Patents for C25D 3 - Electroplating; Baths therefor (11,896)
05/2005
05/17/2005US6893738 Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil
05/17/2005US6893550 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent
05/12/2005WO2003083182A3 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
05/12/2005US20050100791 Current collector structure and methods to improve the performance of a lead-acid battery
05/12/2005US20050100758 Corrosion resistant conductive parts
05/12/2005US20050098440 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
05/12/2005US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys
05/11/2005EP1529126A2 Electrolytic copper plating solutions
05/11/2005CN1615204A Alloy composition and method for low temperature fluxless brazing
05/11/2005CN1615203A Improvements in fluxless brazing
05/11/2005CN1614803A Corrosion resistant conductive parts
05/07/2005CA2486687A1 Corrosion resistant conductive parts
05/06/2005WO2005040459A2 Electroplating compositions and methods for electroplating
05/06/2005WO2005039647A2 Radium target and method for producing it
05/06/2005CA2542178A1 Radium target and method for producing it
05/05/2005US20050092616 Baths, methods, and tools for superconformal deposition of conductive materials other than copper
05/05/2005US20050092611 Bath and method for high rate copper deposition
05/05/2005US20050092608 Ion-implanted electroformed structural material and method of producing the structural material
05/04/2005EP1526943A1 Brazing product and method of manufacturing a brazing product
05/04/2005EP1325175B1 Electrolyte and method for depositing tin-copper alloy layers
05/04/2005CN1613159A Current collector structure and methods to improve the performance of a lead-acid battery
05/04/2005CN1611632A Ion-implanted electroformed structural material and method of producing the structural material
05/03/2005US6887366 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets
04/2005
04/28/2005WO2005038095A2 Electrolytic method for phosphating metal surfaces and phosphated metal layer
04/28/2005US20050087916 Non-consumable electrode for electrolysis of alumina; good mechanical properties and electrical properties with enhanced chemical stability
04/28/2005US20050087447 Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration
04/28/2005US20050087439 Chambers, systems, and methods for electrochemically processing microfeature workpieces
04/27/2005EP1525247A2 Complexing agent for treating metallic and plastic surfaces
04/27/2005CN1610066A Metallization method for producing integrated circuit copper interconnecting wire by separating bipolar acid chemical plating
04/27/2005CN1609281A Method for electrolytic copper plating
04/27/2005CN1609280A Ball iron ring chrome-plating technology and plating liquid thereof
04/27/2005CN1199299C Cadmium cathode and Ni-Cd accumulator comprising same
04/26/2005US6884290 Electrically conductive polycrystalline diamond and particulate metal based electrodes
04/21/2005WO2005035835A2 Workpieces coated with an aluminum/magnesium alloy
04/21/2005WO2005014881A3 Production method of substrate with black film and substrate with black film
04/21/2005US20050082171 cobalt and iron alloy without a substantial drop of saturation flux density from its theoretical value; anode and cathode compartments separated by a diaphragm or salt bridge to permit electric charge transfer, but inhibit penetration of iron ions
04/21/2005US20050081744 Electroplating compositions and methods for electroplating
04/20/2005EP1524336A1 Workpieces coated with an aluminum magnesium alloy
04/20/2005EP1524335A1 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
04/20/2005EP1524252A2 Sintered bodies based on niobium suboxide
04/20/2005CN1607990A Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
04/20/2005CN1607197A Sintered bodies based on niobium suboxide
04/20/2005CN1198342C Battery case and surface-treated steel sheet for same
04/20/2005CN1198002C Apparatus and method for manufacturing Ni-Fe alloy thin foil
04/20/2005CN1198001C Zinc and zinc alloy electroplating additives and electroplating method
04/19/2005US6881319 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer
04/14/2005WO2005033374A1 Electrolyte for the galvanic deposition of aluminum-magnesium alloys
04/14/2005WO2004035875A3 Method for bronze galvanic coating
04/14/2005WO2004005528A3 Pyrophosphoric acid bath for use in copper-tin alloy plating
04/14/2005US20050079089 Alloy coating, method for forming the same, and member for high temperature apparatuses
04/14/2005US20050077186 Stabilizing and homogenizing the deposition of a compact tin-silver alloy, in presence with an acidic water solution contains an organic complexant
04/14/2005US20050077180 Reduce electrodepositing defects, and reduce within die thickness variations; adjusting the concentrations of suppressor, a leveler and chloride accelerator; depositing copper, silver, gold and alloys on integrated circuit; wafer semiconductors
