| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 12/18/2002 | CN1385556A Stabilizer for plating tin-bismuth alloy and preparation method thereof |
| 12/17/2002 | US6495022 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine |
| 12/17/2002 | US6495001 For the production of electrical contact components, by applying a film of tin or tin alloy to a strip of electroconductive base material, and subsequently depositing a silver film |
| 12/12/2002 | WO2002068727A3 Copper-plating solution, plating method and plating apparatus |
| 12/12/2002 | US20020187364 Electrodeposition; electronics |
| 12/12/2002 | US20020187355 High speed electroplating; uniform deposits |
| 12/12/2002 | US20020185716 Metal article coated with multilayer finish inhibiting whisker growth |
| 12/11/2002 | EP1264918A1 Electrolytic copper plating method |
| 12/11/2002 | EP1264009A2 Method for applying a metal layer to a light metal surface |
| 12/11/2002 | EP0844316B1 Surface-treated steel sheet excellent in corrosion resistance after working |
| 12/11/2002 | CN1384782A Treated copper foil and process for making treated copper foil |
| 12/11/2002 | CN1384226A Ni-Co alloy electroplating process for copper plate working surface of continuously casting crystallizer |
| 12/11/2002 | CN1384225A Ferro-nickel alloy electroplating process for copper plate working surface of continuously casting crystallizer |
| 12/10/2002 | US6492262 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/10/2002 | US6491806 Electroplating bath composition |
| 12/05/2002 | WO2002097165A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/05/2002 | US20020182433 Composite metal layer, comprises (I) copper, (II) tungsten or molybdenum and (III) nickel, cobalt, iron or zinc; and a roughened layer of copper formed on the composite metal layer. |
| 12/05/2002 | DE10123585C1 Production of metals which foam on heat treatment or metal foams comprises suspending a propellant which splits gas on heat treatment in a galvanic electrolyte, and galvanically depositing the metal with the electrolyte on a substrate |
| 12/04/2002 | EP1114207B1 Pellistor |
| 11/28/2002 | US20020175080 Plating a wafer by exposing to a first solution of a sulfur depolarizing compound to brighten and level; exposing to a metal compound solution, applying a current; elimination of depletion/monitoring of additives and defects (bumps) |
| 11/27/2002 | EP1260614A1 Tin plating |
| 11/27/2002 | EP1260198A1 Movable joint |
| 11/27/2002 | CN1382306A Copper deposit process |
| 11/27/2002 | CN1094995C Method for electroplating alloy powder for H-Ni battery and its apparatus |
| 11/26/2002 | US6486533 Metallization structures for microelectronic applications and process for forming the structures |
| 11/26/2002 | US6485863 Battery container with surface treated steel sheet |
| 11/21/2002 | WO2002092211A2 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 11/21/2002 | US20020173853 Movable joint and method for coating movable joints |
| 11/21/2002 | US20020170828 Electroplating composition and process |
| 11/20/2002 | EP1257693A1 Composite copper foil and manufacturing method thereof |
| 11/20/2002 | CN1380915A Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in electrolysis apparatus |
| 11/20/2002 | CN1380445A Electroplating tin-bithmuth alloy plating liquor and its preparation method |
| 11/17/2002 | CA2386972A1 Movable joint and method for coating joints |
| 11/14/2002 | WO2002090623A1 Copper plating bath and method for plating substrate by using the same |
| 11/14/2002 | US20020166774 Alloy composition and plating method |
| 11/13/2002 | EP1257004A1 Metal article with multilayer coating |
| 11/13/2002 | CN1379123A Complexing agent for electroplating Sn-Bi alloy and its preparing process |
| 11/13/2002 | CN1379122A Brightening agent for electroplated Sn-Bi alloy and its preparing process |
| 11/12/2002 | US6479176 Gradient interface magnetic composites and methods therefor |
| 11/12/2002 | US6478944 Functional Sn-Bi alloy plating using a substitute material for Pb |
| 11/07/2002 | WO2002088434A1 Aluminium electroplating formulations |
| 11/07/2002 | WO2002088423A1 Copper plating solution and method for copper plating |
| 11/07/2002 | WO2002058775A3 Device for dilating and irradiating a vascular segment or body passageway |
| 11/07/2002 | US20020164262 For producing optical mirror |
| 11/07/2002 | US20020162751 Cleaning and activating workpiece; exposing to a galvanic chrome plating bath to formhard chromium plating having a pearl or columnar structure type surface, and filling in and smoothing surface with galvanically applied silver layer |
| 11/07/2002 | US20020162748 Method for surface treatment of gold-plated body and surface-treated product, and process for producing gold-plated body and gold-plated body, and method for immobilization of sulfur-containing molecules |
| 11/07/2002 | DE10121593A1 Verfahren zur Beschichtung von Werkstücken mit einem Lagermetall A method of coating workpieces with a bearing metal |
