| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 03/26/2003 | CN1405360A Multilayer nickel-iron alloy composite coating process |
| 03/26/2003 | CN1405359A Method for electroplating electrode of ceramic wafer electronic component |
| 03/25/2003 | US6537683 Stratified composite material for sliding elements and method for the production thereof |
| 03/20/2003 | WO2003023395A1 Enhanced detection of metal plating additives |
| 03/20/2003 | WO2002075797A3 Method of forming copper interconnects |
| 03/20/2003 | US20030052014 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener |
| 03/20/2003 | US20030052013 R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co |
| 03/20/2003 | US20030051713 Cylinder liner for diesel engines with EGR and method of manufacture |
| 03/19/2003 | EP1292724A1 Zinc-nickel electroplating |
| 03/19/2003 | EP1198623B1 Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths |
| 03/19/2003 | EP0939448B1 Battery case and surface-treated steel sheet for battery case |
| 03/19/2003 | CN1404536A Zn-Co-W alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 03/19/2003 | CN1404535A Composite copper foil and manufacturing method thereof |
| 03/18/2003 | US6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
| 03/13/2003 | WO2003021008A1 Tin electroplating solution and method for plating |
| 03/13/2003 | WO2002103751A3 Electroplating chemistry for the cu filling of submicron features of vlsi/ulsi interconnect |
| 03/13/2003 | WO2002063071A3 Acid dip for zinc-manganese alloy electrodeposition |
| 03/13/2003 | US20030049850 Enhanced detection of metal plating additives |
| 03/13/2003 | US20030047460 For use in electrical contacts and the connectors used in the field of electronics receive, as a finish, thin layers of electroplated precious metals having brightness, ductility, non-porous and have corrosion resistance |
| 03/12/2003 | EP1291933A1 Method of manufacturing a steel sheet for a battery case |
| 03/12/2003 | EP1290247A1 Zinc alloy bath |
| 03/12/2003 | EP1290246A1 Method of manufacturing an aluminium product |
| 03/12/2003 | EP1200640B1 Coating method |
| 03/12/2003 | CN1401823A Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe |
| 03/11/2003 | US6531046 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current |
| 03/11/2003 | US6531045 Acid resistance |
| 03/06/2003 | WO2003018880A1 Electrolytic solution for electrochemical deposition of gold and its alloys |
| 03/06/2003 | WO2002097165A3 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/06/2003 | US20030044303 Ultra high saturation moment soft magnetic thin film and its manufacturing method |
| 03/05/2003 | EP1288162A2 Stable aqueous suspension liquid of finely divided diamond particles metallic film containing diamond particles and method of producing the same |
| 03/05/2003 | EP1287184A1 Satin-finished nickel or nickel alloy coating |
| 03/04/2003 | US6528424 Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution |
| 03/04/2003 | US6528185 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate |
| 03/04/2003 | US6527840 Consisting of palladium ions, gold ions and rhodium ions, the silver ions and at least one metal ion having a concentration of 0.001 to 0. 01 mol/l |
| 02/27/2003 | WO2003016595A1 Member excellent in antibacterial and/or antialgae effects and process for producing the same |
| 02/27/2003 | US20030038036 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith |
| 02/26/2003 | EP1285104A1 Electrolyte and method for depositing tin-silver alloy layers |
| 02/26/2003 | EP1218569B1 Galvanizing solution for the galvanic deposition of copper |
| 02/26/2003 | EP1114206B1 Cyanide-free aqueous alkaline bath used for the galvanic application of zinc or zinc-alloy coatings |
| 02/25/2003 | US6524723 Copper foil for printed circuit boards and its surface treatment method |
| 02/20/2003 | WO2003015483A1 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil |
| 02/20/2003 | WO2003014425A1 Copper on invar composite and method of making |
| 02/20/2003 | US20030036569 Do not readily protonate (even in aqueous solutions of low pH), commonly encountered in many extreme applications due to the very low basicity of the perfluorinated anion. |
| 02/20/2003 | US20030035977 Barrier layer for electrical connectors and methods of applying the layer |
| 02/18/2003 | US6521358 Lead frame for semiconductor device and method of producing same |
| 02/18/2003 | US6521114 Prevention of marine encrustation on bronze propellers |
| 02/18/2003 | US6521113 Mixture of platinum salt and carbonate |
| 02/13/2003 | WO2003012174A1 Electrolytic process for depositing a layer of copper on a steel wire |
| 02/13/2003 | WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 02/13/2003 | US20030029730 Copper on INVAR® composite |
| 02/13/2003 | DE10129900C1 Verfahren zur Wärmebehandlung eines Kaltbandes mit einer Oberflächenbeschichtung aus Ni und/oder Co, durch das Verfahren herstellbares Blech und durch das Verfahren herstellbarer Batteriebecher A method of heat treatment of a cold strip with a surface coating of Ni and / or Co, producible by the method and sheet producible by the method of battery cans |
