| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 11/18/2003 | CA2287179C Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 11/13/2003 | WO2003092911A1 Minimizing whisker growth in tin electrodeposits |
| 11/13/2003 | WO2003066936A3 Commercial process for electroplating nickel-phosphorus coatings |
| 11/13/2003 | WO2002063070A8 Nickel cobalt phosphorous low stress electroplating |
| 11/13/2003 | US20030209446 Method for enhancing the solderability of a surface |
| 11/12/2003 | EP1360347A2 Method for producing plated molded product |
| 11/12/2003 | EP1360346A2 Acid dip for zinc-manganese alloy electrodeposition |
| 11/12/2003 | CN1455947A Substrate processing apparatus |
| 11/12/2003 | CN1455026A Combined-box alloy plating process of continuous casting crystallizer copper plate |
| 11/12/2003 | CN1127582C Method for chemical plating nickel and then over plating hard chromium on metallic material |
| 11/06/2003 | US20030207135 Dispersion for electrodeposition which has excellent shelf life and can form thin, high dielectric constant films, as well as a high dielectric constant film formed from the aqueous dispersion and electronic parts provided with the high |
| 11/06/2003 | US20030206852 Nickel-rich quaternary metal oxide materials as cathodes for lithium-ion and lithium-ion polymer batteries |
| 11/06/2003 | US20030205478 Object plating method and system |
| 11/06/2003 | US20030205474 Plating solution containing up to about 0.4M of supporting electrolyte. |
| 11/06/2003 | CA2406764A1 High temperature lighting bulb shield |
| 11/05/2003 | EP1357989A1 Process for degassing an aqueous plating solution |
| 11/05/2003 | CN1126827C Process for producing iron-chromium-silicon coating layer on carbon steel surface |
| 11/04/2003 | US6641710 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density |
| 10/30/2003 | WO2003029779A3 Improved method for analysis of three organic additives in an acid copper plating bath |
| 10/30/2003 | US20030201188 Mixture of acid, tin compound and surfactant; determination crystal orientation |
| 10/30/2003 | US20030201187 Gas liquid phase separator with improved pressure control |
| 10/29/2003 | EP1356136A1 Method for producing electrical conductors, a solar collector, an electrochemical cell and use of conductors produced in this way |
| 10/29/2003 | EP1355745A1 Bond enhancement antitarnish coatings |
| 10/28/2003 | US6638411 Method and apparatus for plating substrate with copper |
| 10/23/2003 | WO2003087433A1 Platinum electrode and method for manufacturing the same |
| 10/23/2003 | WO2002055568A3 Use of polyolefins with alkaline, aromatic substituents as auxiliaries in the electrolytic deposition of metal layers |
| 10/23/2003 | US20030197050 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 10/23/2003 | US20030196906 Can be used for ceramic composite materials; comprising nickel ions and at least two chelating agents selected from aminopolycarboxylic acids, polycarboxylic acids, and polyphosphonic acids |
| 10/23/2003 | DE29924530U1 Alkaline zinc-nickel galvanic bath for producing zinc-nickel coatings has an ion exchange membrane separating the anode from the alkaline electrolyte |
| 10/22/2003 | EP1354077A1 Method for the continuous deposition of a nickel-containing coating on a metallic film |
| 10/22/2003 | CN1125194C High-tensile electrolytic copper foil process for producing the same |
| 10/21/2003 | US6635165 Plating surfaces by precipitating corrosion and wear resistance alloy coatings comprising nickel, cobalt, tungsten and phosphorus, from electrolytic cells |
| 10/16/2003 | WO2003085713A1 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects |
| 10/16/2003 | WO2003085173A2 Reference electrode calibration for voltammetric plating bath analysis |
| 10/16/2003 | US20030192785 Zinc and zinc alloy electroplating additives and electroplating methods |
| 10/16/2003 | US20030192784 Platinum electrode and method for manufacturing the same |
| 10/15/2003 | EP1352110A1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method |
| 10/15/2003 | CN1449453A A surface-treated steel wire for reinforcing structures for articles of manufacture made of elastomeric material and an article of manufacture |
| 10/15/2003 | CN1448544A Surface protection technique for NdFeB permanent magnet material |
| 10/15/2003 | CN1448543A Environment-friendly type zinc-plating bath |
| 10/14/2003 | US6632542 Nanostructured layer covered by sol-gel film; low thermal emissivity for infrared radiation; protected from mechanical, thermal, and environmental degradation |
| 10/09/2003 | WO2003083182A2 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths |
| 10/09/2003 | WO2003083171A1 Conversion coating solution |
| 10/09/2003 | US20030189082 Alloy composition and method for low temperature fluxless brazing |
| 10/09/2003 | US20030188977 Voltammetric reference electrode calibration |
| 10/09/2003 | US20030188974 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects |
| 10/07/2003 | US6630060 Device for carrying out an electro-chemical treatment |
| 10/02/2003 | WO2003080896A1 High speed acid copper plating |
| 10/02/2003 | US20030183533 Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 10/02/2003 | US20030183532 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and |