| 11/06/2002 | EP1254973A1 Method of coating of workpieces with a bearing metal |
| 11/06/2002 | CN1378607A Method for producing electrolytically coated cold rolled strip, preferably for use in production of battery sheaths, and battery sheath produced according to said method |
| 11/05/2002 | US6475645 Electrodeposited paint containing cobalt and zinc |
| 11/05/2002 | US6475644 Medical devices for delivery of targeted radioisotopes |
| 11/05/2002 | US6475643 Lead-free alloy of tin and gallium, oxidation resistance |
| 10/31/2002 | WO2002086196A1 Copper acid baths, system and method for electroplating high aspect ratio substrates |
| 10/31/2002 | US20020160222 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate |
| 10/31/2002 | US20020160221 Hot-dip galvanized steel sheet |
| 10/30/2002 | EP1253220A1 Sliding member |
| 10/30/2002 | EP1252650A1 Substrate processing apparatus |
| 10/30/2002 | CN1093572C Technology for producing Cu-P anode |
| 10/29/2002 | US6472086 Multilayer; steel support; alloy overcoating; lead-free |
| 10/24/2002 | WO2002046500A3 Improvements relating to metal finishes |
| 10/24/2002 | US20020154442 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
| 10/24/2002 | US20020153260 For use in electroplating printed circuit boards and other electronic packaging devices |
| 10/24/2002 | US20020153259 Providing aqueous solution comprising source of copper, additive to adjust pH to a predetermined value, and a complexing agent for complexing copper; providing electrons from a source not being in direct contact with solution |
| 10/24/2002 | US20020153255 Method of electroplating a nickel-iron alloy film with a graduated composition |
| 10/24/2002 | US20020153210 Plated wear surface for alloy components and methods of manufacturing the same |
| 10/24/2002 | DE10108893A1 Production of metals and their alloys and compound semiconductors comprises galvanically depositing metals, alloys or compound semiconductors from an ionic liquid or suitable molten salt in an electrolysis device |
| 10/23/2002 | EP1250472A1 Method for the deposition of a chromium alloy |
| 10/23/2002 | CN1376214A Method for electrodeposition of emtallic multilayers |
| 10/23/2002 | CN1093179C Foil with controlled properties for printed circuit board and procedures and electrolyte bath solutions for preparing same |
| 10/22/2002 | US6468411 Brightener for zinc-nickel plating bath and method of electroplating |
| 10/17/2002 | WO2002081782A1 Back-end metallisation process |
| 10/16/2002 | EP1249861A2 A multi-step method for metal deposition |
| 10/16/2002 | EP1249517A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| 10/16/2002 | EP1248868A2 Electrolyte for use in electrolytic plating |
| 10/16/2002 | CN1092537C Process for producing palladium hydroxide compound |
| 10/10/2002 | WO2002058113A3 Electrochemical methods for polishing copper films on semiconductor substrates |
| 10/10/2002 | US20020146259 Fixing belt and image heating and fixing apparatus |
| 10/10/2002 | US20020144910 Method for preventing the thermal oxidation yellowing of tin-plated wires |
| 10/10/2002 | US20020144909 Palladium plating solution |
| 10/10/2002 | US20020144908 Back-end metallisation process |
| 10/09/2002 | EP1194616A4 Copper replenishment technique for precision copper plating system |
| 10/09/2002 | EP0948670B1 Electrolyte for aluminium electroplating |
| 10/08/2002 | US6461745 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding |
| 10/03/2002 | WO2001083854A3 Electroplating bath composition and method of using |
| 10/02/2002 | EP1244827A1 Bath for electrochemically depositing highly lustrous white rhodium coatings and whitening agent for the same |
| 10/02/2002 | EP1009869B1 Cyanide-free monovalent copper electroplating solutions |
| 10/02/2002 | EP0925388B1 Electroplating of nickel-phosphorus alloys coatings |
| 10/02/2002 | CN1372017A Method for producing and using compound additives used in electric deposition to level and polish metal |
| 10/02/2002 | CN1371783A Method for making miniature cutter and stereo microstructure |
| 10/01/2002 | US6458264 Containing at least one of alkane or alkanol sulfonic acid or sulfuric acid and a thiourea |
| 10/01/2002 | US6458218 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 09/26/2002 | WO2002075797A2 Method of forming copper interconnects |
| 09/26/2002 | WO2002049077A3 Barrier layer for electrical connectors and methods of applying the layer |
| 09/26/2002 | US20020135972 Electronic parts, and process for manufacturing electronic parts |
| 09/25/2002 | CN1371432A Copper replenishment technique for precision copper plating system |
| 09/24/2002 | US6454928 Tin-plating which includes gallium and copper |
| 09/19/2002 | WO2002072923A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 09/19/2002 | WO2002038326A3 Brazing product having a low melting point |
| 09/19/2002 | US20020132137 Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
| 09/19/2002 | US20020130046 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |