C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces

Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/2004
11/25/2004	WO2004101860A1 High purity electrolytic sulfonic acid solutions
11/25/2004	WO2004101857A2 Methods and apparatus for forming multi-layer structures using adhered masks
11/25/2004	WO2004101856A2 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
11/25/2004	WO2004101855A2 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
11/25/2004	WO2004101854A2 Aqueous alkaline zincate solutions and methods
11/25/2004	WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/25/2004	US20040235219 Plating apparatus, plating method, and method for manufacturing semiconductor device
11/25/2004	US20040234683 forming plating layers having uniform thickness and smoothness on surfaces of resin fines selected from network structure polymers, thermosetting resins or elastic bodies, having conductive base layers using electrolytic cells having a rotatable barrel in the bath, while vibrating the barrel; alloys
11/25/2004	US20040232534 Packaging component and semiconductor package
11/25/2004	US20040232386 Paste composed of metal or alloy powder having the form of fine metal particles linked in a chain shape; may be paramagnetic; capable of further reducing the electrical resistance of an anisotropic conductive film; forming a plated coating having a uniform crystal structure
11/25/2004	US20040231998 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor.
11/25/2004	US20040231996 Rotating the integrated circuit wafer during electrodeposition, by immersing in an electrolytic solution, prevent defects in plated copper films
11/25/2004	DE10107675B4 Endoprothese und Verfahren zu ihrer Herstellung Endoprosthesis and processes for their preparation
11/25/2004	CA2525064A1 High purity electrolytic sulfonic acid solutions
11/25/2004	CA2502672A1 Aqueous alkaline zincate solutions and methods
11/24/2004	EP1480270A2 Packaging component and semiconductor package
11/24/2004	EP1479793A2 Plating method
11/24/2004	CN2658172Y Improved micro-etch process groove for electroplating production line
11/24/2004	CN2658171Y Descaling groove of electroplating technological process
11/24/2004	CN2658170Y Descaling process groove on electroplating production line
11/24/2004	CN2658169Y Surface dewater device before electroplating technical microetch
11/24/2004	CN1549876A Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
11/24/2004	CN1549669A Method for producing plate body and method for producing circuit device utilizing the same plate body
11/24/2004	CN1548588A Reinforced electroplating process with masked cathode
11/23/2004	US6821717 Process to form narrow write track for magnetic recording
11/23/2004	US6821409 Electroetching methods and systems using chemical and mechanical influence
11/23/2004	US6821406 Method for surface treatment of gold-plated body and surface-treated product, and process for producing gold-plated body and gold-plated body, and method for immobilization of sulfur-containing molecules
11/18/2004	WO2004099469A2 High resolution electrolytic lithography, apparatus therefor and resulting products
11/18/2004	WO2004099460A2 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface
11/18/2004	WO2004063405A3 Magnesium containing aluminum alloys and anodizing process
11/18/2004	WO2003010364A3 Dynamic pulse plating for high aspect ratio features
11/18/2004	US20040229077 Plated material and method of manufacturing the same, terminal member for connector, and connector
11/18/2004	US20040226827 Method of manufacturing electronic device
11/18/2004	US20040226826 Electrolytic cells; immersion bath; wire mesh screen; variations in pattern density on substrate surface
11/18/2004	US20040226825 electrodeposition of nickel; controlling thickness, flexibility, hardness; drum with apertures filled with dielectric resin
11/18/2004	US20040226402 Cylinders having differing surface roughness
11/18/2004	DE10238284B4 Verfahren zum Herstellen einer schaumförmigen Metallstruktur, Metallschaum sowie Anordnung aus einem Trägersubstrat und einem Metallschaum A method of manufacturing a foam-like metal structure, metal foam as well as arrangement of a supporting substrate and a metal foam
11/17/2004	EP1477587A2 Improved tin plating method
11/17/2004	EP1477586A2 A movable joint and method for coating movable joints
11/17/2004	CN1547763A Dummy structures to reduce metal recess in electropolishing process
11/17/2004	CN1546737A One side electroplating method and apparatus therefor
11/16/2004	US6818322 Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property
11/16/2004	US6818115 For circuit boards; provides improved flow of electrolyte through holes of printed circuit boards, which generates improved throwing power of plating inside through holes and blind vias
11/12/2004	CA2467033A1 A movable joint and method for coating movable joints
11/11/2004	WO2004097894A2 Self-organized nanopore arrays with controlled symmetry and order
11/11/2004	US20040222103 Process for the direct metal-plating of a plastic substrate
11/11/2004	US20040222102 A template is provided having at least two conductive regions separated by a non-conductive region
11/10/2004	EP1475463A2 Reverse pulse plating composition and method
