| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 02/03/2005 | WO2003028048A3 Low-force electrochemical mechanical processing method and apparatus |
| 02/03/2005 | WO2002020876A3 Segmenting of processing system into wet and dry areas |
| 02/03/2005 | US20050025960 Catalyst composition and deposition method |
| 02/03/2005 | US20050023149 Uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate |
| 02/03/2005 | US20050023148 Selectively transferring a prepatterned dielectric mask precursor through which voids extend to solidify and adhere to a substrate; depositing material through the voids; removing the mask to leave one or more openings through the deposited layer; depositing a 2nd material through the openings; polishing |
| 02/03/2005 | US20050023146 Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric |
| 02/03/2005 | US20050023145 Forming and adhering a desired pattern of dry film photoresist masking material on a substrate resulting in voids that expose the substrate and depositing conductive material into the voids |
| 02/03/2005 | DE10357174B3 Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse |
| 02/03/2005 | CA2530286A1 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 02/02/2005 | CN1575512A 键合线 Bonding wire |
| 02/02/2005 | CN1575348A Hot press forming method, and a plated steel material therefor and its manufacturing method |
| 02/02/2005 | CN1575099A Method for forming sheet metal |
| 02/02/2005 | CN1574300A 封装组件和半导体封装 Package assembly and semiconductor packaging |
| 02/02/2005 | CN1572911A Apparatus and method for plating a substrate |
| 02/02/2005 | CN1572909A Molten salt bath for electroforming and method of manufacturing metal product using the same |
| 02/02/2005 | CN1572903A Catalyst composition and deposition method |
| 02/02/2005 | CN1187478C Method for preparing copper-nickel phosphor multilayer film |
| 02/02/2005 | CN1187132C Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same |
| 02/01/2005 | US6849294 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 02/01/2005 | US6849173 Forming copper seed layer over the sidewalls of opening in patterned dielectric layer; electrochemically removing any copper oxide; electrochemically plating a bulk copper layer over the oxide-free seed layer |
| 02/01/2005 | US6849138 Method for surface treatment of aluminum alloy high-temperature processed articles |
| 01/27/2005 | WO2005008759A1 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/27/2005 | WO2004090198A3 Electrolytically coated cold-rolled strip, preferably to be used for the production of battery shells, and method for coating the same |
| 01/27/2005 | US20050020068 Plating method |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016861 On a semiconductor wafer with an insulating layer of a field region and a plurality of features, forming a barrier layer overlying the field region; electrodepositing copper filling the features in the insulating layer, polishing to remove the copper layer and the barrier layer from the field region |
| 01/27/2005 | US20050016859 Increasing step current to carry out an electroplating operation so that the bumps have a uniform thickness |
| 01/27/2005 | US20050016858 Reverse pulse plating composition and method |
| 01/27/2005 | US20050016856 Determining the quantity of brightener and leveler in a metal plating bath using plating bath samples of known and different quantity of the brightener and the leveler, but where the quantity differs from the quantity in the other bath samples |
| 01/27/2005 | DE19723980B4 Kontinuierliches, rechnergesteuertes Verfahren zur Herstellung von schwarzverchromten, oberflächenfehlerfreien, komplettierbaren Spritzgußteilen aus Magnesiumlegierungen mit elektrisch leitfähigen und optimal haftfähigen Oberflächenbereichen und Anwendung dieses Verfahrens A continuous computer-controlled process for the preparation of black chrome, surface error-free, komplettierbaren injection molded parts made of magnesium alloys with electrically conductive and optimal adhesive surface areas and use of this method |
| 01/26/2005 | EP1500146A1 Method for making thin-film semiconductors based on i-iii-vi sb 2 /sb compounds, for photovoltaic applications |
| 01/26/2005 | EP1499759A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 01/26/2005 | EP1499758A1 Metallization of polymer parts for painting |
| 01/26/2005 | CN1571867A Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 01/26/2005 | CN1571865A System and method for electrolytic plating |
| 01/25/2005 | US6846574 Device adapted for exposure to high temperatures |
| 01/25/2005 | US6846401 Method of plating and pretreating aluminium workpieces |
| 01/20/2005 | WO2005005692A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
| 01/20/2005 | WO2004101863A3 Method and device for coating a substrate |
| 01/20/2005 | WO2004099469A3 High resolution electrolytic lithography, apparatus therefor and resulting products |
| 01/20/2005 | WO2004020696A3 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam |
| 01/20/2005 | US20050014014 Electroplating bath composition and method of using |
| 01/20/2005 | DE19542313B4 Beschichtetes, hitzebeständiges und korrosionsfestes Stahlmaterial Coated, heat-resistant and corrosion-resistant steel material |
| 01/19/2005 | EP1498512A1 Method for activating surface of parent material and its activating system |
| 01/19/2005 | EP1497859A2 Method for the production of thin metal-containing layers having low electrical resistance |
