| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 07/03/2002 | EP0975826B1 Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 07/03/2002 | EP0869867B1 Tin coated electrical connector |
| 07/03/2002 | CN1357060A Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| 07/03/2002 | CN1356407A Process for plating Cr on iner cavity of cylinder sleeve |
| 07/03/2002 | CN1356185A High-precision ultra-thin very-wide cold-rolled steel band, chrome-plated steel band for shield of optical fibre cable and technology thereof |
| 07/02/2002 | US6413405 Active carbon electro-deposited with Ag-I system having sterilizing effect |
| 07/02/2002 | US6413271 Method of making a radioactive stent |
| 06/27/2002 | WO2002049773A1 Bond enhancement antitarnish coatings |
| 06/27/2002 | WO2002026381A3 Ionic liquids and their use |
| 06/27/2002 | US20020079229 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 06/27/2002 | US20020079215 Workpiece processor having processing chamber with improved processing fluid flow |
| 06/27/2002 | US20020079133 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/25/2002 | US6410985 Silver metallization by damascene method |
| 06/25/2002 | US6410178 Separator of fuel cell and method for producing same |
| 06/25/2002 | US6410164 Antifouling member and process for producing the same |
| 06/25/2002 | US6409906 Electroplating solution for plating antimony and antimony alloy coatings |
| 06/20/2002 | WO2002049077A2 Barrier layer for electrical connectors and methods of applying the layer |
| 06/20/2002 | US20020077520 Device and method for dilating and irradiating a vascular segment or body passageway |
| 06/20/2002 | US20020074231 Bottom-up fill of recesses increasing the rotation speed of a substrate and contacting with a soluble copper salt and electrolyte until a desired thickness is achieved |
| 06/20/2002 | DE10059139A1 Acid aqueous electrolyte, used for coating electronic components with a tin-copper alloy, comprises alkyl sulfonic acids and/or alkanol sulfonic acids, soluble tin (II) salts, soluble copper (II) salts, and organic sulfur compounds |
| 06/19/2002 | EP1215305A1 Method for preparing an electroplating bath and related copper plating process |
| 06/19/2002 | EP1215304A1 Two-layer chrome-plating process |
| 06/19/2002 | EP1214739A2 Copper deposit process |
| 06/19/2002 | EP1214191A1 Treated copper foil and process for making treated copper foil |
| 06/18/2002 | US6406611 Nickel cobalt phosphorous low stress electroplating |
| 06/18/2002 | US6406609 Semiconductor wafers, dielectric layers and copper |
| 06/13/2002 | WO2002046500A2 Improvements relating to metal finishes |
| 06/13/2002 | WO2002045476A2 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 06/13/2002 | DE10058896C1 Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht Electrolytic copper bath, the use thereof and method for depositing a matt layer of copper |
| 06/12/2002 | EP1213372A2 Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process |
| 06/12/2002 | CN1353779A System for electrochemically processing workpiece |
| 06/12/2002 | CN1353778A Workpiece processor having processing chamber with improved processing fluid flow |
| 06/11/2002 | US6403235 Adhering to heat affected zone of steel a cladding of high strength precipitation or age hardenable inconel? alloy; heat treatment to concurrently soften and harden |
| 06/11/2002 | US6403234 Plated material for connectors |
| 06/11/2002 | US6402924 Programmed pulse electroplating process |
| 06/11/2002 | US6402922 Pulse plating |
| 06/11/2002 | US6402592 Electrochemical methods for polishing copper films on semiconductor substrates |
| 06/06/2002 | WO2000061838A9 Method for depositing ni-co and ni-fe-co alloys |
| 06/06/2002 | US20020066673 Method for plating copper conductors and devices formed |
| 06/06/2002 | DE10060127A1 Elektrolytisches Eisenabscheidungsbad Electrolytic Eisenabscheidungsbad |
| 06/05/2002 | EP1211011A1 Solder coating material and production method therefor |
| 06/04/2002 | US6399220 Conformable nickel coating and process for coating an article with a conformable nickel coating |
| 05/30/2002 | WO2002042519A1 Zinc-plated article free from occurrence of whisker and having rust-resistant, multi-layered film, composition for forming rust-resistant multi-layered film and method for preparing zinc-plated article free from occurrence of whisker and having rust-resistant, multi-layered film |
| 05/30/2002 | US20020064591 Substrate plating method and apparatus |
| 05/30/2002 | US20020063064 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate |
| 05/30/2002 | US20020063063 Non-cyanide-type gold-tin alloy plating bath |
| 05/29/2002 | EP0956600B1 PREPARATION OF Cu x In y Ga z Se n (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS |
