Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
04/2005
04/14/2005US20050077082 Tin deposition
04/14/2005DE202005001724U1 Sieve insert for medical cleaning units in stainless steel with black chromed marking of the resting surface for medical instruments, is made using masking technique
04/14/2005DE10343371A1 Process for metallizing surfaces comprises inserting workpieces to be metallized individually into treatment chambers, and contacting surface sections of the workpiece with process chemicals which flow into the treatment chambers
04/14/2005DE10337029A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use
04/13/2005EP1522610A2 Method for the production of a wear-resistant layer
04/13/2005EP1522609A2 Conductive sheet having a metal layer on at least one portion of an insulating substrate, product using the same, and manufacturing method thereof
04/13/2005EP1522608A2 Diffusion barrier and protective coating for turbine engine component and method for forming
04/13/2005EP1214739A4 Copper deposit process
04/13/2005EP1200646B1 Alloy plating
04/13/2005CN1606400A Conductive sheet, product using the same, and manufacturing method thereof
04/13/2005CN1605635A Method for relieving stress before plating whole chain
04/13/2005CN1197443C Assembly of an electronic component with spring packaging
04/13/2005CN1197128C Method for forming copper layer on semiconductor chip
04/13/2005CN1196812C Surface treated Tin-plated steel sheet and chemical treatment solution
04/12/2005US6878461 Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same
04/12/2005US6878458 Metal foil for current collector of secondary battery and method of producing the same
04/12/2005US6878355 Device for activating conductivity in porous structures
04/12/2005US6878261 Surface treatment method of copper foil with silane coupling agent
04/12/2005US6878260 An antiplating layer is formed on localized area of a plastic component; a portion of the anti-plating layer is etched using a low-power laser; electroplating to form a plated layer over the remaining area of the plastic component
04/12/2005US6878259 Immersion in electrolytic cell
04/12/2005CA2148215C Nanocrystalline metals
04/07/2005US20050074934 Electrodeposited layer
04/07/2005US20050073047 Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof
04/07/2005US20050072683 Containing two high molecular weight surfactants of different hydrophobicities and sulfur containing saturated organic compound electrocoating rate promoter; film uniformity and filling performance
04/07/2005US20050072682 Covering with low cost, high corrosion and abrasion resistant multilayer; metal electroplating and electrostatically spraying and curing organic powder sealant
04/07/2005US20050072680 Rotating about axis passing through surface to be plated and moving wafer such that its axis rotates about second axis of rotation
04/06/2005EP1520915A2 Method and apparatus for partially plating work surfaces
04/06/2005EP1520281A2 Low-force electrochemical mechanical processing method and apparatus
04/06/2005CN1604830A Wire for high-speed electrical discharge machining
04/06/2005CN1196391C Method for surface treatment of copper foil
04/06/2005CN1196202C Method and equipment for forming zinc oxide film, and method and apparatus manufacturing photovoltaic device
04/05/2005US6875471 Metallization of polymer parts for painting
04/05/2005US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
04/05/2005US6875330 Process for coating workpieces with bearing metal
04/05/2005US6875291 Method for producing a tin-zinc alloy film
03/2005
03/31/2005WO2004099460A3 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface
03/31/2005US20050069645 Method of electrolytically depositing materials in a pattern directed by surfactant distribution
03/31/2005US20050067296 Electrodeposition; galvanically coating iron on surface of aluminum-based substrate, cleaning with solution of oils, fats, emulsions, and pigments, etching in solution to dissolve alloy, rinsing surface with water, immersing in electrolytic iron sulfate solution, then anodically/cathodically switching
03/31/2005US20050067292 Electrodeposition; integrated circuits
03/31/2005US20050067274 [electroplating apparatus]
03/31/2005DE10005680B4 Trägermaterial für eine flexible, bandförmige CIS-Solarzelle Support material for a flexible, band-shaped CIS solar cell
03/30/2005EP1518944A1 Tin-plated steel plate and method for production thereof
03/30/2005CN1600904A Mickel coated steel strap for deep drawing and preparation method
03/30/2005CN1195101C Composite deposition process on surface of piston ring
03/29/2005US6872579 Thin-film coil and method of forming same
03/29/2005US6872288 Apparatus for controlling flow in an electrodeposition process
03/24/2005WO2003096859A3 Method for producing galvanised sanitary objects made of plastic
03/24/2005US20050064703 Substrate processing method
03/24/2005US20050064228 Protective coating for turbine engine component
03/24/2005US20050061679 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density
