| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 03/15/2005 | US6866765 Electrolytic copper-plated R-T-B magnet and plating method thereof |
| 03/10/2005 | WO2005021840A1 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes |
| 03/10/2005 | WO2005021839A1 Method for electrochemically depositing metals from an electrolyte |
| 03/10/2005 | WO2005021836A2 Chromium-free antitarnish adhesion promoting treatment composition |
| 03/10/2005 | WO2005021429A1 Method for producing a layer or a film from a metal nanotube composite material |
| 03/09/2005 | EP1415021A4 Copper on invar composite and method of making |
| 03/09/2005 | CN1592800A Electrolytic copper plating solutions |
| 03/09/2005 | CN1590596A Electroplating on composite substrates |
| 03/09/2005 | CN1590595A Electroplating liquid and technology used in electrodeposition of trngsten series noncrystalline alloy cladding material or nanometer alloy cladding material |
| 03/09/2005 | CN1590594A Plating method |
| 03/08/2005 | US6863795 Plating a wafer by exposing to a first solution of a sulfur depolarizing compound to brighten and level; exposing to a metal compound solution, applying a current; elimination of depletion/monitoring of additives and defects (bumps) |
| 03/08/2005 | CA2346587C Method of manufacturing an aluminum product |
| 03/03/2005 | US20050048298 Chromium-free antitarnish adhesion promoting treatment composition |
| 03/03/2005 | US20050045488 Copper electrodeposition in microelectronics |
| 03/03/2005 | US20050045486 Plating method and plating solution |
| 03/03/2005 | US20050045485 Reducing or avoiding pitting; utilizing such as amine based polyalkylene oxide; reliable interconnect formation for ultra large scale integration microcircuits |
| 03/03/2005 | DE10337669A1 Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung The aqueous acidic solution and method for the galvanic deposition of copper coatings as well as use of the solution |
| 03/02/2005 | EP1510600A1 Process and apparatus for the deposition of metal and metal alloys from organometallic electrolytes |
| 03/02/2005 | EP1509641A1 Method for producing organoaluminium complexes and the use thereof for producing electrolyte solutions for the electrochemical deposition of aluminium-magnesium alloys |
| 03/02/2005 | EP1322591B1 Ionic liquids and their use |
| 03/02/2005 | CN1191392C Galvanic bath, method for producing structurded hard chromium layers and use thereof |
| 03/01/2005 | US6860981 Minimizing whisker growth in tin electrodeposits |
| 02/24/2005 | WO2005017971A2 Nanomachined and micromachined electrodes for electrochemical devices |
| 02/24/2005 | WO2004050959A3 Reduction of surface oxidation during electroplating |
| 02/24/2005 | US20050043812 Movable joint and method for coating movable joints |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | DE202004015858U1 Fire extinguishing fitting for hygienically conveying drinking water is made from aluminum or aluminum alloy completely or partially coated with tin |
| 02/23/2005 | CN1190523C Electrolyte and method for depositing tin-silver alloy layers |
| 02/23/2005 | CN1190522C Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 02/23/2005 | CN1190521C Copper electroplating solution and its electroplating process |
| 02/23/2005 | CN1190520C Copper electroplating method |
| 02/22/2005 | US6858531 Electro chemical mechanical polishing method |
| 02/22/2005 | US6858123 An electroplating solution comprising copper sulfate, sulfuric acid, hydrochloride, an ethylene oxide adduct or polyethylene glycol, hydroxylamine sulfate, and hydroxyl amine chloride; making semiconductors |
| 02/22/2005 | US6858122 Nickel electroplating solution |
| 02/17/2005 | WO2005015037A1 Layered composite material for plain bearings, production and use thereof |
| 02/17/2005 | WO2005015036A1 Laminated composite material, production and use thereof |
| 02/17/2005 | WO2005014891A2 Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution |
| 02/17/2005 | WO2005014890A1 An electrolyte solution |
| 02/17/2005 | WO2005014881A2 Production method of substrate with black film and substrate with black film |
| 02/17/2005 | US20050034996 Non-reactive coatings for inertization |
| 02/17/2005 | US20050034992 Method of manufacturing MgB2 superconducting material |
| 02/17/2005 | DE10029837B4 Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen Process for the preparation of platinum-plated plates on one side and expanded metal grids made from refractory metals |
| 02/16/2005 | EP1507026A1 Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings |
| 02/16/2005 | EP1506328A2 Fabrication of a high resolution biological molecule detection device with gold electrical conductors |
| 02/16/2005 | CN1580332A Zn-Ni-RE electroplating layer and its electroplating method and electrolytic liquor |
| 02/16/2005 | CN1189798C Fixing strip, image heating and fixing device |
| 02/10/2005 | US20050032387 Asymmetric plating |
| 02/10/2005 | US20050031784 Barrier layer for electroplating processes |
| 02/10/2005 | US20050029112 an alkylsulfonic acid surfactant; water soluble tin (II) and silver (I) salts; linear, organic thioether compounds as complexing agents; electrodeposition; oxidation resistance; solder is suitable for high and low current densities; nontoxic |
| 02/10/2005 | US20050029108 Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
| 02/10/2005 | US20050028906 Annealing surface treatment; crystal growth enhancer |
| 02/09/2005 | CN1576399A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 02/09/2005 | CN1188907C Electroplating appts. |
