Patents for C25D 3 - Electroplating; Baths therefor (11,896)
04/2004
04/20/2004US6724571 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles
04/20/2004US6723449 Structure and plating method of thin film magnetic head and magnetic storage apparatus
04/20/2004US6723219 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
04/15/2004WO2004007809A3 Plain bearing having an overlay alloy layer
04/15/2004WO2003085173A3 Reference electrode calibration for voltammetric plating bath analysis
04/15/2004US20040072423 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
04/15/2004US20040072419 Method for applying metal features onto barrier layers using electrochemical deposition
04/15/2004US20040069641 Thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; or mercapto-nicotinate as a compound forming a complexing compound with gold.
04/15/2004DE10246614A1 Method of making vehicle component with metallic coating from steel sheet or strip, involves coating metal from non-aqueous organic solution before cold forming, hot forming and hardening
04/14/2004EP1408141A1 Process for galvanic deposition of bronze
04/14/2004CN1488783A Rare earth chromium composite electroplating layer and preparing method and use thereof
04/14/2004CN1145718C Producing technology for copper-clad panel
04/08/2004WO2002072923A3 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
04/08/2004US20040068323 Implant and process of modifying an implant surface
04/08/2004US20040065558 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
04/08/2004US20040065551 Multilayer three-dimensional structures; using copper pyrophosphate; low temperature plating baths
04/08/2004US20040065225 Electrodeposition; using gold sulfite complex; dental molding
04/07/2004EP1405934A2 Zinc-diffused alloy coating for corrosion/heat protection
04/07/2004CN1145231C Electrode structure body, chargeable cell and its producing method
04/07/2004CN1144670C Copper foil for TAB band carrier and TAB carrier band using copper foil, and TAB band carrier
04/06/2004US6717236 Filling via with copper-rich copper-zinc alloy electroplated on copper surface from stable chemical solution, controlling zinc doping; improved interconnect reliability and corrosion resistance
04/01/2004WO2004027120A1 Dark layers
04/01/2004US20040060825 Copper-plating liquid, plating method and plating apparatus
04/01/2004US20040060728 Method for producing electroconductive structures
04/01/2004US20040060436 Removing oxygen from a copper plating solution using hollow hydrophobic fiber membranes; intrusion of solution into membrane pores is avoided
04/01/2004US20040060156 Method of manufacturing porous metal plate and electrode for alkaline storage batteries
03/2004
03/31/2004EP1403469A2 Method for selective surface protection of a gas turbine blade
03/31/2004EP1403402A1 Process for the electrolytic deposition of materials with aluminium, magnesium or alloys of aluminium and magnesium
03/31/2004EP1403401A2 Precious alloyed metal solder plating process
03/31/2004CN1485466A Process of electricity sedimentation in aqueous solution for producing rare earth magnetic film alloy material
03/25/2004WO2004025760A1 Improved fuel for a zinc-based fuel cell and regeneration thereof
03/25/2004WO2003100136A3 Alkaline zinc-nickel bath with increased current efficiency
03/25/2004WO2003060959A3 Method for applying metal features onto barrier layers using electrochemical deposition
03/25/2004US20040058189 Zinc-diffused alloy coating for corrosion/heat protection
03/25/2004US20040055889 Using ultraviolet light; joining semiconductor die to substrate; prevent short circuiting
03/25/2004US20040055877 Workpiece processor having processing chamber with improved processing fluid flow
03/25/2004DE19924895B4 Verfahren zur Herstellung einer cyanidfreien, für galvanische Gold-Bäder geeigneten Goldverbindungslösung A process for the preparation of a cyanide-free, suitable for gold electroplating baths gold compound solution
03/25/2004DE10243139A1 Alloy for decorative or functional purposes e.g. as a coating material for buttons and sliding clasp fasteners and absorbing layers in solar cells contains tin, copper, bismuth and oxidic oxygen
03/24/2004EP1400613A2 Tin plating method
03/24/2004CN1484484A Ultraconductive magnetic-field slveened room and preparation method thereof
03/24/2004CN1483857A Method for plating dense chromium
03/24/2004CN1143010C Metal foil with raised bonding capacity for base and its manufacturing method
03/23/2004US6709564 Electrodepositing copper; organic additive increases throwing power, leveling, suppresses deposition rate; copper salts increase overvoltage; copper pyrophosphate; cyanide, halide, thiocyanate, sulfamate; 2,5-dimercapto-1,3,4-thiadiazole
03/23/2004US6709563 Copper-plating liquid, plating method and plating apparatus
03/23/2004US6709562 Void-free and seamless; copper is superior to the electromigration resistance of alcu
03/23/2004CA2441718A1 Zinc-diffused alloy coating for corrosion/heat protection
03/18/2004WO2004001101A3 Electrolytic bath for the electrodeposition of noble metals and their alloys
03/18/2004US20040054231 Ionic liquids and their use