11/10/2004	EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/10/2004	EP1153430B1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
11/10/2004	CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/09/2004	US6815357 Process and apparatus for manufacturing a semiconductor device
11/09/2004	US6815086 Methods for fluxless brazing
11/09/2004	US6814915 Method for annealing an electrodeposition structure
11/04/2004	WO2004094703A2 Methods of forming medical devices
11/04/2004	WO2004094702A2 Multi-chemistry plating system
11/04/2004	WO2004094333A2 Composite article comprising a ceramic coating
11/04/2004	WO2004094115A2 High precision multi-grit slicing blade
11/04/2004	US20040219775 Lead free bump and method of forming the same
11/04/2004	US20040219771 Pattern forming method and pattern forming device
11/04/2004	US20040219376 Biasing a conductive material to surface of heat resistant resin film; applying electrolytic plating
11/04/2004	US20040217012 Efficient removal of generated gases; higher current densities; shorter time; homogenous; coating wires on outer side
11/04/2004	DE10326253B3 Metal-glass fastening equipment lead-through for airbag or seat belt tension triggers has metal pins in a through-opening and a main body with front and rear sides and a release action
11/04/2004	DE10316612A1 Elektrolytisch beschichtetes Kaltband, vorzugsweise zur Verwendung für die Herstellung von Batteriehülsen sowie Verfahren zur Beschichtung derselben Electroplated cold-rolled strip, preferably for use for the manufacture of battery sleeve as well as methods for coating the same
11/04/2004	DE10314502A1 Ein Verfahren zum Beschichten einer Halbleiterstruktur A method of coating a semiconductor structure
11/04/2004	CA2520079A1 Composite article comprising a ceramic coating
11/03/2004	EP1169162B1 Method and apparatus for plating and polishing a semiconductor substrate
11/03/2004	CN1542168A Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle
11/03/2004	CN1174481C Method for making burrless castellation via hole for plastic chip carrier and product
11/02/2004	US6811819 Aqueous alkaline zincate solutions and methods
11/02/2004	US6811675 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
11/02/2004	US6811673 Method for electrolytic galvanizing using electrolytes containing alkane sulphonic acid
11/02/2004	US6811672 Method for forming plating film and electronic component having plating film formed theron by same method
11/02/2004	US6811671 Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed
10/2004
10/28/2004	WO2004092452A1 Two-layer flexible copper-clad laminate and method for manufacturing the two-layer flexible copper-clad laminate
10/28/2004	WO2004092451A1 Method of directly forming electroplate layer on the surface of nonconductive material
10/28/2004	WO2004092450A1 Compositions and coatings including quasicrystals
10/28/2004	WO2004092433A1 High strength and high magnetic permeability steel sheet for cathode ray tube band and method for production thereof
10/28/2004	US20040211672 Composite plating film and a process for forming the same
10/27/2004	EP1471347A1 Method of determining organic additives in an electroplating bath
10/27/2004	EP1471084A2 Polymers for metal coating and method for the preparation thereof
10/27/2004	EP1470267A1 Methods of anodizing sintered valve metal anodes
10/27/2004	CN1540040A Reverse pulse electroplating composition and method thereof
10/27/2004	CN1540039A Nickel base alloy composite conductor roll and manufacturing method
10/27/2004	CN1173612C Copper foil for printed circuit and its manufacture
10/26/2004	US6809029 Semiconductor production device and production method for semiconductor device
10/26/2004	US6808813 Ceramic electronic device and method of manufacturing the device
10/26/2004	US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing
10/26/2004	US6808612 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation
10/21/2004	WO2004090200A1 Alloy deposition controlled by a characteristic diagram
10/21/2004	WO2004090199A1 Electrochemical particle coating method and devices therefrom
10/21/2004	WO2004090198A2 Electrolytically coated cold-rolled strip, preferably to be used for the production of battery shells, and method for coating the same
10/21/2004	WO2004042790A8 Method for increasing the copper to superconductor ratio in a superconductor wire
10/21/2004	US20040209779 Method for increasing the copper to superconductor ratio in a superconductor wire
10/21/2004	US20040209464 Plating method and plating apparatus
10/21/2004	US20040209112 an electrically conductive material for connecting parts which consists of a parent material of copper, does not crack even when bent sharply, keeps a low contact resistance after standing at high temperatures, has good corrosion resistance to SO2
10/21/2004	US20040209106 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer
10/21/2004	US20040208749 Method of forming abrasion-resistant layer on rotor blade, an abrasion-resistant layer and a method of regenerating the same, and a gas turbine
10/21/2004	US20040206629 Method for the selectively electroplating a strip-shaped, metal support material
10/21/2004	US20040206628 Electrical bias during wafer exit from electrolyte bath

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