| 02/09/2005 | CN1188550C Method for electrolytic galvanising electrolytes contanining alkane sulphonic acid |
| 02/09/2005 | CN1188088C Method for producing prosthetic moulded parts for dental use |
| 02/08/2005 | US6852445 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
| 02/08/2005 | US6852427 Directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, |
| 02/08/2005 | US6852211 Nickel electroplating solution |
| 02/08/2005 | US6852207 Using galvanic deposition by pulse-plating, characterized in that gold or a gold alloy is deposited from a gold sulphite bath at a pulse current density of between 0.2 A/dm2 and 50 A/dm2 |
| 02/03/2005 | WO2005010241A1 Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
| 02/03/2005 | WO2005010239A1 Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith |
| 02/03/2005 | WO2004054016A3 Electrochemical cell suitable for use in electronic device |
| 02/03/2005 | DE10035280B4 Aprotische Elektrolytmischung Aprotic electrolyte mixture |
| 02/02/2005 | CN1575106A Printed circuit boards and the methods of their production |
| 02/02/2005 | CN1572917A Method for recycling of plating solutions |
| 02/02/2005 | CN1572909A Molten salt bath for electroforming and method of manufacturing metal product using the same |
| 02/02/2005 | CN1187480C Method and apparatus for producing hot-rolled steel belt with electrolytic coating |
| 02/02/2005 | CN1187479C Electroplating device and process for electroplating parts using said device and annular adhesive magnet |
| 01/27/2005 | WO2005008759A1 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/27/2005 | WO2005007933A1 Electrochemical processing cell |
| 01/27/2005 | US20050020068 Plating method |
| 01/27/2005 | US20050019664 Mechanically processing a nickel foil to be made three dimensional through the creation of concave and convex parts that are rolling pressed to incline in one direction, and then filling with active material to make an electrode; lightweight nickel-metal hydride battery with good charge-discharge |
| 01/27/2005 | US20050016858 Reverse pulse plating composition and method |
| 01/27/2005 | US20050016856 Determining the quantity of brightener and leveler in a metal plating bath using plating bath samples of known and different quantity of the brightener and the leveler, but where the quantity differs from the quantity in the other bath samples |
| 01/27/2005 | US20050016328 Method of manufacturing silver flake |
| 01/27/2005 | DE19926102B4 Verfahren und Anlage zur Herstellung eines elektrolytisch beschichteten Warmbandes Method and apparatus for producing an electrolytically coated hot strip |
| 01/26/2005 | EP1499451A1 Minimizing whisker growth in tin electrodeposits |
| 01/26/2005 | CN1570219A Electroplating compositions and methods |
| 01/20/2005 | WO2004072320A3 Use of n-allyl substituted amines and their salts as brightening agents in nickel plating baths |
| 01/20/2005 | WO2004020696A3 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam |
| 01/20/2005 | WO2003100137A3 Acid plating bath and method for the electolytic deposition of satin nickel deposits |
| 01/20/2005 | US20050014359 Semiconductor device manufacturing method |
| 01/20/2005 | US20050014014 Electroplating bath composition and method of using |
| 01/20/2005 | DE10327374A1 Propansulfonierte und 2-Hydroxy-propansulfonierte Alkylaminalkoxylate, ihre Herstellung und Verwendung als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten Propansulfonierte and 2-hydroxy-propansulfonierte alkylamine alkoxylates, their preparation and use as a tool for the electrolytic deposition of metallic layers |
| 01/19/2005 | EP1497483A1 Platinum electrode and method for manufacturing the same |
| 01/19/2005 | CN1566407A Alkaline Sn-Ag alloy plating solution and its plating method |
| 01/19/2005 | CN1566406A Method for pulse plating of copper using pyrophosphate with neodymium-iron-boron permanent magnet |
| 01/19/2005 | CN1185369C Process for preparing Pd nano-particle film on surface of gold electrode |
| 01/13/2005 | WO2005003411A1 Tin alloy electroplating system |
| 01/13/2005 | US20050006245 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/13/2005 | DE102004025560A1 Gleitteil Slide |
| 01/13/2005 | DE102004014402A1 Geschmolzenes Salzbad für das Elektroformen und Verfahren zu seiner Herstellung, Metallprodukt unter Verwendung desselben Of the same molten salt bath for electroforming and method for its manufacture, metal product using |
| 01/12/2005 | EP1364079B1 A process for electrochemical deposition of tantalum |
| 01/12/2005 | CN1565047A Method of manufacturing semiconductor device |
| 01/12/2005 | CN1564941A Improved method for analysis of three organic additives in an acid copper plating bath |
| 01/12/2005 | CN1564881A Copper electrolytic solution containing quaternary amine compound having specific skeleton and organic sulfur compound as additives, and electrolytic copper foil produced therefrom |
| 01/12/2005 | CN1564880A Copper electrolytic solution containing quaternary amine compound having specific skeleton and organic sulfur compound as additives, and electrolytic copper foil produced therefrom |
| 01/12/2005 | CN1563505A Method of pulse plating nickel based nano composite plating layer and equipment |
| 01/12/2005 | CN1563504A Steel parts plated by Zn-Fe-SiO and electroplating method and electrolyte |
| 01/12/2005 | CN1563503A Steel components and parts covered by Zn-Fe-RE cladding material, electroplating method and electrolyte |