| 05/29/2002 | DE10143076A1 Material für die Kupfergalvanisierung, Verfahren für dessen Herstellung und Kupfergalvanisierungsverfahren Material for the copper plating, process for its preparation and Kupfergalvanisierungsverfahren |
| 05/29/2002 | CN1351678A 合金电镀 Alloy plating |
| 05/28/2002 | US6395230 Pellistor |
| 05/23/2002 | US20020061715 Modified plating solution for plating and planarization and process utilizing same |
| 05/23/2002 | US20020060159 Chrome-plated sliding member and manufacturing method thereof |
| 05/22/2002 | EP1207730A1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| 05/22/2002 | EP1207219A1 Equipment and method for covering a metallic element with a layer of copper |
| 05/22/2002 | EP0977911A4 Preparation of copper-indium-gallium-diselenide precursor films by electrodeposition for fabricating high efficiency solar cells |
| 05/21/2002 | US6391181 Coloring, metal alloys of zinc, copper and zinc |
| 05/21/2002 | US6391179 Plating and antideposit agents |
| 05/16/2002 | WO2002038835A1 Method for the deposition of a chromium alloy |
| 05/16/2002 | WO2002038326A2 Brazing product having a low melting point |
| 05/16/2002 | US20020056649 Method of fabricating thin magnetic film and electrolytic plating apparatus for fabricating thin magnetic film |
| 05/16/2002 | US20020056644 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density |
| 05/15/2002 | EP1205582A1 Process for electrolytic deposition from a chrome containing solution |
| 05/15/2002 | EP1205577A1 Process for preparing of metallic materials for their use as electrodes |
| 05/14/2002 | US6387229 Alloy plating |
| 05/10/2002 | CA2351791A1 Preparation process of metal materials for their use as electrodes |
| 05/09/2002 | US20020053519 Seed layer repair |
| 05/09/2002 | US20020053518 Material for copper electroplating, method for manufacturing same and copper electroplating method |
| 05/09/2002 | US20020053517 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine |
| 05/08/2002 | EP1203654A2 Tin coated electrical connector |
| 05/08/2002 | EP1203110A2 Method for the production of a self-supporting copper foil |
| 05/08/2002 | CN1348326A Production method of copper foil for fine line use |
| 05/08/2002 | CN1348224A Indium plating method for copper nail as negative pole current collector of mercury-free alkali Zn-Mn battery |
| 05/08/2002 | CN1348022A Electrolyte for electrothermal film of electromolding alloy |
| 05/08/2002 | CN1084396C Silver plating bath and silver plating method with the same bath |
| 05/08/2002 | CN1084307C Glass forming mold and its producing method, and application in cathode ray tube |
| 05/07/2002 | US6383661 Method of manufacturing an aluminum product |
| 05/07/2002 | US6381893 Weapon barrel having a hard chromium inner layer |
| 05/02/2002 | US20020052292 Depositing platinum or a mixture of platinum with ruthenium on a metallic substrate from a Pt- or Pt- and Ru-containing sulfuric acid solution |
| 05/02/2002 | US20020050628 Metallization structures for microelectronic applications and process for forming the structures |
| 05/02/2002 | EP1201790A1 Seed layer |
| 05/02/2002 | EP1201789A2 Plating bath and method for electroplating tin-zinc alloys |
| 05/02/2002 | EP1200646A2 Alloy plating |
| 05/02/2002 | EP1200640A1 Coating method |
| 04/30/2002 | US6379522 Electrodeposition chemistry for filling of apertures with reflective metal |
| 04/25/2002 | WO2002033153A2 Copper bath and method of depositing a matt copper coating |
| 04/25/2002 | US20020046954 Aqueous solution for electrodepositing tin-zinc alloys |
| 04/25/2002 | DE10046600A1 Acid aqueous electrolyte, used for coating electronic components with a tin-copper alloy, comprises alkyl sulfonic acids and/or alkanol sulfonic acids, soluble tin (II) salts, soluble copper (II) salts, and organic sulfur compounds |
| 04/25/2002 | CA2419595A1 Copper bath and method of depositing a matt copper coating |
| 04/24/2002 | EP1199386A2 Plating methods and systems |
| 04/24/2002 | EP1199384A2 Plating Bath |
| 04/24/2002 | EP1199383A2 Seed layer repair bath |
| 04/24/2002 | EP1198623A1 Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths |
| 04/24/2002 | CN1083497C Nickel-ceramic compound plating technology for aluminium alloy cylinder inner wall |
| 04/23/2002 | US6375885 Methods for coating surfaces with magnetic composites exhibiting distinct flux properties |
| 04/18/2002 | WO2002031228A1 Copper electroplating using insoluble anode |
| 04/18/2002 | US20020043468 Source of metal ions, an electrolyte and one or more branched suppressor compounds comprising branched polymers, dendrimers or star polymers |
| 04/18/2002 | US20020043467 Electrolyte |
| 04/17/2002 | EP1197587A2 Seed layer repair and electroplating bath |
| 04/17/2002 | EP1197586A2 Electrolyte |
| 04/16/2002 | US6373683 Electronic parts |