| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 11/24/2005 | US20050258047 Process for electrochemical deposition of tantalum and an article having a surface modification |
| 11/23/2005 | EP1598448A1 Lead-free bump and method for forming the same |
| 11/23/2005 | CN1701137A Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti |
| 11/23/2005 | CN1228868C Method for mfg. foamed metal substrate and electrode for alkali battery |
| 11/22/2005 | CA2115062C Acid bath for the galvanic deposition of copper, and the use of such a bath |
| 11/17/2005 | WO2005108651A2 Method for production of a coating and anode used in such a method |
| 11/17/2005 | WO2005108650A1 Methods and apparatus for determining organic component concentrations in an electrolytic solution |
| 11/17/2005 | WO2005108648A2 Production of a structured hard chromium layer and production of a coating |
| 11/17/2005 | US20050252783 Electroplating solution for gold-tin eutectic alloy |
| 11/17/2005 | US20050252780 Seeding a magnetic layer alloy of nickel, iron, and/or cobalt ; removing portion to define a feature; depositing nonmagnetic conductive layer of tantalum or rhodium; forming cavities; electroplating |
| 11/17/2005 | US20050252778 Finely patterned, excellent elongation and tensile strength at normal and high temperatures; amine is a glycerol derivative with terminal tertiary amine groups and pendant hydroxy groups or an endcapped polyethylene glycol or poly(1,2-propylene glycol); bis(alkylenesulfonic or phosphonic acid) disulfides |
| 11/17/2005 | US20050252583 Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper film |
| 11/16/2005 | EP1595001A1 Surface-coating method |
| 11/15/2005 | CA2249073C Process for increasing the oxidation and corrosion resistance of a superalloy part, and superalloy part obtained by this process |
| 11/10/2005 | US20050250327 Copper plating of semiconductor devices using intermediate immersion step |
| 11/10/2005 | US20050249967 Tin plating method |
| 11/09/2005 | EP1592825A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 11/09/2005 | CN1694603A Electrolytic gold plating method of printed circuit board |
| 11/09/2005 | CN1226468C Rare earth chromium composite electroplating layer preparing method |
| 11/09/2005 | CN1226465C Method for producing and using compound additives used in electric deposition to level and polish metal |
| 11/09/2005 | CN1226464C Method for plating dense chromium |
| 11/03/2005 | WO2005103340A1 Composite foil, method for producing same, current collector using such composite foil, electrode for nonaqueous electrolyte secondary battery, and nonaqueous electrolyte secondary battery |
| 11/03/2005 | WO2005065430A3 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
| 11/03/2005 | US20050245083 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 11/03/2005 | US20050241954 Electrolytic gold plating method of printed circuit board |
| 11/03/2005 | US20050241953 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying tin sensitizer, rinsing, then palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin |
| 11/03/2005 | US20050241948 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
| 11/03/2005 | US20050241946 electrodeposition of copper or silver; for filling fine interconnect recesses such as trenches and via holes in semiconductor substrate with uniform coatings; control the movement of the conductive layer and the porous member relatively to each other without passing electric current |
| 11/02/2005 | EP1591563A1 Tin-containing plating bath |
| 11/02/2005 | EP0776385B1 High fatigue ductility electrodeposited copper foil |
| 11/02/2005 | CN1692182A Electrolytic silver plating solution |
| 11/02/2005 | CN1690253A Electrolyte for copper plating |
| 11/02/2005 | CN1225571C Zn-Co-W alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 11/01/2005 | US6960677 reacting sodium potassium alloy and a trihydrocarbylaluminum compound, giving sodium/potassium tetrahydrocarbylaluminate salts; can be solvent-free at low temperatures; |
| 11/01/2005 | US6959853 aluminum-silicon clad aluminum brazing sheet composites; physical vapor deposition and layered sequencing of a metal substrate, eutectic-forming layer and braze-promoting layer; plasma or ion-cleaning minimizes environmental impact |
| 10/27/2005 | WO2005100641A1 Method for imparting excellent resistance to hydrogen to article and article exhibiting excellent resistance to hydrogen |
| 10/27/2005 | US20050236274 Methods and apparatus for determining organic component concentrations in an electrolytic solution |
| 10/26/2005 | EP1520063B1 Bath for gold electrodeposition |
| 10/26/2005 | CN1687486A Method for plating hard chromium on surface of metallic material |
| 10/25/2005 | US6958113 Plating apparatus and plating method |
| 10/20/2005 | WO2005098095A1 Method for preparing multi-component alloy onto substrate by molten salt electrolysis |
| 10/20/2005 | US20050230264 Electroplating solution and method for electroplating |
| 10/20/2005 | US20050230263 Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
| 10/19/2005 | CN1685087A Method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys |
| 10/19/2005 | CN1223707C Sn-Cu alloy electroplating bath |
| 10/13/2005 | WO2005095667A1 Chromium plating |
| 10/13/2005 | US20050224358 Method for improved local planarity control during electropolishing |
| 10/13/2005 | US20050224340 System for electrochemically processing a workpiece |
| 10/12/2005 | EP1292724B1 Zinc-nickel electroplating |
| 10/12/2005 | CN2732766Y Durionising device capable of saving electric energy and equipment accessory |
