Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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05/17/2005 | US6893738 Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil |
05/17/2005 | US6893550 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
05/12/2005 | WO2003083182A3 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths |
05/12/2005 | US20050100791 Current collector structure and methods to improve the performance of a lead-acid battery |
05/12/2005 | US20050100758 Corrosion resistant conductive parts |
05/12/2005 | US20050098440 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
05/12/2005 | US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys |
05/11/2005 | EP1529126A2 Electrolytic copper plating solutions |
05/11/2005 | CN1615204A Alloy composition and method for low temperature fluxless brazing |
05/11/2005 | CN1615203A Improvements in fluxless brazing |
05/11/2005 | CN1614803A Corrosion resistant conductive parts |
05/07/2005 | CA2486687A1 Corrosion resistant conductive parts |
05/06/2005 | WO2005040459A2 Electroplating compositions and methods for electroplating |
05/06/2005 | WO2005039647A2 Radium target and method for producing it |
05/06/2005 | CA2542178A1 Radium target and method for producing it |
05/05/2005 | US20050092616 Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
05/05/2005 | US20050092611 Bath and method for high rate copper deposition |
05/05/2005 | US20050092608 Ion-implanted electroformed structural material and method of producing the structural material |
05/04/2005 | EP1526943A1 Brazing product and method of manufacturing a brazing product |
05/04/2005 | EP1325175B1 Electrolyte and method for depositing tin-copper alloy layers |
05/04/2005 | CN1613159A Current collector structure and methods to improve the performance of a lead-acid battery |
05/04/2005 | CN1611632A Ion-implanted electroformed structural material and method of producing the structural material |
05/03/2005 | US6887366 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets |
04/28/2005 | WO2005038095A2 Electrolytic method for phosphating metal surfaces and phosphated metal layer |
04/28/2005 | US20050087916 Non-consumable electrode for electrolysis of alumina; good mechanical properties and electrical properties with enhanced chemical stability |
04/28/2005 | US20050087447 Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration |
04/28/2005 | US20050087439 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
04/27/2005 | EP1525247A2 Complexing agent for treating metallic and plastic surfaces |
04/27/2005 | CN1610066A Metallization method for producing integrated circuit copper interconnecting wire by separating bipolar acid chemical plating |
04/27/2005 | CN1609281A Method for electrolytic copper plating |
04/27/2005 | CN1609280A Ball iron ring chrome-plating technology and plating liquid thereof |
04/27/2005 | CN1199299C Cadmium cathode and Ni-Cd accumulator comprising same |
04/26/2005 | US6884290 Electrically conductive polycrystalline diamond and particulate metal based electrodes |
04/21/2005 | WO2005035835A2 Workpieces coated with an aluminum/magnesium alloy |
04/21/2005 | WO2005014881A3 Production method of substrate with black film and substrate with black film |
04/21/2005 | US20050082171 cobalt and iron alloy without a substantial drop of saturation flux density from its theoretical value; anode and cathode compartments separated by a diaphragm or salt bridge to permit electric charge transfer, but inhibit penetration of iron ions |
04/21/2005 | US20050081744 Electroplating compositions and methods for electroplating |
04/20/2005 | EP1524336A1 Workpieces coated with an aluminum magnesium alloy |
04/20/2005 | EP1524335A1 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same |
04/20/2005 | EP1524252A2 Sintered bodies based on niobium suboxide |
04/20/2005 | CN1607990A Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
04/20/2005 | CN1607197A Sintered bodies based on niobium suboxide |
04/20/2005 | CN1198342C Battery case and surface-treated steel sheet for same |
04/20/2005 | CN1198002C Apparatus and method for manufacturing Ni-Fe alloy thin foil |
04/20/2005 | CN1198001C Zinc and zinc alloy electroplating additives and electroplating method |
04/19/2005 | US6881319 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer |
04/14/2005 | WO2005033374A1 Electrolyte for the galvanic deposition of aluminum-magnesium alloys |
04/14/2005 | WO2004035875A3 Method for bronze galvanic coating |
04/14/2005 | WO2004005528A3 Pyrophosphoric acid bath for use in copper-tin alloy plating |
04/14/2005 | US20050079089 Alloy coating, method for forming the same, and member for high temperature apparatuses |
04/14/2005 | US20050077186 Stabilizing and homogenizing the deposition of a compact tin-silver alloy, in presence with an acidic water solution contains an organic complexant |
04/14/2005 | US20050077180 Reduce electrodepositing defects, and reduce within die thickness variations; adjusting the concentrations of suppressor, a leveler and chloride accelerator; depositing copper, silver, gold and alloys on integrated circuit; wafer semiconductors |