| 10/02/2003 | US20030183528 Combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing |
| 10/02/2003 | US20030183527 Electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of |
| 10/01/2003 | EP1348320A1 Method for producing electroconductive structures |
| 10/01/2003 | EP1112125A4 Metallization structures for microelectronic applications and process for forming the structures |
| 10/01/2003 | CN1446272A Method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 09/30/2003 | US6627329 Bonding layer is the product of gold plating with a thiol which in turn interacts with lubricant |
| 09/25/2003 | WO2003078698A1 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it |
| 09/25/2003 | WO2003078686A1 Non-cyanide copper plating process for zinc and zinc alloys |
| 09/25/2003 | US20030180621 Creating concave/convex parts on nickel foil, filling with active material, then rolling/pressing to form electrode |
| 09/25/2003 | US20030178318 Dipping into nickel-/iron- sulfamate, phosphorous acid, and buffer solution under electric current density; for use in nuclear power plants |
| 09/25/2003 | US20030178314 Electrolytic bath comprises chromium-/nickel-/iron-chloride, and coumarin leveling agent to enhance brightness, which is subjected to electric current to deposit metals as coating while in turbulent contact with said bath |
| 09/24/2003 | EP1346084A1 Zn-co-w alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 09/24/2003 | EP1171239B1 Method for producing a catalyst |
| 09/24/2003 | CN1444258A Reducing defect in electrodeposited copper used in semiconductor |
| 09/24/2003 | CN1122119C Method and appts. for metal layer by electrolytic deposition |
| 09/24/2003 | CN1122118C Method of making iron alloy electroplated aluminium or alaminium alloy materials, and said aluminium or aluminium alloy |
| 09/23/2003 | US6623886 Oxidation of a hydroxide into composite oxide |
| 09/18/2003 | WO2003076695A1 Gold plating solution and method for gold plating |
| 09/18/2003 | WO2002068728A8 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/17/2003 | EP1344850A1 Alkaline zinc-nickel bath |
| 09/17/2003 | EP1343924A2 Improvements relating to metal finishes |
| 09/17/2003 | CN1443254A Zinc and Zinc alloy electroplating additives and electroplating methods |
| 09/17/2003 | CN1442510A Non-cyanide gold imitation electro plating method of flowers and plants |
| 09/17/2003 | CN1121513C Copper zinc electroplating bath copper foil for printed wiring board and method of surface treatment thereof |
| 09/16/2003 | US6620304 Bath system for galvanic deposition of metals |
| 09/11/2003 | US20030168347 Providing substrate with a low emissivity surface; depositing a nanostructured selective absorption layer atop low emissivity surface; applying a sol-gel precursor overcoating to absorption layer; curing sol-gel precursor overcoating |
| 09/11/2003 | US20030168343 Defect reduction in electrodeposited copper for semiconductor applications |
| 09/11/2003 | US20030168341 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
| 09/10/2003 | EP1342817A2 Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| 09/10/2003 | EP1342816A2 Tin plating method |
| 09/10/2003 | EP1341951A2 Copper bath and method of depositing a matt copper coating |
| 09/10/2003 | CN1441087A Nickel electric plating liquid |
| 09/10/2003 | CN1441086A Nickel electric plating liquid |
| 09/10/2003 | CN1120902C Method for producing layered material for sliding bearings and electroplating bath for carrying out this method |
| 09/04/2003 | US20030164302 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal |
| 09/03/2003 | EP1340839A1 Whiskerless galvanized product having multi-layer rust prevention film, composition for forming multi-layer rust prevention film and manufacturing method of whiskerless galvanized product having multi-layer rust prevention film |
| 09/03/2003 | EP0839139B1 Hydrophobic ionic liquids |
| 09/03/2003 | CN1439745A One sided platinizing refractory metal plate and preparation for extended metal grid |
| 09/02/2003 | US6613451 Metallic material |
| 09/02/2003 | CA2156407C Process and arrangement for the electrolytic deposition of metal layers |
| 08/28/2003 | WO2003071001A1 Electroplating solution containing organic acid complexing agent |
| 08/28/2003 | WO2003046260A3 Electrolysis bath for electrodepositing silver-tin alloys |
| 08/28/2003 | WO2002064862A3 Method for producing plated molded product |
| 08/28/2003 | US20030159941 Oxidation resistance |
| 08/28/2003 | US20030159940 Satin-finished nickel or nickel alloy coating |
| 08/28/2003 | US20030159939 Solder electroplating bath including brighteners having reduced volatility |
| 08/28/2003 | US20030159938 Electroplating solution containing organic acid complexing agent |
| 08/27/2003 | CN1438678A High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate |
| 08/27/2003 | CN1119435C A surface-treated metal wire for use in the realization of reinforcement structures for manufactured products in elastomer material |
| 08/26/2003 | US6610192 Reducing overplating in a copper layer of an integrated circuit device using at least one leveling agent, a reaction product of an amine with an epihalohydrin |