatings and methods for producing same |
09/02/2004 | WO2004074554A1 Device and method for producing armoured layers on the cylinder bearing surfaces of internal combustion engines or similar |
09/02/2004 | WO2004074537A1 Surface-coating method |
09/02/2004 | WO2004055245A3 Method for the deposition of an alloy on a substrate |
09/02/2004 | US20040171269 Substrate processing method |
09/02/2004 | US20040170857 Having a blackened surface with a uniform hue and no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, and high in transmittancel; for a plasma display panel |
09/02/2004 | US20040170769 Tool and process for chrome plating a vehicle wheel surface |
09/02/2004 | US20040168927 Electroconductive structure and electroplating method using the structure |
09/02/2004 | US20040168926 Electrodeposition; supplying solution; rotating wafers |
09/02/2004 | CA2516053A1 Process for coating a surface |
09/01/2004 | EP1452628A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
09/01/2004 | EP1452627A2 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
09/01/2004 | EP1452107A1 Coin made from a CuAlZnSn alloy for a mirror polish stamping and process of manufacturing the same |
09/01/2004 | EP1451392A2 Pretreatment process for coating of aluminium materials |
09/01/2004 | CN1525544A Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
09/01/2004 | CN1525492A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
09/01/2004 | CN1164800C Device for electrolytically treating board-shaped workpieces, especially printed circuits |
08/31/2004 | US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating |
08/31/2004 | CA2145870C Process for treating plastic surfaces and swelling solution |
08/26/2004 | WO2004072330A2 Electro-plating method and apparatus |
08/26/2004 | US20040166360 Hot press forming method, and a plated steel material therefor and its manufacturing method |
08/26/2004 | US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed |
08/26/2004 | US20040163842 Flexible printed wiring board for chip-on-film |
08/26/2004 | US20040163740 Flash plate pretreatment; applying organic coating to ferrous-alloy aircraft and curing; corrosion resistance |
08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
08/25/2004 | EP1088117B1 Method for depositing a metallic layer on a polymer surface of a workpiece |
08/25/2004 | CN1524292A Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
08/25/2004 | CN1524136A Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
08/25/2004 | CN1523951A Chip-on-film use copper foil |
08/25/2004 | CN1523138A Process for making plastic surface by electroplating |
08/25/2004 | CN1163994C Base plate for electrode base of secondary cell, secondary cell electrode base, process for producing same and electrode and cell producing therefrom |
08/25/2004 | CN1163639C Anodic oxygenation method and operation apparatus thereof |
08/24/2004 | US6780303 Continuous nickel plating process for an aluminum conductor and corresponding device |
08/19/2004 | WO2003059531A3 Method for coating a substrate having holes |
08/19/2004 | US20040161627 a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns |
08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
08/19/2004 | US20040159552 coating the surface of a single crystal or directionally solidified article, especially on local areas of a gas turbine component; uniformity; good oxidation and fatigue resistance; may be used as a repair process |
08/19/2004 | US20040159550 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent |
08/18/2004 | EP1448035A1 Chip-on-film use copper foil |
08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
08/18/2004 | EP1447842A1 Bonding wire |
08/18/2004 | EP1446262A1 Improvements in fluxless brazing |
08/18/2004 | EP1446261A1 Product and method for low temperature fluxless brazing |
08/18/2004 | EP1446260A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
08/18/2004 | CN1522192A Method for producing and recycling operating material for enameling purposes |
08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
08/17/2004 | US6777831 Power supply device, for supplying a controlled electrical signal in an operations such as plating, etching, etc. |
08/17/2004 | US6777778 Thin-film resistor and method for manufacturing the same |
08/17/2004 | US6776891 Plating alloy using electrolytic cells |
08/17/2004 | US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
08/17/2004 | US6776827 Method and solution for treating fluorocarbon surfaces |
08/12/2004 | WO2004067806A1 Stencil manufacture |