| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 11/04/2004 | CA2520079A1 Composite article comprising a ceramic coating |
| 11/03/2004 | CN1542167A Non-aqueous solvent cyanogens-free gold plating solution |
| 11/03/2004 | CN1174121C Process for obtaining nano-coating with high wear-resistance and friction-reducing function |
| 11/02/2004 | US6811675 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 11/02/2004 | US6811674 Palladium plating solution |
| 11/02/2004 | US6811673 Method for electrolytic galvanizing using electrolytes containing alkane sulphonic acid |
| 11/02/2004 | US6811672 Method for forming plating film and electronic component having plating film formed theron by same method |
| 11/02/2004 | US6811671 Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed |
| 10/28/2004 | WO2004092075A1 Anti-biofilm forming structure and method of manufacturing the same |
| 10/28/2004 | US20040211673 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer |
| 10/27/2004 | EP1471347A1 Method of determining organic additives in an electroplating bath |
| 10/27/2004 | EP1470198A2 Polymer derivatives for the treatment of metals |
| 10/27/2004 | CN1540040A Reverse pulse electroplating composition and method thereof |
| 10/27/2004 | CN1173078C Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe |
| 10/26/2004 | US6808614 Sulfonic acid electrolyte; a tin compound soluble in the sulfonic acid to form a tin sulfonate; a copper compound soluble in the sulfonic acid to form a copper sulfonate; a nonionic surfactant; a satin brightener; and an antioxidant. |
| 10/21/2004 | WO2004090197A1 Electrolytic copper foil with low roughness surface and process for producing the same |
| 10/21/2004 | US20040206631 Brightener degradation inhibitor compound in copper plating bath |
| 10/21/2004 | DE10340615A1 Manufacture of biaxially textured pure metal or alloy layer useful as magnetic material involves depositing biaxially textured pure metal or alloy layer on the surface of the pure metal or alloy substrate using electroplating process |
| 10/20/2004 | CN1539029A Copper on INVAR composite and method of making |
| 10/20/2004 | CN1537978A Production method of composite photo catalytic antibacterial foamed metal |
| 10/19/2004 | US6805786 Precious alloyed metal solder plating process |
| 10/14/2004 | US20040202887 A bearing having improved an improved antiseizure overlay layer of bismuth or bismuth alloy of crystal structure, a Miller index (202) face of index of orientation of > 30% and a maximum X-ray diffraction intensity R(202); oil wetting; automobile crankshafts,connecting rods, internal combustion engines |
| 10/14/2004 | US20040200727 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 10/13/2004 | EP1467004A1 Tin alloy electroplating compositions and methods |
| 10/13/2004 | EP1467003A1 METHOD FOR FORMING Re−Cr ALLOY COATING FILM THROUGH ELECTROPLATING USING Cr(IV)−CONTAINING BATH |
| 10/13/2004 | EP1467002A1 METHOD FOR FORMING Re ALLOY COATING FILM HAVING HIGH Re CONTENT THROUGH ELECTROPLATING |
| 10/13/2004 | EP1467001A1 METHOD FOR FORMING Re COATING FILM OR Re-Cr ALLOY COATING FILM THROUGH ELECTROPLATING |
| 10/13/2004 | CN1537315A Material deposition from liquefied gas solution |
| 10/13/2004 | CN1536948A Electro plating bath used for forming film resis tance layer, resistance layer forming method, conductive substrate material having resistance layer and circuit base plate material |
| 10/13/2004 | CN1171513C Copper foil for printed circuit board and its surface treatment method |
| 10/13/2004 | CN1171325C Battery sheath made of formed cold-rolled metal sheet and method for producing battery sheaths |
| 10/13/2004 | CN1170965C Method for electro copperplating substrates |
| 10/13/2004 | CN1170963C Cyanide-free monovalent copper eletroplating solutions |
| 10/07/2004 | US20040197661 Metallic separtor for fuel cell and production method for the same |
| 10/07/2004 | US20040196593 Magnetic material, magnetic recording medium, magnetic recording/reproducing apparatus, information processing apparatus, and method for manufacturing the magnetic material |
| 10/07/2004 | US20040195107 Includes aldehyde additive; faster electrodeposition; reduced contact resistance; high current density |
| 10/07/2004 | US20040195105 Using pure metal or alloy as cathode; high misorientation on plane formed by a-axis and b-axis |
| 10/06/2004 | CN1534112A Device for avoiding hole forming on electroplating deposited copper film and its use method |
| 10/06/2004 | CN1170010C Copper plated material, its manufacturing method and method for copper plating |
| 10/05/2004 | US6800399 Nickel foil; three-dimensional |
| 10/05/2004 | US6800190 Forming light polarizing thin films; using nontoxic electrolyte such as nickel sulfate, ammonium chloride, zinc lactate, sodium thiocyanate and sodium lactate in water |
| 10/05/2004 | US6800188 Reaction product of amines with glycidyl ether or quaternary ammonium compound |
| 10/05/2004 | US6799832 Orifice that extends through the plate between the inner surface and outer surface, coated with the precious metal-polymer alloy. |
| 09/30/2004 | US20040188267 corrosion resistance protective coating; lamination rare eath magnet with nickel sulfide in plating bath |
| 09/30/2004 | US20040187731 Bath contains carrier; water soluble, mercapto-containing organic brightener; and leveling agent; semiconductor connectors |
| 09/30/2004 | DE19953318B4 Chromplattierte Teile und Chromplattierungsverfahren Chrome plated parts and chromium-plating |
| 09/29/2004 | EP1461815A1 Material deposition from a liquefied gas solution |
| 09/29/2004 | EP1461471A2 Polymer derivatives for treating metals |
| 09/29/2004 | CN1533686A Flexible printed wiring board for chip-on-film |