04/14/2005US20050077082 Tin deposition
04/14/2005DE202005001724U1 Sieve insert for medical cleaning units in stainless steel with black chromed marking of the resting surface for medical instruments, is made using masking technique
04/14/2005DE10342291A1 Process for the acidic electrolytic deposition of a metal alloy for coating electronic components comprises passing deposited metal back into the chloride-free electrolyte solution by adding and dissolving the corresponding metal compounds
04/14/2005DE10337029A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use
04/13/2005EP1522610A2 Method for the production of a wear-resistant layer
04/13/2005EP1214739A4 Copper deposit process
04/13/2005EP1200646B1 Alloy plating
04/12/2005US6878411 Bath for the electrochemical deposition of high-gloss white rhodium coatings and whitening agent for the same
04/12/2005US6878261 Surface treatment method of copper foil with silane coupling agent
04/12/2005US6878259 Immersion in electrolytic cell
04/12/2005CA2148215C Nanocrystalline metals
04/07/2005WO2005031812A2 Improved copper bath for electroplating fine circuitry on semiconductor chips
04/07/2005US20050072683 Containing two high molecular weight surfactants of different hydrophobicities and sulfur containing saturated organic compound electrocoating rate promoter; film uniformity and filling performance
04/07/2005US20050072682 Covering with low cost, high corrosion and abrasion resistant multilayer; metal electroplating and electrostatically spraying and curing organic powder sealant
04/07/2005CA2539481A1 Improved copper bath for electroplating fine circuitry on semiconductor chips
04/06/2005EP1520064A2 Plain bearing having an overlay alloy layer
04/06/2005EP1520063A1 Bath for gold electrodeposition
04/06/2005CN1603474A Method for preventing displacement reaction in tin bismuth electroplating system
04/06/2005CN1196391C Method for surface treatment of copper foil
04/06/2005CN1195904C Aqueous solution for electrodepositing tin-zinc alloys and its application for deposition of tin-zinc coating
04/05/2005US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
04/05/2005US6875330 Process for coating workpieces with bearing metal
03/2005
03/31/2005WO2005028717A1 Insoluble anode with an auxiliary electrode
03/31/2005US20050067297 Copper bath for electroplating fine circuitry on semiconductor chips
03/31/2005US20050067296 Electrodeposition; galvanically coating iron on surface of aluminum-based substrate, cleaning with solution of oils, fats, emulsions, and pigments, etching in solution to dissolve alloy, rinsing surface with water, immersing in electrolytic iron sulfate solution, then anodically/cathodically switching
03/30/2005EP1518946A1 Electrolyte for the galvanic deposition of aluminium
03/30/2005EP1518945A1 Electrolyte for the galvanic deposition of aluminium magnesium alloys
03/29/2005US6872295 Providing aqueous solution comprising source of copper, additive to adjust pH to a predetermined value, and a complexing agent for complexing copper; providing electrons from a source not being in direct contact with solution
03/24/2005WO2005026403A1 Method for making a metal decorative effect on the surface of an object
03/24/2005US20050064228 Protective coating for turbine engine component
03/24/2005US20050061679 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density
03/23/2005EP1516943A2 Protective coating for turbine engine component
03/23/2005CN1599809A Pretreatment process for coating of aluminium materials
03/23/2005CN1598071A Complex of ammonium thicoaurite and preparation process thereof
03/23/2005CN1598070A Non-spherical plastic lens and mfg. method of module thereof
03/23/2005CN1598051A Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings
03/23/2005CN1597290A Metal mould for processing plastic gloves and its production method
03/23/2005CN1194587C Production method of copper foil for fine line use
03/22/2005US6869690 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer
03/17/2005US20050058848 Forming a nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy layer, thermally diffusing the zinc into nickel alloy coating layer
03/17/2005US20050056545 Gold plating solution and gold plating method
03/17/2005US20050056542 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
03/17/2005US20050056538 Insoluble anode with an auxiliary electrode
03/17/2005DE10337030A1 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use
03/16/2005EP1514956A1 Tin or tin alloy Electroplating on composite substrates
03/16/2005EP1513967A2 Acid plating bath and method for the electolytic deposition of satin nickel deposits
03/16/2005CN1193116C 黑色钌电镀液 Black Ruthenium plating solution
03/16/2005CN1193115C Electrolytic copper-plated R-T-B magnet and method thereof and electrolytic copper solution
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