| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 10/21/2004 | US20040206390 Semiconductor layer includes a copper-indium-gallium-diselenide film (CIGS); vapor deposition |
| 10/21/2004 | DE10340615A1 Manufacture of biaxially textured pure metal or alloy layer useful as magnetic material involves depositing biaxially textured pure metal or alloy layer on the surface of the pure metal or alloy substrate using electroplating process |
| 10/20/2004 | EP1468127A2 Method and system for selective electro-coating of the surfaces of metals |
| 10/20/2004 | EP1274885B1 Electrical contacting element made of an elastic material |
| 10/20/2004 | CN1539030A Plating method and plating apparatus |
| 10/20/2004 | CN1539029A Copper on INVAR composite and method of making |
| 10/20/2004 | CN1537977A Surface structure of metallic body |
| 10/20/2004 | CN1537976A Metal and glass ceramic laminated composite container and its making method |
| 10/20/2004 | CN1537971A Electroplating pretreatment solution and electroplating pretreatment method |
| 10/19/2004 | US6806186 Submicron metallization using electrochemical deposition |
| 10/19/2004 | US6805975 Steel sheet for procelain enameling and method for production thereof, and enameled product and method for production thereof |
| 10/19/2004 | US6805786 Precious alloyed metal solder plating process |
| 10/19/2004 | US6804881 Applying dielectric coating onto electroconductive support; electroplating solder into recesses; applying colloidal palladium; contacting with divalent sulfur salt; free of glass fibers |
| 10/14/2004 | US20040203221 Electronic device manufacturing method |
| 10/14/2004 | US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching |
| 10/14/2004 | US20040202776 An antiplating layer is formed on localized area of a plastic component; a portion of the anti-plating layer is etched using a low-power laser; electroplating to form a plated layer over the remaining area of the plastic component |
| 10/14/2004 | US20040200727 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 10/13/2004 | EP1465739A2 Method for coating a substrate having holes |
| 10/13/2004 | CN1537180A Method for producing electroconductive particles |
| 10/13/2004 | CN1171337C Metal porous body and making method thereof, current collector for cell having same |
| 10/13/2004 | CN1171325C Battery sheath made of formed cold-rolled metal sheet and method for producing battery sheaths |
| 10/12/2004 | US6803312 Semiconductor device and method for fabricating the same |
| 10/12/2004 | US6802999 Method of fabricating protective coating for a crucible with the coating having channels formed therein |
| 10/12/2004 | US6802985 Method for fabricating metal wirings |
| 10/12/2004 | US6802951 Methods of anodizing valve metal anodes |
| 10/12/2004 | US6802947 Apparatus and method for electro chemical plating using backside electrical contacts |
| 10/07/2004 | US20040198081 Microelectronic spring contact elements |
| 10/07/2004 | US20040197661 Metallic separtor for fuel cell and production method for the same |
| 10/07/2004 | US20040197594 Steel material being useful for the manufacture of metal pipes |
| 10/07/2004 | US20040196593 Magnetic material, magnetic recording medium, magnetic recording/reproducing apparatus, information processing apparatus, and method for manufacturing the magnetic material |
| 10/07/2004 | US20040195111 Performs uniform electrodeposition and electroetching |
| 10/07/2004 | US20040195106 Plating method and plating apparatus |
| 10/07/2004 | US20040195105 Using pure metal or alloy as cathode; high misorientation on plane formed by a-axis and b-axis |
| 10/07/2004 | US20040195090 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 10/07/2004 | DE10312308A1 Verfahren zur Herstellung von Sanitärarmaturen mit Edelstahlfinish Process for the preparation of sanitary fittings with stainless steel finish |
| 10/06/2004 | EP1465262A2 Zinc oxide film treatment method and method of manufacturing photovoltaic device and utilizing the same |
| 10/06/2004 | EP1464734A2 Apparatus and method for manufacturing moulded parts |
| 10/06/2004 | EP1464731A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 10/06/2004 | EP1200647B1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 10/06/2004 | CN1534112A Device for avoiding hole forming on electroplating deposited copper film and its use method |
| 10/05/2004 | US6800190 Forming light polarizing thin films; using nontoxic electrolyte such as nickel sulfate, ammonium chloride, zinc lactate, sodium thiocyanate and sodium lactate in water |
| 10/05/2004 | US6800187 Support that controls plating solution flow dynamics and electric field shape during electroplating; uniformity; bubble free |
| 10/05/2004 | US6800186 Method and apparatus for electrochemical processing |
| 09/30/2004 | WO2004083492A1 Lead frame plating apparatus |
| 09/30/2004 | WO2004083491A1 Method for the production of sanitary fittings with a stainless steel finish |
| 09/30/2004 | US20040191949 Zinc oxide film treatment method and method of manufacturing photovoltaic device utilizing the same |
| 09/30/2004 | US20040191561 Gold layer; prevent diffusion of nickel undercoatings |