| 09/28/2004 | US6797415 Cobalt-nickel-iron alloy thin film and method of forming the same, and thin-film magnetic head and method of manufacturing the same |
| 09/28/2004 | US6797409 Electrodeposition process and a layered composite material produced thereby |
| 09/28/2004 | US6797146 Contacting with an electroplating bath of a source of metal ions, an electrolyte comprising two or more acids, and additives |
| 09/28/2004 | US6797142 Tin plating |
| 09/23/2004 | WO2004080887A1 Three dimensional mecrofabrication |
| 09/23/2004 | WO2004044269A3 Brightener additive and bath for alkaline cyanide-free zinc electroplating |
| 09/23/2004 | DE10340197B3 Process for electrochemical separation of metals from an electrolyte containing the metal ions to be separated and indium ions useful in separation of metal ions from electrolytes with decreased hydrogen build up at the electrodes |
| 09/22/2004 | EP1460150A1 Method for fabricating bismuth thin film and device using said film |
| 09/22/2004 | EP1459644A1 Decorative article having white coating and method for manufacture thereof |
| 09/22/2004 | EP1458908A1 A tubular member having an anti-galling coating |
| 09/22/2004 | CN1530470A Tin-plating method |
| 09/22/2004 | CN1530469A High efficient copper foil and producing method thereof |
| 09/22/2004 | CN1530464A Method for producing molded goods plating |
| 09/22/2004 | CN1168125C Copper deposit process |
| 09/21/2004 | US6794063 The lower/upper magnetic core contains an alloy of cobalt, nickel and/or iron; crystal grains of the thin film magnetic head having a grain size gradient, smaller in the center than at the surface; large coercive force; recording media |
| 09/21/2004 | US6793796 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film |
| 09/21/2004 | US6793795 Utilizing ferrous and/or ferric salts and dimensionally stable insoluble anodes; full surface uniform deposition; rapidly and completely filling small width and diameter recesses; avoiding gas or liquid inclusions |
| 09/21/2004 | US6793793 High reactability; reduced generation of liquid waste; eliminates electrode cleaning |
| 09/16/2004 | WO2004079055A1 Method for producing rare-earth permanent magnet and metal plating bath |
| 09/16/2004 | WO2004079054A1 Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents |
| 09/16/2004 | US20040180225 Peel strength enhancement of copper laminates |
| 09/16/2004 | US20040179309 magnetoresistance at room temperature; spintronics device; very fast film growth speed in the electrodepositing method, and a thickness of a Bi thin film can be controlled easily in the sputtering method |
| 09/16/2004 | US20040178078 Electroplated copper interconnection structure, process for making and electroplating bath |
| 09/16/2004 | US20040178077 providing a highly reliable copper interconnect structure suitable for wiring in integrated circuit chips with at least substantially, if not entirely, void-free seamless conductors |
| 09/16/2004 | CA2517977A1 Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents |
| 09/15/2004 | CN1528955A Nano carbon tube composite electroplating zinc film preparing method |
| 09/15/2004 | CN1528954A Nano Multi-layer zinc film electroplating preparation method |
| 09/15/2004 | CN1166815C Electrogalvanized steel sheet with light tone |
| 09/15/2004 | CN1166479C Electroplated diamond polycrystal saw blade and its production process |
| 09/15/2004 | CN1166411C Process for preparation of broad-spectrum antibacterial compound coating |
| 09/14/2004 | US6790776 Barrier layer for electroplating processes |
| 09/14/2004 | US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
| 09/14/2004 | US6790332 Ia/ic ratio is 1-1.5, and wherein a charge ratio qa/qc=taia/tcic of charge qa, transported during an anode pulse of duration ta, to a charge qc, transported during a cathode pulse of duration tc, is 30-45. |
| 09/14/2004 | CA2225825C Roll forming structural steel profiles with galvanised coating |
| 09/09/2004 | US20040175582 Coated foil resists laser ablation, thereby resisting piercing of the foil by the laser during drilling; adhesion of the copper foil layer to the dielectric substrate |
| 09/09/2004 | US20040174633 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
| 09/09/2004 | US20040173468 electroplating solution includes a mixture of soluble metallic salts and organic additives dissolved in a non-aqueous non-aromatic organic solvent |
| 09/09/2004 | US20040173465 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
| 09/08/2004 | EP1455005A2 Copper foil for high frequency circuit and method of producing of same |
| 09/08/2004 | EP1292724A4 Zinc-nickel electroplating |
| 09/08/2004 | CN1527892A Method for producing plated molded product |
| 09/08/2004 | CN1526856A Continuous nickel plating process for stainless steel wire |
| 09/08/2004 | CN1526855A Continuous fine metal wire nickel plating apparatus |
| 09/08/2004 | CN1165639C Sn-In alloy electroplating liquid and its preparing method |
| 09/07/2004 | US6786624 Forming corrosion and heat resistant nickel-chromium-iron alloy into metal cup and/or connector; electropolishing; discoloration inhibition, durability |
| 09/03/2004 | CA2458078A1 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
| 09/02/2004 | WO2004074550A1 ELECTROLYTE FOR NANOCRYSTALLINE Fe-Ni ALLOYS WITH LOW THERMAL EXPANSION |
| 09/02/2004 | WO2004074537A1 Surface-coating method |
| 09/02/2004 | WO2004053182A3 Nodular nickel boron coating |
| 09/02/2004 | US20040170857 Having a blackened surface with a uniform hue and no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, and high in transmittancel; for a plasma display panel |
| 09/02/2004 | US20040169959 Structure and plating method of thin film magnetic head and magnetic storage apparatus |