| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 09/18/2002 | EP1240365A1 Method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to said method |
| 09/18/2002 | CN1370245A Copper electroplating bath, pre-treating liquid before copper electroplating and copdper electroplating method |
| 09/17/2002 | US6451452 Lead-free; copper alloy |
| 09/17/2002 | US6451448 Surface treated metallic materials and manufacturing method thereof |
| 09/12/2002 | DE19983254C2 Vorrichtung und Verfahren zur Herstellung einer dünnen Folie aus einer Ni-Fe-Legierung Apparatus and method for forming a thin film of an Ni-Fe alloy |
| 09/11/2002 | EP1137825B1 Aqueous solution for electrodepositing tin-zinc alloys |
| 09/10/2002 | US6447954 High energy, light weight, lead-acid storage battery |
| 09/10/2002 | US6447666 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 09/06/2002 | WO2002068729A1 A process for electrochemical deposition of tantalum and an article having a surface modification |
| 09/06/2002 | WO2002068728A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/06/2002 | WO2002068727A2 Copper-plating solution, plating method and plating apparatus |
| 09/06/2002 | WO2002068007A1 Implant and process of modifying an implant surface |
| 09/06/2002 | WO2002045476A9 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 09/06/2002 | CA2438207A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/05/2002 | DE10110743A1 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung Bath for the electrodeposition of gold and gold alloys and its use |
| 09/04/2002 | EP1236814A1 Bath for galvanic deposits of gold and gold alloys and application thereof |
| 09/04/2002 | EP1175518B1 Alloy coating of cast iron |
| 09/03/2002 | US6444112 Manufacturing method of electrodeposited copper foil |
| 09/03/2002 | US6444110 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 08/29/2002 | US20020119374 Oxidation of a hydroxide into composite oxide |
| 08/29/2002 | US20020118487 Cobalt-nickel-iron alloy thin film and method of forming the same, and thin-film magnetic head and method of manufacturing the same |
| 08/22/2002 | WO2002064862A2 Method for producing plated molded product |
| 08/22/2002 | US20020112966 Adding a sulfonated naphthalene-formaldehyde condensate to an acidic aqueous zinc salt to reduce high current density dendrites and control high current density, roughness, grain size and orientation of a zinc coating |
| 08/22/2002 | US20020112965 Bond enhancement antitarnish coatings |
| 08/22/2002 | US20020112964 Plating solution of metal ions at a molar concentration of between about 0.4 M and about 0.9 M; an acid, a suppressor, an accelerator and a leveler; semiconductors; void- and defect-free; sub-micron scale and smaller features |
| 08/22/2002 | US20020112952 Object plating method and system |
| 08/21/2002 | CN1364766A New polypeptide-human Latexin protein 34.65, and polynucleotide for encoding such polypeptide |
| 08/20/2002 | US6436269 Plating bath and method for electroplating tin-zinc alloys |
| 08/15/2002 | WO2002063071A2 Acid dip for zinc-manganese alloy electrodeposition |
| 08/15/2002 | WO2002063070A1 Nickel cobalt phosphorous low stress electroplating |
| 08/15/2002 | WO2002063069A2 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 08/15/2002 | WO2002062446A1 Process for degassing an aqueous plating solution |
| 08/15/2002 | WO2002004713A3 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 08/14/2002 | EP1230673A1 Integrated circuit plating using highly-complexed copper plating baths |
| 08/14/2002 | EP1230443A1 Method for electrodeposition of metallic multilayers |
| 08/14/2002 | EP1062383A4 Electrolyte and tin-silver electroplating process |
| 08/14/2002 | EP0993512B1 Porous film and method of preparation thereof |
| 08/14/2002 | CN1363861A Fixing strip, image heating and fixing device |
| 08/13/2002 | US6432585 Electrode structural body, rechargeable battery provided with said electrode structural body, and rechargeable battery |
| 08/13/2002 | US6432293 A process for copper-plating a wafer which comprises electroplating a semiconductor wafer having sub-micron trenches etched therein with an electrode comprising a corrosion-resistant metal substrate and a coat mainly composed |
| 08/08/2002 | WO2002061184A1 Method for producing electrical conductors, a solar collector, an electrochemical cell and use of conductors produced in this way |
| 08/08/2002 | US20020106533 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 08/08/2002 | US20020104763 Bath contains an inorganic or organic acid or a water-soluble salt thereof, and one or more thioamide compounds or thiol compounds; forms a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts |
| 08/08/2002 | CA2436244A1 Method for producing electrical conductors, a solar collector, an electrochemical cell and use of conductors produced in this way |
| 08/07/2002 | EP1227884A1 Electro catalyst |
| 08/07/2002 | EP1080252B1 Method for electro copperplating substrates |
| 08/07/2002 | CN1362541A Electroplasting solution for electrodeposition of bright ZnFe alloy with low Fe content from sulfate system |
| 08/07/2002 | CN1362539A Composite electroforming process of copper-base composite material |
| 08/06/2002 | US6428672 Apparatus and method for manufacturing Ni—Fe alloy thin foil |
| 08/01/2002 | WO2002059397A1 Method for the continuous deposition of a nickel-containing coating on a metallic film |