| 09/30/2004 | US20040191560 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 09/30/2004 | US20040188268 Manufacturing procedure of hand tool |
| 09/30/2004 | US20040188267 corrosion resistance protective coating; lamination rare eath magnet with nickel sulfide in plating bath |
| 09/30/2004 | US20040188266 High precision multi-grit slicing blade |
| 09/30/2004 | US20040188265 Methods for reducing protrusions and within die thickness variations on plated thin film |
| 09/30/2004 | US20040188261 Methods of forming medical devices |
| 09/30/2004 | US20040188260 Method of plating a semiconductor structure |
| 09/30/2004 | US20040188259 Design of deposits to ajust for defects in working surfaces; electrochemistry |
| 09/30/2004 | DE19953318B4 Chromplattierte Teile und Chromplattierungsverfahren Chrome plated parts and chromium-plating |
| 09/29/2004 | EP1461478A2 Composite plating film and a process for forming the same |
| 09/29/2004 | EP1461472A2 Honeycomb structure thermal barrier coating |
| 09/29/2004 | EP1297537B1 Lead-coated complex porous structures, and corresponding method for conductive activation |
| 09/29/2004 | CN1533686A Flexible printed wiring board for chip-on-film |
| 09/29/2004 | CN1533449A Method for selectively electroplating strip-shaped metal support material |
| 09/29/2004 | CN1532951A Treating method of zinc oxide film and method for producing photoelectric element using it |
| 09/29/2004 | CN1169282C Electroplating current supply system |
| 09/29/2004 | CN1169266C Manufacture of electric connector |
| 09/29/2004 | CN1168854C System, device and method for electroplating semiconductor wafer |
| 09/29/2004 | CN1168844C Strip composite material and its producing method |
| 09/28/2004 | US6797769 Electrodepositing solution for low-potential electrodeposition and electrodeposition method using the same |
| 09/28/2004 | US6797409 Electrodeposition process and a layered composite material produced thereby |
| 09/28/2004 | US6797146 Contacting with an electroplating bath of a source of metal ions, an electrolyte comprising two or more acids, and additives |
| 09/28/2004 | US6797145 Current carrying structure using voltage switchable dielectric material |
| 09/28/2004 | US6797135 Electroplating apparatus |
| 09/28/2004 | US6797132 Apparatus for plating and polishing a semiconductor workpiece |
| 09/28/2004 | US6796484 Aluminium-silicon alloy and nickel layers; filler metal selected from tin, bismuth, zinc, silver, indium, lead, antimony, magnesium, cadmium, and gallium |
| 09/23/2004 | WO2004081263A1 Electroplating pcb components |
| 09/23/2004 | WO2004081262A1 Method of electroplating a workpiece having high-aspect ratio holes |
| 09/23/2004 | WO2004081261A2 Plating apparatus |
| 09/23/2004 | WO2004080887A1 Three dimensional mecrofabrication |
| 09/23/2004 | WO2004054699A3 Method for improving the interaction between a medium and a structural component |
| 09/23/2004 | WO2004050951A3 Security film and method for the production thereof |
| 09/23/2004 | US20040185294 Sealing layers for wear resistance of multilayer surface and coating |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | US20040182715 Process and apparatus for air bubble removal during electrochemical processing |
| 09/23/2004 | DE10340197B3 Process for electrochemical separation of metals from an electrolyte containing the metal ions to be separated and indium ions useful in separation of metal ions from electrolytes with decreased hydrogen build up at the electrodes |
| 09/23/2004 | DE10311575A1 Electrolytic metallizing of a workpiece with bores of high aspect ratio useful for the electrodeposition of copper, e.g. onto conductive plates |
| 09/23/2004 | DE10309908A1 Manufacturing steel tubing used in automobile industry, electroplates with zinc, adds passivation layer, degreases and coats with polymer by hot extrusion |
| 09/22/2004 | EP1460152A1 A method of depositing a wear resistant seal coating and seal system |
| 09/22/2004 | EP1460150A1 Method for fabricating bismuth thin film and device using said film |
| 09/22/2004 | CN1531028A Electroplating method |
| 09/22/2004 | CN1530471A Apparatus and utilizing method for preventing electroplating depositing copper thin membrane generating cavity |
| 09/22/2004 | CN1530470A Tin-plating method |
| 09/22/2004 | CN1530469A High efficient copper foil and producing method thereof |
| 09/22/2004 | CN1530464A Method for producing molded goods plating |
| 09/22/2004 | CN1168125C Copper deposit process |
| 09/22/2004 | CN1167829C Method for metallizing surface of solid polymer substrate and the product obtd. |
| 09/21/2004 | US6793797 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation |
| 09/21/2004 | US6793796 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film |
| 09/21/2004 | US6793795 Utilizing ferrous and/or ferric salts and dimensionally stable insoluble anodes; full surface uniform deposition; rapidly and completely filling small width and diameter recesses; avoiding gas or liquid inclusions |
| 09/21/2004 | US6793793 High reactability; reduced generation of liquid waste; eliminates electrode cleaning |
| 09/16/2004 | WO2004079055A1 Method for producing rare-earth permanent magnet and metal plating bath |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |