Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
09/2004
09/16/2004WO2003038158A3 Electroplating device and electroplating system for coating already conductive structures
09/16/2004US20040180143 Paint ball gun having permanent lubricated surfaces
09/16/2004US20040179309 magnetoresistance at room temperature; spintronics device; very fast film growth speed in the electrodepositing method, and a thickness of a Bi thin film can be controlled easily in the sputtering method
09/16/2004US20040178078 Electroplated copper interconnection structure, process for making and electroplating bath
09/16/2004US20040178077 providing a highly reliable copper interconnect structure suitable for wiring in integrated circuit chips with at least substantially, if not entirely, void-free seamless conductors
09/16/2004US20040178060 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
09/16/2004US20040178058 Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film
09/16/2004US20040177498 Electronic device and manufacturing same
09/16/2004DE10206494B4 Vorrichtung zum Abdecken eines Werkstücks Device for covering a work piece
09/15/2004EP1455981A2 Wire for high-speed electrical discharge machining
09/15/2004EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
09/15/2004CN2640634Y Thermol soaking and dewaxing groove for hub
09/15/2004CN1529772A Electrochemical co-deposition of metals for electronic device manufacture
09/15/2004CN1529771A Composite foil and its manufacturing process
09/15/2004CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte
09/15/2004CN1529642A Continuous casting roll for casting molten baths and method for producing same
09/15/2004CN1529545A Selective electroplating method
09/15/2004CN1528953A Product coating method and its coating structure and glue-extruding gun pushrod
09/15/2004CN1166820C Method for making metal-plastic compoiste article
09/15/2004CN1166814C Process for manufacturing frame for color picture tubes
09/15/2004CN1166459C Manufacture method of integral dies of metal spraying and brush plating
09/14/2004US6790776 Barrier layer for electroplating processes
09/14/2004US6790763 Substrate processing method
09/14/2004US6790377 Method for electrochemical fabrication
09/14/2004US6790334 Combined adhesion promotion and direct metallization process
09/14/2004US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver
09/14/2004US6790332 Ia/ic ratio is 1-1.5, and wherein a charge ratio qa/qc=taia/tcic of charge qa, transported during an anode pulse of duration ta, to a charge qc, transported during a cathode pulse of duration tc, is 30-45.
09/14/2004US6790295 Carburizing slide surfaces of iron or steel, plating with chromium, and impulsing by shot peening for lubricant retaining cavities; wear resistance
09/14/2004US6790265 Aqueous alkaline zincate solutions and methods
09/14/2004CA2352929C Method of forming chromium coated copper for printed circuit boards
09/14/2004CA2322363C Method of forming chromium coated copper for printed circuit boards
09/14/2004CA2225825C Roll forming structural steel profiles with galvanised coating
09/14/2004CA2167074C Method for metallising non-conductive substrates
09/10/2004WO2004076724A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY
09/10/2004WO2003083181A3 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
09/09/2004US20040174633 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles
09/09/2004US20040173467 Immersing aluminum or aluminum alloy substrate in zincate solution comprising hydroxide, zinc, nickel, cobalt, iron, and/or copper ions; in presence of nitrogen and/or sulfur compound
09/09/2004US20040173466 Titanium-containing metals with adherent coatings and methods for producing same
09/09/2004US20040173465 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith
09/09/2004US20040173461 Method and apparatus for local polishing control
09/09/2004US20040173454 Apparatus and method for electro chemical plating using backsid electrical contacte
09/09/2004US20040173375 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
09/08/2004EP1455005A2 Copper foil for high frequency circuit and method of producing of same
09/08/2004CN1527892A Method for producing plated molded product
09/08/2004CN1526856A Continuous nickel plating process for stainless steel wire
09/07/2004US6787460 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed
09/07/2004US6787248 Structure on a bi-color rust-proof barrier layer of a tool head
09/03/2004CA2458078A1 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith
09/03/2004CA2458076A1 Titanium-containing metals with adherent coatings and methods for producing same
09/02/2004WO2004074554A1 Device and method for producing armoured layers on the cylinder bearing surfaces of internal combustion engines or similar
09/02/2004WO2004074537A1 Surface-coating method
09/02/2004WO2004055245A3 Method for the deposition of an alloy on a substrate
09/02/2004US20040171269 Substrate processing method
09/02/2004US20040170857 Having a blackened surface with a uniform hue and no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, and high in transmittancel; for a plasma display panel
09/02/2004US20040170769 Tool and process for chrome plating a vehicle wheel surface
09/02/2004US20040168927 Electroconductive structure and electroplating method using the structure
09/02/2004US20040168926 Electrodeposition; supplying solution; rotating wafers
09/02/2004CA2516053A1 Process for coating a surface
09/01/2004EP1452628A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
09/01/2004EP1452627A2 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
09/01/2004EP1452107A1 Coin made from a CuAlZnSn alloy for a mirror polish stamping and process of manufacturing the same
09/01/2004EP1451392A2 Pretreatment process for coating of aluminium materials
09/01/2004CN1525544A Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
09/01/2004CN1525492A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
09/01/2004CN1164800C Device for electrolytically treating board-shaped workpieces, especially printed circuits
08/2004
08/31/2004US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating
08/31/2004CA2145870C Process for treating plastic surfaces and swelling solution
08/26/2004WO2004072330A2 Electro-plating method and apparatus
08/26/2004US20040166360 Hot press forming method, and a plated steel material therefor and its manufacturing method
08/26/2004US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed
08/26/2004US20040163842 Flexible printed wiring board for chip-on-film
08/26/2004US20040163740 Flash plate pretreatment; applying organic coating to ferrous-alloy aircraft and curing; corrosion resistance
08/26/2004US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts
08/25/2004EP1088117B1 Method for depositing a metallic layer on a polymer surface of a workpiece
08/25/2004CN1524292A Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
08/25/2004CN1524136A Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
08/25/2004CN1523951A Chip-on-film use copper foil
08/25/2004CN1523138A Process for making plastic surface by electroplating
08/25/2004CN1163994C Base plate for electrode base of secondary cell, secondary cell electrode base, process for producing same and electrode and cell producing therefrom
08/25/2004CN1163639C Anodic oxygenation method and operation apparatus thereof
08/24/2004US6780303 Continuous nickel plating process for an aluminum conductor and corresponding device
08/19/2004WO2003059531A3 Method for coating a substrate having holes
08/19/2004US20040161627 a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns
08/19/2004US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices
08/19/2004US20040159552 coating the surface of a single crystal or directionally solidified article, especially on local areas of a gas turbine component; uniformity; good oxidation and fatigue resistance; may be used as a repair process
08/19/2004US20040159550 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent
08/18/2004EP1448035A1 Chip-on-film use copper foil
08/18/2004EP1447846A2 Socket and method for connecting electronic components
08/18/2004EP1447842A1 Bonding wire
08/18/2004EP1446262A1 Improvements in fluxless brazing
08/18/2004EP1446261A1 Product and method for low temperature fluxless brazing
08/18/2004EP1446260A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
08/18/2004CN1522192A Method for producing and recycling operating material for enameling purposes
08/17/2004US6778406 Resilient contact structures for interconnecting electronic devices
08/17/2004US6777831 Power supply device, for supplying a controlled electrical signal in an operations such as plating, etching, etc.
08/17/2004US6777778 Thin-film resistor and method for manufacturing the same
08/17/2004US6776891 Plating alloy using electrolytic cells
08/17/2004US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
08/17/2004US6776827 Method and solution for treating fluorocarbon surfaces
08/12/2004WO2004067806A1 Stencil manufacture