03/18/2004US20040053132 Electrochemical cells; narrow particle size distribution for improved air flow
03/18/2004US20040053077 Magnetic film and thin film magnetic head using this magnetic film
03/18/2004US20040053019 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil
03/18/2004US20040051999 Soft magnetic film and thin film magnetic head using the same
03/18/2004US20040050712 Acid dip for zinc-manganese alloy electrodeposition
03/18/2004US20040050711 Substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution
03/18/2004US20040050706 Copper electroplating method using insoluble anode
03/18/2004DE202004000597U1 Decorative metal material, e.g. for a fountain pen cap, has a black chrome layer which is plated to the metal surface and forms a bond between the substrate surface and the paint layer
03/17/2004EP1397532A1 Mixture for use as brightening agent in an electrodeposit solution of silver, gold or one of their alloys
03/17/2004EP1397530A2 Apparatus and methods for electrochemical processing of microelectronic workpieces
03/17/2004EP1272691B1 Electrolytic solution for electrochemical deposit of palladium or its alloys
03/17/2004CN1482285A Method of copper galvanization on superbig cement surface
03/17/2004CN1142327C Composition and method for electroplating low-stress nickel
03/17/2004CN1142320C Composite coating containing inorganic fullerene structure nano material and method for preparing the same
03/16/2004US6706418 For use in electroplating printed circuit boards and other electronic packaging devices
03/16/2004US6706167 Zinc and zinc alloy electroplating additives and electroplating methods
03/11/2004WO2004020697A1 Method of producing jewelry
03/11/2004WO2004020696A2 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam
03/11/2004US20040047899 Member excellent in antibacterial and/or antialgae effects and process for producing the same
03/11/2004US20040045832 Methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to
03/11/2004DE10238284A1 Verfahren zum Herstellen einer schaumförmigen Metallstruktur, Metallschaum sowie Anordnung aus einem Trägersubstrat und einem Metallschaum A method of manufacturing a foam-like metal structure, metal foam as well as arrangement of a supporting substrate and a metal foam
03/10/2004EP1396559A1 Palladium plating solution
03/10/2004CN1481283A Bond enhancement antitarnish coatings
03/10/2004CN1480564A Method for preparing rare earth alloy through sweeping electric potential sedimentation
03/10/2004CN1480563A Electrolytic copper foil and electrolytic copper foil for secondary cell collector
03/10/2004CN1141421C Water-contg. electrolyte electroplating bath for electroplating trngsten alloys, and process for deposite ductile tungsten alloys
03/10/2004CN1141420C Process for electroplating Cr onto surface of thin steel sheet
03/09/2004US6701656 Weapon barrel having a hard chromium inner layer
03/04/2004WO2003066936B1 Commercial process for electroplating nickel-phosphorus coatings
03/04/2004US20040041264 Method for alloy-electroplating group IB metals with refractory metals for interconnections
03/04/2004US20040040859 Electrodeposition of chromium; pretreatment with silver, or alloy thereof; corrosion resistance finish
03/03/2004CN1478926A Titanium base material platinum coating method
03/02/2004US6699590 Hot-dip galvanized steel sheet
03/02/2004US6699379 Method for reducing stress in nickel-based alloy plating
02/2004
02/26/2004WO2004016829A2 Electrolytic copper plating solutions
02/26/2004WO2003023395A9 Enhanced detection of metal plating additives
02/26/2004US20040038070 Fluxless brazing
02/26/2004US20040035911 Fluxless brazing
02/26/2004US20040035910 Low temperature fluxless brazing
02/26/2004US20040035714 Electrodepositing, alloying in presence of alkyl- or alkanol-sulfonic acid, free of cyanide ions, preventing tin oxidation
02/26/2004DE10257737B3 Electrolytic magnesium deposition on a substrate made from sheet metal with a zinc (alloy) coating, used in the automobile industry, using a solvent for the deposition and heat treating the coated substrate
02/26/2004CA2465363A1 Electrolytic copper plating solutions
02/25/2004EP1391538A2 Chrome plated engine valve
02/25/2004EP1390134A2 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
02/25/2004CN2604765Y Full-automatic oxygen-free copper-wire surface silver plating apparatus
02/25/2004CN1477237A Brass-plating process in alkaline solution and its electroplating solution formula
02/25/2004CN1477236A Additive component of alkaline solution for electroplating zinc-nickel alloy and brass and its preparation method
02/25/2004CN1139676C Tin-bismuth alloy electroplanting bath and electroplating method therewith
02/25/2004CN1139368C Radioactive support and its electroplanting process
02/24/2004US6694943 Cylinder for internal combustion engine and method of treating inner wall surface of the cylinder
02/19/2004US20040033366 Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
02/19/2004US20040031694 Electrolytes comprising mixtures of nickel sulfate or nickel chloride, sodium hypophosphite, boric acid, water and thiourea, used to form protective coatings having corrosion and wear resistance
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