| 08/01/2002 | WO2002058775A2 Device for dilating and irradiating a vascular segment or body passageway |
| 07/31/2002 | EP1225972A2 Pattern dependent surface profile evolution of electrochemically deposited metal |
| 07/31/2002 | EP1133588B1 Stratified composite material for sliding elements and method for the production thereof |
| 07/31/2002 | EP0912777B1 Alkoxylated dimercaptans as copper additives |
| 07/31/2002 | CN1361312A Object electroplating method and system |
| 07/30/2002 | US6426146 Overcoated with zinc oxide |
| 07/30/2002 | US6425996 Adjusting electroconductivity |
| 07/25/2002 | WO2002058114A1 Substrate processing apparatus |
| 07/25/2002 | WO2002058113A2 Electrochemical methods for polishing copper films on semiconductor substrates |
| 07/25/2002 | WO2002057517A1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method |
| 07/25/2002 | WO2002022913A3 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 07/25/2002 | US20020095846 Weapon barrel having a hard chromium inner layer |
| 07/25/2002 | DE10147659A1 Chrom-plattiertes Gleitelement und Verfahren zu seiner Herstellung Chromium-plated sliding element and process for its preparation |
| 07/23/2002 | US6423389 Electrodeposition of copper/or alloys, stainless steels and aluminum on metallic conduits to form protective devices for optical fibers |
| 07/23/2002 | US6423202 Process for making gold salt for use in electroplating |
| 07/18/2002 | WO2002055763A1 Whisker-free tin or tin alloy plating solution, plating film and plated article |
| 07/18/2002 | WO2002055568A2 Use of polyolefins with alkaline, aromatic substituents as auxiliaries in the electrolytic deposition of metal layers |
| 07/18/2002 | WO2001088226A3 Method of manufacturing an aluminium product |
| 07/18/2002 | US20020092772 Barrier layer for electroplating processes |
| 07/18/2002 | US20020092585 A layer of the refractory metal deposited on the substrate, atleast one of the elements boron and carbon is deposited from other source, workpiece is heated to diffuse metal into substrate, deposited boron or carbon form a bond with metal |
| 07/18/2002 | DE10100954A1 Verwendung von Polyolefinen mit basischen, aromatischen Substituenten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten Use of polyolefins having basic, aromatic substituents as an aid for the electrolytic deposition of metallic layers |
| 07/17/2002 | EP0871801B1 Electroplating processes compositions and deposits |
| 07/17/2002 | CN1359429A 涂敷方法 Coating method |
| 07/17/2002 | CN1087791C Brightening agent for sulfate zinc plating |
| 07/16/2002 | US6420053 Articles having a colored metallic coating with special properties |
| 07/16/2002 | US6419811 Roughening to deposit copper protrusions by subjecting foil near or above limiting current density in electrolytic bath with titanium and tungsten ions to cathodic electrolysis, and rust-proofing (chromates or silane coupling agents) |
| 07/15/2002 | CA2330982A1 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 07/11/2002 | WO2002054840A1 Method for producing electroconductive structures |
| 07/11/2002 | US20020090484 Plating bath |
| 07/11/2002 | US20020088845 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film |
| 07/11/2002 | US20020088717 To produce brazed assembly such as heat-exchanger or electrochemical fuel cell or brazing sheet; for joining two structural elements |
| 07/11/2002 | US20020088713 Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte |
| 07/10/2002 | EP1221498A1 Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in the electrolysis apparatus |
| 07/10/2002 | EP0829557B1 Tin-silver alloy plating bath and process for producing plated object using the plating bath |
| 07/10/2002 | CN1358410A Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358409A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358408A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358407A Surface treated copper foil and method for preparing the same and copper-cload laminate using the same |
| 07/10/2002 | CN1087361C Zn-Sn alloy electroplating bath and preparing process thereof |
| 07/09/2002 | US6416648 Excellent corrosion resistance; automobiles; controlling conditions of temperature, ph, electric current density of an electrolyte consisting of zinc sulfate hydrate, iron sulfate, ammonium sulfate and potassium chloride as well as the coating |
| 07/09/2002 | US6416571 Mixture of reaction product of amine and epichlorohydrin with cationic surfactant |
| 07/09/2002 | CA2041121C High speed electroplating of tinplate |
| 07/04/2002 | WO2002052068A1 Zn-co-w alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 07/04/2002 | US20020084193 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 07/04/2002 | US20020084191 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
| 07/04/2002 | US20020084190 Method and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses |
| 07/03/2002 | EP1219729A1 Electrolytic copper plating solution and method for controlling the same |
| 07/03/2002 | EP1218937A2 Novel chip interconnect and packaging deposition methods and structures |
| 07/03/2002 | EP1218569A1 Galvanizing solution for the galvanic deposition of copper |
| 07/03/2002 | EP1141447B1 Aluminium organic electrolytes and method for electrolytic coating with aluminium or aluminium-magnesium-alloys |