| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 05/24/2005 | US6896784 Method for controlling local current to achieve uniform plating thickness |
| 05/24/2005 | US6896776 Method and apparatus for electro-chemical processing |
| 05/24/2005 | CA2141604C Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 05/19/2005 | WO2005045102A2 Coating of substrates |
| 05/19/2005 | US20050106474 Method for controlling linewidth in advanced lithography masks using electrochemistry |
| 05/19/2005 | US20050106408 features separated by distance bridged by tin whisker; silver or silver alloy layer coating at least one surface of features; fine grain tin or tin alloy layer directly coating silver layer; silver phase is beneficial to minimize increase in resistivity due to oxidation of fretting wear debris |
| 05/19/2005 | US20050103637 First layer of high mechanical strength and chemical resistance, and second layer has high electroconductivity, the layers adhered to each other at the interface via a composition gradient, or via a thin film of copper between them; rotary blade cutter |
| 05/19/2005 | US20050103636 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad |
| 05/19/2005 | US20050102830 Electrolessly plating a thin copper film onto a dielectric, forming plated resists, electrolytically plating copper, removing the plated resists and thin copper film layers, etching the wiring pattern layers, and forming another dielectric layer; high performance; miniaturization |
| 05/19/2005 | DE10358147B3 Transport and treatment method for circuit boards and conductor foils has electrolyte flow for electrolytic processing assisting transport of circuit boards or conductor foils in transport direction |
| 05/19/2005 | DE10217277B4 Verfahren zur metallischen Innenbeschichtung von Hohlkörpern, insbesondere von Strahlrohrelementen A process for internal coating of metallic hollow bodies, in particular jet pipe elements |
| 05/18/2005 | EP1531656A2 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| 05/18/2005 | EP1531014A2 Roll for metal rolling, and support for lithographic printing plate |
| 05/18/2005 | CN1617772A Method for coating a substrate having holes |
| 05/18/2005 | CN1202697C Method for filling through hole |
| 05/17/2005 | US6893550 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
| 05/17/2005 | US6893549 Cleaning apparatus for ECMD anode pad |
| 05/17/2005 | US6893505 Valve for controlling fluid flow |
| 05/17/2005 | US6893330 Tool and process for chrome plating a vehicle wheel surface |
| 05/12/2005 | WO2005042806A1 Silver-coated stainless strip for movable contact and method for production thereof |
| 05/12/2005 | WO2005042805A1 Method of depositing selectively absorbent film on a metal substrate |
| 05/12/2005 | WO2005042804A2 Method and apparatus for fluid processing a workpiece |
| 05/12/2005 | WO2004101854A3 Aqueous alkaline zincate solutions and methods |
| 05/12/2005 | WO2004094703A3 Methods of forming medical devices |
| 05/12/2005 | US20050098440 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
| 05/12/2005 | US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys |
| 05/12/2005 | US20050097735 Process for forming metal layers |
| 05/12/2005 | DE10358149B3 Process for contact-free transport and treatment of flat material by wet chemical and/or electrolytic processing useful in the transport and treatment, e.g. cleaning and etching, of conductive films and plates |
| 05/11/2005 | CN1615204A Alloy composition and method for low temperature fluxless brazing |
| 05/11/2005 | CN1615203A Improvements in fluxless brazing |
| 05/10/2005 | US6891198 Film carrier tape for mounting an electronic part |
| 05/10/2005 | US6890813 Polymer film metalization |
| 05/10/2005 | US6890415 Reactor vessel having improved cup, anode and conductor assembly |
| 05/10/2005 | US6890413 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 05/10/2005 | US6890412 Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles |
| 05/10/2005 | US6889428 Clamper covers the conductive foil to cover the exposed parts of the surface, and a plating liquid is injected into the interior of the clamper for forming the plated film on the surface of the masked conductive foil |
| 05/06/2005 | WO2005040461A1 Method and system for selectively coating metal surfaces |
| 05/06/2005 | WO2005040459A2 Electroplating compositions and methods for electroplating |
| 05/05/2005 | US20050095862 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 05/05/2005 | US20050092616 Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
| 05/05/2005 | US20050092613 Two-bath electrolysis |
| 05/05/2005 | US20050092612 Electrodeposition film forming method, and semiconductor apparatus |
| 05/05/2005 | US20050092611 Bath and method for high rate copper deposition |
| 05/04/2005 | EP1527216A2 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied |
| 05/04/2005 | EP1527215A2 Apparatus and method for electroplating a wafer surface |
| 05/04/2005 | EP1526944A1 Brazing product and method of its manufacture |
| 05/04/2005 | EP1526943A1 Brazing product and method of manufacturing a brazing product |
| 05/04/2005 | EP1468127B1 Method and system for selective electro-coating of the surfaces of metals |
| 05/04/2005 | EP1189678A4 Hydrogen-permeable metal membrane and method for producing the same |
| 05/04/2005 | DE10035102B4 Verfahren zur Beschichtung von Bauteilen aus gehärtetem Stahl oder Eisenguss mit Zink-Nickel-Legierungen und mit diesem Verfahren erhältliche beschichtete Substrate Method for coating components made of hardened steel or cast iron with zinc-nickel alloys and obtainable by this process coated substrates |
