| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 04/16/2002 | US6372118 Ni-Fe-Co electroplating bath |
| 04/16/2002 | US6372117 Bright tin-copper alloy electroplating solution |
| 04/10/2002 | EP1194616A1 Copper replenishment technique for precision copper plating system |
| 04/10/2002 | EP1194614A1 Process for the deposition of a silver-tin alloy |
| 04/10/2002 | EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 04/09/2002 | US6368966 Addition of zinc to copper in very low quantities assists in solving the diffusion and self-passivation problems, |
| 04/04/2002 | WO2002026701A2 Ionic liquids and their use as solvents |
| 04/04/2002 | WO2002026381A2 Ionic liquids and their use |
| 04/04/2002 | US20020038765 Electrochemical cells and an interchangeable |
| 04/04/2002 | DE10045991A1 Ternäre Zinn-Zink-Legierungen, galvanische Bäder und galvanisches Verfahren zur Erzeugung von ternären Zinn-Zink-Legierungsschichten Ternary tin-zinc alloy electroplating baths and galvanic method for generating ternary tin-zinc alloy layers |
| 04/03/2002 | EP1192298A2 System for electrochemically processing a workpiece |
| 04/03/2002 | EP1192297A1 Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| 04/03/2002 | EP1105554B1 Surface treatment of steel |
| 04/03/2002 | CN1342787A Copper plated material, its manufacturing method and method for copper plating |
| 04/02/2002 | US6365031 Process control |
| 04/02/2002 | US6365029 Sputtering electroconductive material on dielectric; forming photoresist pattern |
| 03/28/2002 | WO2002024979A1 Electrolyte and method for depositing tin-copper alloy layers |
| 03/28/2002 | US20020036145 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
| 03/28/2002 | US20020036144 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same |
| 03/27/2002 | EP1191615A2 A battery container and surface treated steel sheet for battery container |
| 03/27/2002 | EP1191129A2 Metal plating method |
| 03/27/2002 | EP1190118A1 Bath system for galvanic deposition of metals |
| 03/27/2002 | CN1341405A Radioactive support and its electroplanting process |
| 03/21/2002 | WO2002022913A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 03/21/2002 | WO2001066830A3 Method for applying a metal layer to a light metal surface |
| 03/21/2002 | US20020034676 Method of fabricating catalyzed porous carbon electrode for fuel cell |
| 03/21/2002 | US20020033342 Forming chip connectors; electrolytic cells |
| 03/21/2002 | US20020033341 Immersion in electrolytic cell |
| 03/20/2002 | CN1341164A Electrolytic copper foil |
| 03/20/2002 | CN1340870A Non-sintered thin electrode for battery, battery using said electrode and its manufacture method |
| 03/19/2002 | US6358392 Bismuth thin films structure and method of construction |
| 03/14/2002 | US20020031684 Lead-free; copper alloy |
| 03/14/2002 | DE10043865A1 Verfahren zur Herstellung eines Katalysators A process for the preparation of a catalyst |
| 03/13/2002 | CN1339620A Gold electroplatic method for flowers |
| 03/12/2002 | US6355366 Exposing cleaned and activated workpiece to galvanic chromium plating bath to form a plating of hard chromium, filling and smoothing beaded or columnar structured surface by applying lubricant based on molybdenum disulfide, exposing |
| 03/12/2002 | US6355363 For holding open lumina |
| 03/12/2002 | US6355166 Magnetically enhanced composite materials and methods for making and using the same |
| 03/12/2002 | US6355154 Article plated with boron carbide in a nickel-phosphorus matrix, and process and bath for its preparation |
| 03/12/2002 | US6355153 Chip interconnect and packaging deposition methods and structures |
| 03/12/2002 | US6354916 Modified plating solution for plating and planarization and process utilizing same |
| 03/07/2002 | WO2001059185A3 Pre-plate treating system |
| 03/07/2002 | US20020027083 For the electrochemical reduction of organic compounds |
| 03/07/2002 | US20020027081 For forming copper interconnects by plating a semiconductor substrate with copper to fill copper in fine recesses for interconnects formed in the surface of substrate |
| 03/06/2002 | EP1185153A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185152A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185151A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185150A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1184922A2 Non-sintered type thin electrode for battery, battery using same and process for same |
| 03/06/2002 | EP1184165A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/06/2002 | EP1184079A2 Electrochemical process for producing a catalyst |
| 02/28/2002 | WO2002016673A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| 02/28/2002 | US20020025475 Nickel foil; three-dimensional |
| 02/28/2002 | DE10039171A1 Kathode für Elektrolysezellen Cathode for electrolysis cells |