| 10/12/2005 | CN1681967A Non-cyanide copper plating process for zinc and zinc alloys |
| 10/12/2005 | CN1680630A Technology of non-cyanide silver coating |
| 10/12/2005 | CN1680629A Electrolyte used for copper electroplate and method for electroplating metal to an electroplated surface |
| 10/06/2005 | WO2005093134A2 Iron-phosphorus electroplating bath and method |
| 10/06/2005 | WO2005093133A1 Baths, systems and processes for electroplating zinc-nickel ternary and higher alloys and articles so electroplated |
| 10/06/2005 | WO2005093132A1 Polyamine brightening agent |
| 10/06/2005 | WO2005075696A3 Low-carbon steel wire with nickel sub coating |
| 10/06/2005 | CA2554611A1 Baths, systems and processes for electroplating zinc-nickel ternary and higher alloys and articles so electroplated |
| 10/05/2005 | CN1678428A Brazing product and method of manufacturing a brazing product |
| 10/05/2005 | CN1677232A Method for making metal picture |
| 10/05/2005 | CN1676674A Method for preparing nickel-phosphor alloy base composite cladding containing nano particle |
| 10/05/2005 | CN1676673A Brightening agent for cyanogen-free silver-plating and its preparing method |
| 10/05/2005 | CN1676672A Electrochemical electroplating electrolyte and method for electroplating surface of metal |
| 10/01/2005 | CA2503320A1 Methods for the fabrication of gold-covered magnetic nanoparticles |
| 09/29/2005 | WO2005090646A1 Tin plating electrolyte composition and method for electroplating surfaces with tin |
| 09/29/2005 | US20050211564 Method and composition to enhance wetting of ECP electrolyte to copper seed |
| 09/29/2005 | US20050211563 stabilizer selected from sodium citrate, potassium citrate or ammonium citrate, for increasing the stability of metal electrodeposition |
| 09/29/2005 | US20050211562 Electroplating a thin dense chromium layer by immersing in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics; electrochemistry |
| 09/29/2005 | US20050211561 plating solutions comprising a mixture of copper sulfate, sulfuric acid, chlorine ions and adjuvants comprising a leveling agent and a brighteners, capable of forming the upper face of via-hole and conductor circuit in the same layer in approximately the same plane at the time of manufacturing circuits |
| 09/29/2005 | US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/28/2005 | EP1580304A1 Tin plating electrolyte composition and method for electroplating surfaces with tin |
| 09/28/2005 | EP1579031A1 Peel strength enhancement of copper laminates 102426-201 |
| 09/28/2005 | CN1220796C Process for plating Cr on inner cavity of cylinder sleeve |
| 09/22/2005 | US20050209117 (Electro)chemical deposition of copper, nickel, zinc or gold; electrolytic cleaning of soft steels; solution of carboxymethylated polyethyleneimine sodium salt, dispersants, inorganic transition metal compound, inorganic acid or base, and metal oxide or salt; improved corrosion resistance; nontoxic |
| 09/22/2005 | US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces |
| 09/22/2005 | US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/21/2005 | EP1576660A1 Method of producing thin films of compound i-iii-vi, promoting the incorporation of iii elements in the film |
| 09/21/2005 | EP1576208A2 Brightener for zinc-nickel plating bath |
| 09/21/2005 | EP1576203A2 Reduction of surface oxidation during electroplating |
| 09/21/2005 | EP1268347B8 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
| 09/21/2005 | CN1670260A Conductor roll restoring method |
| 09/21/2005 | CN1670259A Additive for plating bath |
| 09/20/2005 | US6946065 cathodic polarization; vapor deposition; bottom-up filling of trenches/vias within sidewalls to avoid production of seams/voids; for production of integrated circuits |
| 09/15/2005 | US20050202272 High bond strength interlayer for rhenium hot gas erosion protective coatings |
| 09/15/2005 | US20050202180 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
| 09/15/2005 | US20050200260 Electrically conductive polycrystalline diamond and particulate metal based electrodes |
| 09/15/2005 | US20050199507 Chemical structures and compositions of ECP additives to reduce pit defects |
| 09/15/2005 | US20050199506 Electrolyte deposits tin/alloy film on composite substrate |
| 09/15/2005 | CA2500921A1 Solution for the electroplating of soft magnetic co-fe-ni alloys |
| 09/15/2005 | CA2461107A1 Solution for the electroplating of soft magnetic co-fe-ni alloys |
| 09/14/2005 | EP1574599A1 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 09/14/2005 | EP1573091A1 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 09/14/2005 | EP1509641B1 Method for producing organoaluminium complexes and the use thereof for producing electrolyte solutions for the electrochemical deposition of aluminium-magnesium alloys |
| 09/09/2005 | WO2005083156A1 Non-cyanide silver plating bath composition |
| 09/09/2005 | WO2005081657A2 Laser ablation resistant copper foil |
| 09/09/2005 | WO2005017971A9 Nanomachined and micromachined electrodes for electrochemical devices |
| 09/08/2005 | US20050194259 conductive particles applied to substrate in such a manner that they are in mechanical and therefore also electrical contact with one another over the entire surface of the substrate. Consequently, it is possible to generate a homogenous i.e. completely continuous, metal layer |
| 09/08/2005 | US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/07/2005 | EP1570115A2 Method for the electrolytic deposition of magnesium on galvanised sheet metal |
| 09/07/2005 | CN2722643Y Iron plate roasting device with chromium plated roasting plate |