| 05/04/2005 | CN2697110Y Journal protective sleeve for roller surface electroplating |
| 05/04/2005 | CN1612951A Direct electrolytic metallization of non-conducting substrate |
| 05/04/2005 | CN1612950A Ultrasonically-enhanced electroplating apparatus and methods |
| 05/03/2005 | US6887789 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece |
| 05/03/2005 | US6887561 May be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidising agents, |
| 05/03/2005 | US6887522 Forming a first copper film on a predetermined surface of a substrate by chemical vapor deposition and forming a second copper film on the first copper film by an electrolytic copper plating using the first copper film as an electrode |
| 05/03/2005 | US6887366 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets |
| 05/03/2005 | US6887364 Steel sheet is immersed in electrolytic baths and plated on both sides using electrode with inverted polarity; brazing |
| 05/03/2005 | US6887113 Contact element for use in electroplating |
| 05/03/2005 | US6886520 Cylinder for internal combustion engine and method of treating inner surface of the cylinder |
| 04/28/2005 | WO2005038989A2 Fretting and whisker resistant coating system and method |
| 04/28/2005 | WO2004003663A3 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 04/28/2005 | WO2003094246A8 Method for making thin-film semiconductors based on i-iii-vi2 compounds, for photovoltaic applications |
| 04/28/2005 | WO2003034478A3 Apparatus and method for electro chemical plating using backside electrical contacts |
| 04/28/2005 | US20050089645 Flexible member can be used to provide a uniform force to securely retain the workpiece to be positioned in a process module resulting in uniform coatings; for fluid processing (e.g. electrodeposition) of substrates e.g. semiconductor wafers |
| 04/27/2005 | EP1526192A1 Electrolytic process for depositing a graded layer on a substrate and component |
| 04/27/2005 | CN2695454Y Device for improving sedimentation uniforming in electrocasting technology |
| 04/27/2005 | CN1609282A Partial plating method and its apparatus |
| 04/27/2005 | CN1609280A Ball iron ring chrome-plating technology and plating liquid thereof |
| 04/27/2005 | CN1198965C Article having coating thereon |
| 04/27/2005 | CN1198962C Coated article |
| 04/27/2005 | CN1198961C Article having decorative and protective multi-layer coating |
| 04/26/2005 | US6884542 Method for treating titanium to electroplating |
| 04/26/2005 | US6884523 Electronic component and method of manufacturing the same |
| 04/26/2005 | US6884335 Electroplating using DC current interruption and variable rotation rate |
| 04/21/2005 | WO2005035835A2 Workpieces coated with an aluminum/magnesium alloy |
| 04/21/2005 | WO2005014881A3 Production method of substrate with black film and substrate with black film |
| 04/21/2005 | US20050084987 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/21/2005 | US20050082259 cleaning and drying the metal or alloy surfaces, then etching to remove defects on the surface, rinsing with water and coating with corrosion inhibitors; surface treatment |
| 04/21/2005 | US20050082171 cobalt and iron alloy without a substantial drop of saturation flux density from its theoretical value; anode and cathode compartments separated by a diaphragm or salt bridge to permit electric charge transfer, but inhibit penetration of iron ions |
| 04/21/2005 | US20050081744 Electroplating compositions and methods for electroplating |
| 04/20/2005 | EP1524336A1 Workpieces coated with an aluminum magnesium alloy |
| 04/20/2005 | EP1523589A2 Electrolytic reactor |
| 04/20/2005 | CN1607990A Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 04/20/2005 | CN1198488C Electro-deposition copper foil through surface processing and its producing method and use |
| 04/20/2005 | CN1197998C Process for applying protective and decorative coating on article |
| 04/20/2005 | CN1197996C Article having coating |
| 04/20/2005 | CN1197995C Article having decorative and protective coating |
| 04/19/2005 | US6881318 Dynamic pulse plating for high aspect ratio features |
| 04/19/2005 | US6881282 Heating steel slabs to a pre-determined temperature, hot rolling to pre-determined width/thickness, spraying with water to remove scaling, pickling steel strips in acid to remove scaling, rinsing, drying the strips, cold rolling, stamping |
| 04/19/2005 | US6881234 Method for making electrodes for nickel-metal hydride batteries |
| 04/14/2005 | WO2005033798A2 Electrochemical micromanufacturing system and method |
| 04/14/2005 | WO2005033377A2 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface |
| 04/14/2005 | WO2005033376A2 Plating method and apparatus |
| 04/14/2005 | WO2005033375A2 Electrochemical fabrication methods with enhanced post deposition processing |
| 04/14/2005 | WO2005015623A3 Reduction of defects in conductive layers during electroplating |
| 04/14/2005 | US20050079368 a non-metallic oxide or nitride diffusion barrier layer overlying the substrate; and a protective coating overlying the barrier layer containing at least two platinum group metals (ptatinum or rhodium at least 40%) |
| 04/14/2005 | US20050077609 Circuit package and method of plating the same |
| 04/14/2005 | US20050077184 Method for preparing surface for obtaining surface-enhanced Raman scattering spectra of organic compounds |
| 04/14/2005 | US20050077183 Anodic oxidation apparatus, anodic oxidation method, and panel for display device |