Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
12/2004
12/30/2004US20040264820 Sliding member
12/30/2004US20040262165 Plating method
12/30/2004US20040262164 Method and apparatus for managing plating interruptions
12/30/2004US20040262163 Allows electroforming at low temperature; for manufacturing a metal product
12/29/2004WO2004113594A2 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
12/29/2004WO2002022915A3 Removable modular cell for electro-chemical plating
12/29/2004EP1491656A1 Electroless deposition catalyst and menthod
12/29/2004EP1490602A1 Plated fastener inserts and method of producing the same
12/29/2004CN1559081A Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
12/29/2004CN1558966A Platable engineered polyolefin alloys
12/29/2004CN1182766C Electro-deposition copper foil through surface-processing, its mfg. method and use thereof
12/29/2004CN1182571C High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate
12/28/2004US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
12/28/2004US6835294 Dummy electrolysis corrects reduction in via-holes filling
12/23/2004WO2004111312A2 Contact surfaces for electrical contacts and method for producing the same
12/23/2004WO2004111288A2 Fabrication of titanium and titanium alloy anode for dielectric and insulated films
12/23/2004WO2004097894A3 Self-organized nanopore arrays with controlled symmetry and order
12/23/2004WO2004094333A3 Composite article comprising a ceramic coating
12/23/2004WO2004053203A3 Method for the electrolytic deposition of magnesium or magnesium-zinc on galvanised sheet metal
12/23/2004WO2001071780A3 Apparatus and method for electrochemically processing a microelectronic workpiece
12/23/2004US20040258363 Optical fixed attenuator and manufactuing process thereof
12/23/2004US20040256408 Cladding products and methods for making same
12/23/2004US20040256239 Tin plating method
12/23/2004US20040256236 Compositions and coatings including quasicrystals
12/23/2004DE202004016062U1 Device for placing, and holding for dipping flat metal body, especially a copper plate with a cooling element useful in electroplating operations and avoiding plating bath contamination with dirt or corrosion particles
12/22/2004EP1489656A2 Method of fabrication of an unbreakable disc-shaped object and corresponding semiconductor circuit
12/22/2004EP1488024A2 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
12/22/2004EP1487599A1 Metal hydride composite materials
12/22/2004CN2665146Y Compliance type compressing apparatus
12/22/2004CN1557000A Conductive paste and conductive film using it, plating method and production method for fine metal component
12/22/2004CN1556254A Electroplating method and special electroplating device using said electroplating method
12/22/2004CN1556253A Preparation method of composite cladding material and equipment
12/22/2004CN1181570C Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery
12/22/2004CN1181227C High-brightness high-corrosion-resistance high-wear resistance nano compound electroplating layer composition and its preparing process
12/21/2004US6833205 Electrochemical cell system output control method and apparatus
12/16/2004WO2004108346A1 Process for forming a porous drug delivery layer
12/16/2004WO2004081262A8 Method of electroplating a workpiece having high-aspect ratio holes
12/16/2004WO2004042344A3 Fabrication of a high resolution biological molecule detection device with gold electrical conductors
12/16/2004US20040253810 Dummy structures to reduce metal recess in electropolishing process
12/16/2004US20040251142 Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures
12/16/2004US20040251141 Capable of achieving reliable removal of bubbles from treatment liquid wherein substrate is placed to face plate and treatment liquid is jetted from plate; bubble discharge portion formed in plate discharges bubbles in treatment liquid, thereby reducing nonuniform treatment caused by bubbles
12/16/2004US20040251140 Fabrication of titanium and titanium alloy anode for dielectric and insulated films
12/16/2004US20040250981 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll
12/15/2004EP1092338B1 Assembly of an electronic component with spring packaging
12/15/2004CN2663436Y Apparatus for surface water removal before antiscale in pre-processing technique of electroplating
12/15/2004CN1555428A Method and electrode for defining and replicating structures in conducting materials
12/15/2004CN1554805A Electroplating method and electroplating device special for such electroplating method
12/15/2004CN1554804A Applying tungsten base serial non crystal state alloy on electroplating layer for piston ring surface
12/15/2004CN1180133C Electrodeposition of metals in smal recesses using modulated electric fields