04/14/2005 | US20050077082 Tin deposition |
04/14/2005 | DE202005001724U1 Sieve insert for medical cleaning units in stainless steel with black chromed marking of the resting surface for medical instruments, is made using masking technique |
04/14/2005 | DE10342291A1 Process for the acidic electrolytic deposition of a metal alloy for coating electronic components comprises passing deposited metal back into the chloride-free electrolyte solution by adding and dissolving the corresponding metal compounds |
04/14/2005 | DE10337029A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use |
04/13/2005 | EP1522610A2 Method for the production of a wear-resistant layer |
04/13/2005 | EP1214739A4 Copper deposit process |
04/13/2005 | EP1200646B1 Alloy plating |
04/12/2005 | US6878411 Bath for the electrochemical deposition of high-gloss white rhodium coatings and whitening agent for the same |
04/12/2005 | US6878261 Surface treatment method of copper foil with silane coupling agent |
04/12/2005 | US6878259 Immersion in electrolytic cell |
04/12/2005 | CA2148215C Nanocrystalline metals |
04/07/2005 | WO2005031812A2 Improved copper bath for electroplating fine circuitry on semiconductor chips |
04/07/2005 | US20050072683 Containing two high molecular weight surfactants of different hydrophobicities and sulfur containing saturated organic compound electrocoating rate promoter; film uniformity and filling performance |
04/07/2005 | US20050072682 Covering with low cost, high corrosion and abrasion resistant multilayer; metal electroplating and electrostatically spraying and curing organic powder sealant |
04/07/2005 | CA2539481A1 Improved copper bath for electroplating fine circuitry on semiconductor chips |
04/06/2005 | EP1520064A2 Plain bearing having an overlay alloy layer |
04/06/2005 | EP1520063A1 Bath for gold electrodeposition |
04/06/2005 | CN1603474A Method for preventing displacement reaction in tin bismuth electroplating system |
04/06/2005 | CN1196391C Method for surface treatment of copper foil |
04/06/2005 | CN1195904C Aqueous solution for electrodepositing tin-zinc alloys and its application for deposition of tin-zinc coating |
04/05/2005 | US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
04/05/2005 | US6875330 Process for coating workpieces with bearing metal |
03/31/2005 | WO2005028717A1 Insoluble anode with an auxiliary electrode |
03/31/2005 | US20050067297 Copper bath for electroplating fine circuitry on semiconductor chips |
03/31/2005 | US20050067296 Electrodeposition; galvanically coating iron on surface of aluminum-based substrate, cleaning with solution of oils, fats, emulsions, and pigments, etching in solution to dissolve alloy, rinsing surface with water, immersing in electrolytic iron sulfate solution, then anodically/cathodically switching |
03/30/2005 | EP1518946A1 Electrolyte for the galvanic deposition of aluminium |
03/30/2005 | EP1518945A1 Electrolyte for the galvanic deposition of aluminium magnesium alloys |
03/29/2005 | US6872295 Providing aqueous solution comprising source of copper, additive to adjust pH to a predetermined value, and a complexing agent for complexing copper; providing electrons from a source not being in direct contact with solution |
03/24/2005 | WO2005026403A1 Method for making a metal decorative effect on the surface of an object |
03/24/2005 | US20050064228 Protective coating for turbine engine component |
03/24/2005 | US20050061679 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density |
03/23/2005 | EP1516943A2 Protective coating for turbine engine component |
03/23/2005 | CN1599809A Pretreatment process for coating of aluminium materials |
03/23/2005 | CN1598071A Complex of ammonium thicoaurite and preparation process thereof |
03/23/2005 | CN1598070A Non-spherical plastic lens and mfg. method of module thereof |
03/23/2005 | CN1598051A Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings |
03/23/2005 | CN1597290A Metal mould for processing plastic gloves and its production method |
03/23/2005 | CN1194587C Production method of copper foil for fine line use |
03/22/2005 | US6869690 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer |
03/17/2005 | US20050058848 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer |
03/17/2005 | US20050056545 Gold plating solution and gold plating method |
03/17/2005 | US20050056542 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
03/17/2005 | US20050056538 Insoluble anode with an auxiliary electrode |
03/17/2005 | DE10337030A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use |
03/16/2005 | EP1514956A1 Tin or tin alloy Electroplating on composite substrates |
03/16/2005 | EP1513967A2 Acid plating bath and method for the electolytic deposition of satin nickel deposits |
03/16/2005 | CN1193116C 黑色钌电镀液 Black Ruthenium plating solution |
03/16/2005 | CN1193115C Electrolytic copper-plated R-T-B magnet and method thereof and electrolytic copper solution |