| 02/27/2002 | EP1182278A2 Manufacturing method of electrodeposited copper foil and electrodeposited copper foil |
| 02/27/2002 | CN1337475A Method for making electrodeposited cooper foil and electrodeposited cooper foil |
| 02/26/2002 | US6350543 Manganese-rich quaternary metal oxide materials as cathodes for lithium-ion and lithium-ion polymer batteries |
| 02/26/2002 | US6350366 Uniform coatings on substrates and to provide substantially defect free filling of small features |
| 02/21/2002 | WO2002015297A2 Electrochemical cells and an interchangeable electrolyte therefore |
| 02/21/2002 | DE10026680C1 Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten Electrolyte and process for deposition of tin-silver alloy layers, and use of the electrolyte |
| 02/20/2002 | CN1337064A Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 02/19/2002 | US6348138 Electroplating device for electroplating a work by rotation |
| 02/14/2002 | WO2002012595A1 Method of reducing a band mark of an electroplating steel sheet |
| 02/14/2002 | US20020017395 Copper foil for printed circuit boards and its surface treatment method |
| 02/13/2002 | EP1179612A1 Cathode for electrolytic cells |
| 02/13/2002 | EP0907767B1 Cyanide-free electroplating bath for deposition of gold and gold alloys |
| 02/13/2002 | CN1335418A Electronic element, method for producing electronic element and circuit board |
| 02/12/2002 | US6346222 Activating palladium, contacting with excess nitrate solution to make palladium nitrate, distilling at temperature below or equal to 115 degrees c., adding palladium sulfate, adding ammonium hydroxide to make palladium tetraammine sulfate |
| 02/12/2002 | US6346181 Electroplating process for preparing a Ni layer of biaxial texture |
| 02/07/2002 | US20020015856 Bearing material |
| 02/07/2002 | US20020015833 Tensile strength; elongation |
| 02/07/2002 | US20020014414 Adding an effective performance enhancing amount of a salt of an alkyl and/or alkanol sulfonic acid to bath |
| 02/07/2002 | DE10035280A1 Aprotic electrolyte mixture used for electrochemically depositing metals contains an electron pair acceptor for producing an electron donator-acceptor complex, a metal source, and an aprotic solvent |
| 02/05/2002 | US6344129 Method for plating copper conductors and devices formed |
| 02/05/2002 | US6344128 Nickel-iron alloy electroplating bath comprising nickel chloride; ferrous ammonium sulfate; saccharin and naphthalenetrisulfonic acid. |
| 02/05/2002 | CA2093924C Acid bath for copper plating |
| 01/31/2002 | WO2002008497A1 Zinc and zinc alloy electroplating additives and electroplating methods |
| 01/31/2002 | US20020012821 Gradient interface magnetic composites and methods therefor |
| 01/31/2002 | US20020012811 Pretreatment, brazing aluminum, or alloy thereof |
| 01/31/2002 | US20020011673 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 01/31/2002 | US20020011418 Method for surface treatment of copper foil |
| 01/31/2002 | US20020011416 Plating solution is mixture od copper salt and polyether |
| 01/30/2002 | EP1175518A1 Alloy coating of cast iron |
| 01/29/2002 | US6342308 Copper foil bonding for printed circuits |
| 01/29/2002 | US6342148 Tin electroplating bath |
| 01/29/2002 | US6342147 Iron plating on metal surface |
| 01/29/2002 | CA2164049C Article having a decorative and protective coating simulating brass |
| 01/24/2002 | US20020008037 System for electrochemically processing a workpiece |
| 01/24/2002 | US20020008034 Using alkaline electrolyte bath; uniform overcoatings |
| 01/24/2002 | DE10033934A1 Galvanic formation of conducting structures of highly pure copper on semiconductor substrates used in the production of integrated circuits uses a copper bath contains a copper ion source, and an additive compound |
| 01/24/2002 | DE10033433A1 Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten Process for the electrolytic galvanizing of alkanesulfonic acid electrolyte |
| 01/23/2002 | EP1173626A1 Hydrometallurgical processing of lead materials in the presence of fluotitanate compounds |
| 01/23/2002 | CN1332270A Composite coating containing nanometer inorganic fullerene material and its prepn |
| 01/22/2002 | US6340423 Hydrometallurgical processing of lead materials using fluotitanate |
| 01/22/2002 | US6340422 Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 01/17/2002 | WO2002004714A1 Electrolytic copper-plated r-t-b magnet and plating method thereof |
| 01/17/2002 | WO2001051688A3 Electrolyte for use in electrolytic plating |
| 01/17/2002 | WO2001020647A3 Novel chip interconnect and packaging deposition methods and structures |
| 01/17/2002 | US20020006550 Composite oxide comprising lithium, manganese, nickel, cobalt and aluminium; high capacity and stability; low cost |
| 01/17/2002 | DE10061186C1 Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
| 01/16/2002 | EP1171239A1 Method for producing a catalyst |