12/15/2004CN1180132C Process for preparing aluminium or aluminium alloy piece, aqueous plating liquid and its use, assembly and its preparing method
12/14/2004US6831002 Manufacturing method of semiconductor device
12/14/2004US6830667 Cathode cartridge and anode cartridge of testing device for electroplating
12/14/2004CA2156644C Method and apparatus for continuous galvanic or chemical application of metallic layers on a body
12/09/2004WO2004107833A1 Method for manufacturing copper foilfor printed circuit board
12/09/2004WO2004107422A2 Plating apparatus and plating method
12/09/2004US20040247865 Using acidic electrolytic bath; containing mixture of thiourea and amino acid
12/09/2004US20040245112 Apparatus and method for plating a substrate
12/09/2004US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus
12/09/2004US20040244880 Metallization of aluminum and magnesium alloy using laser bombardment; sealing electronics
12/08/2004EP1484433A1 Zinc coating of electrically non conducting surfaces
12/08/2004EP1483762A2 Magnetic flux concentrating cladding material on conductive lines of mram
12/08/2004EP1483430A1 Non-cyanide copper plating process for zinc and zinc alloys
12/08/2004CN1554113A Planar metal electroprocessing
12/08/2004CN1179611C Composite foil of aluminium and copper
12/07/2004US6828225 Substrate processing method
12/07/2004US6827835 Method for electroplated metal annealing process
12/07/2004US6827834 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and
12/07/2004US6827833 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
12/07/2004US6827827 Metal plating apparatus and process
12/02/2004WO2004104430A1 Coated fastener systems and methods of preventing adhesion of a second coating to a portion of a fastener system
12/02/2004WO2004072330A3 Electro-plating method and apparatus
12/02/2004US20040241489 Sliding member
12/02/2004US20040241405 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material; radio communication terminal, such as a mobile telephone or a personal assistant
12/02/2004US20040239006 Silicone compositions, methods of making, and uses thereof
12/02/2004US20040238985 Masking article for use in vehicle manufacturing
12/02/2004US20040238984 Painting or coating a vehicle; grinding, pulverization for resuse in injection molding application
12/02/2004US20040238952 Asymmetric plating
12/02/2004US20040238371 Electrophoretically lacquering, chemically metallizing and galvanically coating; imparting corrosion resistance and long lasting optical finishing
12/02/2004US20040238370 Producing high density device; electroless copper deposition of etchable seed insulating layer, photolithographically producing resist pattern and electrolytically plating etch resistant copper layer
12/02/2004US20040238367 Methods for fabricating metal nanowires
12/02/2004US20040238078 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method
12/02/2004US20040237282 Process for forming a porous drug delivery layer
12/02/2004DE10323658A1 Verfahren und Vorrichtung zur Beschichtung eines Substrats Method and apparatus for coating a substrate
12/02/2004DE10320237A1 Verfahren zur Herstellung durchleuchtbarer, galvanisch veredelter Thermoplastteile und durchleuchtbare Thermoplastteile mit galvanisch veredelter Oberfläche Process for the preparation radiotranslucent, galvanically refined thermoplastic parts and transilluminable thermoplastic parts with galvanically finished surface
12/01/2004EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
12/01/2004EP1264009B1 Method for applying a metal layer to a light metal surface
12/01/2004EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
12/01/2004CN1551928A Corrosion-resistant coating structure containing no-6valent chromium which has resin layers and metal layer excellent in adhesion to resin layers
12/01/2004CN1551295A Method of manufacturing electronic device
12/01/2004CN1551259A Method for forming outer electrode of electronic element and said electronic element
12/01/2004CN1551247A Plated material and method of manufacturing the same, terminal member for connector, and connector
12/01/2004CN1551246A Method for forming metal pattern and electromagnetic interference filter using metal pattern
12/01/2004CN1550579A Improved electroplating liquid analysis
12/01/2004CN1550577A Improved tin plating method
11/2004
11/30/2004US6826440 Experimental management apparatus and experimental management program for electroplating
11/30/2004US6824668 Method for electroplating Ni-Fe-P alloys using sulfamate solution
11/30/2004US6824667 Metal hydride composite materials
11/25/2004WO2004101863A2 Method and device for coating a substrate
11/25/2004WO2004101862A1 Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
11/25/2004WO2004101861A1 Electrochemical fabrication methods with enhanced post deposition