03/24/2005US20050061676 System for electrochemically processing a workpiece
03/24/2005US20050061661 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive
03/24/2005US20050061660 System and method for electrolytic plating
03/24/2005US20050061659 Plating apparatus and plating method
03/24/2005DE19748926B4 Verfahren zum Galvanisieren einer siliciumhaltigen Aluminiumlegierung, Zylinderblock aus einer siliciumhaltigen Aluminiumlegierung Method of electroplating a silicon-containing aluminum alloy cylinder block of a silicon-containing aluminum alloy
03/24/2005DE19746703B4 Galvanisiervorrichtung Plating apparatus
03/24/2005CA2532451A1 Device and method for electrolytically treating electrically insulated structures
03/23/2005EP1516943A2 Protective coating for turbine engine component
03/23/2005EP1516077A2 Ultrasonically-enhanced electroplating apparatus and methods
03/23/2005EP1516076A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
03/23/2005EP1440185A4 Platable engineered polyolefin alloys
03/23/2005CN1599809A Pretreatment process for coating of aluminium materials
03/23/2005CN1597290A Metal mould for processing plastic gloves and its production method
03/23/2005CN1194587C Production method of copper foil for fine line use
03/22/2005US6869690 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer
03/22/2005US6869510 Methods and apparatus for processing the surface of a microelectronic workpiece
03/17/2005WO2004057062A3 Method and device for filling material separations on a surface
03/17/2005US20050058848 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer
03/17/2005US20050056544 Dual contact ring and method for metal ECP process
03/17/2005US20050056542 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
03/17/2005US20050056541 Enclosing in tubal shield; connecting to cathode; immersion into bath
03/17/2005US20050056446 Electronic component and method of manufacturing the same
03/17/2005DE10337030A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use
03/16/2005EP1442161B1 Method of eliminating voids in w plugs
03/16/2005EP1409772B1 Method for selectively electroplating a strip-shaped, metal support material
03/16/2005EP1268880B1 Process for the direct metal-plating of a plastic substrate
03/16/2005EP1204787B1 Method for continuous nickel-plating of an aluminium conductor and corresponding device
03/16/2005CN1594667A Parcel plating process and local gold plating special machine for hardware
03/16/2005CN1193416C Electronic device and method of manufacturing the electronic device
03/15/2005US6868214 Optical waveguide, method of fabricating the waveguide, and optical interconnection device using the waveguide
03/15/2005US6867136 Method for electrochemically processing a workpiece
03/15/2005US6866945 Magnesium containing aluminum alloys and anodizing process
03/15/2005US6866764 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film
03/10/2005WO2005022670A1 Battery can and manufacturing method thereof and battery using the same
03/10/2005WO2005021840A1 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes
03/10/2005WO2005021839A1 Method for electrochemically depositing metals from an electrolyte
03/10/2005WO2005021822A1 Method for producing a hardened steel part
03/10/2005WO2005021821A1 Method for producing hardened parts from sheet steel
03/10/2005WO2005021820A1 Method for producing a hardened profile part
03/10/2005WO2003056609A3 Apparatus and method for electroplating a wafer surface
03/10/2005US20050053849 Controlling thickness of beams; elongated structures; multilayer adhesion; configurated into narrow zones
03/10/2005US20050051437 Having porous member (plating solution impregnated member), the plating apparatus being capable of handling and easily controlling composition of plating soution; especially for electroless deposition of copper or silver; for filling fine interconnect pattern in semiconductor substrate
03/10/2005US20050051436 Electroplating metal into recessed structure by applying first electroplating waveform having first current to anode to enhance deposition of metal at bottom of structure, then changing waveform applied to anode to second electroplating waveform having second current; high speed
03/10/2005US20050051435 Spray coating the inner wall surface of a hollow body, more specifically of a pin holder of an igniter, with gold, the one end side of which is open and comprises there a perimeter edge; for electrical igniter units for igniting fuels; for air bags or for belt tighteners in automotive vehicles
03/10/2005US20050051425 Electroplating apparatus with functions of voltage detection and flow rectification
03/10/2005US20050050767 Wet chemical processing chambers for processing microfeature workpieces
03/09/2005EP1415021A4 Copper on invar composite and method of making
03/09/2005EP1257694A4 Conditioning of through holes and glass
03/09/2005EP1148976B1 Method and apparatus for deposition on and polishing of a semiconductor surface
03/09/2005CN1591989A Terminal and its electroplating method