| 01/19/2005 | EP1497476A1 Process of masking cooling holes of a gas turbine component |
| 01/19/2005 | CN2671706Y Novel roller automatic cleaner |
| 01/19/2005 | CN1568380A Nickel-based surface treatment films excellent in heat-resistant adhesion to resin |
| 01/19/2005 | CN1566406A Method for pulse plating of copper using pyrophosphate with neodymium-iron-boron permanent magnet |
| 01/19/2005 | CN1185371C Method for electroplating substrate using ceramic chromium and ceramic chromium layer electroplated on substrate |
| 01/19/2005 | CN1185369C Process for preparing Pd nano-particle film on surface of gold electrode |
| 01/18/2005 | US6843902 Methods for fabricating metal nanowires |
| 01/13/2005 | WO2005003409A1 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 01/13/2005 | US20050009333 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
| 01/13/2005 | US20050008881 Polymeric coating formulations and steel substrate composites |
| 01/13/2005 | US20050008788 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 01/13/2005 | US20050006245 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/13/2005 | US20050006244 Electrode assembly for electrochemical processing of workpiece |
| 01/13/2005 | US20050006243 Positioning object in concave zone of carrier tape; plating, washing; electrolytic cell |
| 01/13/2005 | US20050006241 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
| 01/13/2005 | DE10326507A1 Verfahren zur Herstellung eines bruchfesten scheibenförmigen Gegenstands sowie zugehörige Halbleiterschaltungsanordung A process for producing a shatter-resistant disc-shaped object and associated Halbleiterschaltungsanordung |
| 01/13/2005 | DE102004025560A1 Gleitteil Slide |
| 01/13/2005 | DE102004014402A1 Geschmolzenes Salzbad für das Elektroformen und Verfahren zu seiner Herstellung, Metallprodukt unter Verwendung desselben Of the same molten salt bath for electroforming and method for its manufacture, metal product using |
| 01/13/2005 | CA2530976A1 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 01/12/2005 | EP1496142A2 Electroplating method and electroplating apparatus |
| 01/12/2005 | EP1495161A2 Electropolishing and electroplating methods |
| 01/12/2005 | EP1364079B1 A process for electrochemical deposition of tantalum |
| 01/12/2005 | CN1565149A Nickel coated copper as electrodes for embedded passive devices |
| 01/12/2005 | CN1563507A Platform method for fabricating cylinder liner with chrome in reticulate pattern being plated |
| 01/12/2005 | CN1563506A Electroplate method of making chromium coat layer of cylinder liner generate spongy structure for storing oil |
| 01/12/2005 | CN1563505A Method of pulse plating nickel based nano composite plating layer and equipment |
| 01/12/2005 | CN1184361C Process for metallizing a plastic surface |
| 01/12/2005 | CN1184360C Anti-corrosion process for pure iron |
| 01/11/2005 | US6841264 Doctor or coater blade and method in connection with its manufacturing |
| 01/11/2005 | US6841191 Transparent insulation has an anti-etch feature for the electrolyte to keep the exposed surface of the body smooth. |
| 01/11/2005 | US6841189 Forming a plating base on the surfaces and introducing a modifying agent to the recess and which absorbs into the surface regions not covered by the plating base |
| 01/11/2005 | US6841056 Reduce concentration of oxygen, sulfur dioxide; forming integrated circuits |
| 01/06/2005 | WO2005001896A2 Wet chemical processing chambers for processing microfeature workpieces |
| 01/06/2005 | WO2005001160A1 Method for manufacturing water appliance made from copper alloy containing lead |
| 01/06/2005 | WO2005001159A1 Method for producing stainproof chromium plated article |
| 01/06/2005 | WO2004031454A3 Cathode design for use in electrodeposition cell |
| 01/06/2005 | WO2003021007A3 Ultrasonically-enhanced electroplating apparatus and methods |
| 01/06/2005 | WO2002050336A3 Integrated mutli-step gap fill and all feature planarization for conductive materials |
| 01/06/2005 | US20050003654 Method of producing semiconductor device |
| 01/06/2005 | US20050003242 Coating a photocatalytic compound unto sybstrate; exposur eto light; electroconductive metal patterns |
| 01/06/2005 | US20050000821 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 01/06/2005 | US20050000820 Apparatus and method for processing a substrate |
| 01/06/2005 | US20050000817 Positioning magnet; reduce interference between electrode and magnet |
| 01/06/2005 | US20050000816 Multilater; dielectric and electroconductive layers |
| 01/06/2005 | US20050000814 Applying ultrasonic frequency to plating bath; immersed, rotating cylinder; uniform plating |
| 01/06/2005 | US20050000600 Ultra high saturation moment soft magnetic thin film |
| 01/05/2005 | EP1493847A2 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 01/05/2005 | CN1561280A Method and apparatus for avoiding particle accumulation in electrodeposition |
| 01/05/2005 | CN1182939C Method and apparatus for deposition on and polishing of semiconductor surface |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion |
| 01/04/2005 | US6837973 Apparatus for electrically coating a hot-rolled steel substrate |
| 12/30/2004 | US20040266085 Integrated multi-step gap fill and all feature planarization for conductive materials |
| 12/30/2004 | US20040265618 Sliding member |
| 12/30/2004 | US20040265562 Method of electroplating copper layers with flat topography |