| 02/11/2003 | US6518182 Via-filling process |
| 02/11/2003 | US6517894 Method for plating a first layer on a substrate and a second layer on the first layer |
| 02/06/2003 | US20030024822 Process for the deposition of a silver-tin alloy |
| 02/06/2003 | DE10124002C1 Aqueous acid bath used for the currentless or galvanic deposition of silver contains silver in the form of a silver salt of a sulfonic or mercapto-carboxylic acid, and a thiodiethanol derivative as additional complex former |
| 02/05/2003 | CN1395629A Method for deposition of chromium alloy |
| 02/05/2003 | CN1394987A Goldplating solution unsubstituted with nickel |
| 02/05/2003 | CN1100893C Laminated material for sliding components and method for preparing through and its reagent |
| 02/04/2003 | US6514400 Method for producing a fuel cell separator |
| 01/30/2003 | US20030019756 Reaction is executed in a reaction vessel containing matter in a supercritical or subcritical state and an electrolytic solution; free of generated liquid waste, no need to clean the electrode |
| 01/29/2003 | EP1097261B1 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 01/28/2003 | US6511589 Nontoxic, non-cyanide electrolytic; trivalent gold hydroxide salt and/or chloroaurate salt; imidazolidinedione, 5,5-dimethylhydantoin, or hydantoic acid as chelating agents; a buffer; and a conductive salt |
| 01/28/2003 | US6511588 Semiconductors, additive which hinders growth of plating metal film to a plating solution |
| 01/23/2003 | WO2003007412A1 Polymer electrolyte membrane for electrochemical and other applications |
| 01/23/2003 | WO2003006360A2 Brightener for zinc-nickel plating bath |
| 01/23/2003 | US20030015433 Electrolytic copper plating method |
| 01/22/2003 | EP1276919A2 Electroplating bath composition and method of using |
| 01/22/2003 | EP1042539A4 Printed circuit manufacturing process using tin-nickel plating |
| 01/22/2003 | CN1392294A Plating method of electrocytic copper |
| 01/21/2003 | US6508927 Tin-copper alloy electroplating bath |
| 01/16/2003 | WO2003004732A1 Electrochemically textured surface having controlled peak characteristics and the method of manufacture |
| 01/16/2003 | US20030012975 Composite copper foil and manufacturing method thereof |
| 01/16/2003 | US20030010646 Comprising enhanced brightener concentrations which accelerate the plating rate in recesses and microvias as carrier molecules become incorporated into the plating deposit; computer printed circuits; semiconductors |
| 01/15/2003 | CN1390985A Composition and method for tinplating |
| 01/09/2003 | WO2002015297A3 Electrochemical cells and an interchangeable electrolyte therefore |
| 01/09/2003 | WO2002004713A2 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 01/09/2003 | CA2415341A1 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 01/08/2003 | EP1272691A1 Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 01/08/2003 | CN1389598A Low-temperature and low-concentration electroplating process to form multilayer nano nickel coating |
| 01/07/2003 | US6503382 Method of electrodepositing a porous film |
| 01/03/2003 | WO2003000937A2 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | EP1268347A1 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
| 01/01/2003 | CN1097644C Ornament |
| 12/31/2002 | US6500886 Plating solution an electrically conductive salt, an adsorbent, one of mono- to hexavalent metal ions and 0.01-30 g aliphatic amine or aliphatic amine polymer; corrosion resistant zinc alloy coating |
| 12/31/2002 | US6500327 Does not erode a piece to be plated, and has a high stability; comprises bi3+ ions, sn2+ ions, and complexing agents |
| 12/27/2002 | WO2002103751A2 Electroplating chemistry for the cu filling of submicron features of vlsi/ulsi interconnect |
| 12/27/2002 | WO2002103084A1 Palladium plating solution |
| 12/26/2002 | US20020197504 Laminated hard Cr plating layer comprising a plurality of hard Cr plating layers laminated on the sliding sliding surface; micro-cracks of each plating layer forming independent micro-pores in the film forming direction |
| 12/26/2002 | US20020195351 Copper electroplating composition for integrated circuit interconnection |
| 12/25/2002 | CN1386914A Process for preparing Pd nano-particle film on surface of gold electrode |
| 12/25/2002 | CN1386913A Brightening agent for cyaniding planting of silver |
| 12/25/2002 | CN1386912A Brightening agent for cyaniding plant of silver |
| 12/25/2002 | CN1386911A Brightening agent for cyaniding planting of silver |
| 12/24/2002 | US6497806 Method of producing a roughening-treated copper foil |
| 12/19/2002 | WO2002101119A1 Mixture for use as brightening agent in an electrodeposit solution of silver, gold or one of their alloys |
| 12/19/2002 | US20020192503 Thin film magnetic head and method of fabricating the head |
| 12/19/2002 | US20020189716 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 12/18/2002 | CN1386146A Electrolytic copper-plated R-T-B magnet and method thereof |
| 12/18/2002 | CN1386044A Roughened copper foil and making method thereof |