| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 07/07/2005 | US20050145502 Minimizing whisker growth in tin electrodeposits |
| 07/07/2005 | DE10354860A1 Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages Halogenated or pseudo-halogenated monomeric phenazinium, process for their preparation and compounds containing acidic bath and method for electrolytically depositing a copper deposit |
| 07/06/2005 | CN1636297A Electrochemical cells and an interchangeable electrolyte therefore |
| 07/06/2005 | CN1636083A Copper bath capable of depositing lackluster copper coat and method thereof |
| 07/06/2005 | CN1636073A Heat treatment method for a cold-rolled strip with an Ni and/or Co surface coating, sheet metal producible by said method and battery can producible by said method |
| 07/06/2005 | CN1635188A Copper pin indium barrel plating process for cell |
| 07/06/2005 | CN1209504C Zinc and Zinc alloy electroplating additives and electroplating methods |
| 07/05/2005 | US6913791 Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith |
| 07/05/2005 | US6913184 Alloy composition and method for low temperature fluxless brazing |
| 07/05/2005 | US6912771 Magnetic head for hard disk drive having varied composition nickel-iron alloy magnetic poles |
| 06/30/2005 | WO2005059207A1 Electrolyte for the galvanic deposition of aluminium |
| 06/30/2005 | WO2005031812A3 Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 06/30/2005 | US20050142846 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 06/30/2005 | US20050139488 Electrolytic stripping method |
| 06/30/2005 | US20050139478 forming copper seed layer by applying electroplating power with current density of between about 1.0 mA/cm2 and about 5.0 mA/cm2, in periodic pulses; enhancing the deposition of copper layer; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 06/30/2005 | US20050139118 Brightener degradation inhibitor compound in copper plating bath |
| 06/29/2005 | EP1268347B1 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
| 06/29/2005 | CN1633519A Electroplating solution containing organic acid complexing agent |
| 06/29/2005 | CN1632359A Tin plated copper capillary and process for producing same |
| 06/29/2005 | CN1632176A Process of gold plating for industrial pure titanium |
| 06/29/2005 | CN1208503C Titanium base material platinum coating method |
| 06/29/2005 | CN1208493C Electroplating method for aluminium alloy electroplating steel plate |
| 06/28/2005 | US6911138 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener |
| 06/28/2005 | US6911068 Plating bath and method for depositing a metal layer on a substrate |
| 06/23/2005 | WO2005057693A1 Negative electrode collector for nonaqueous electrolyte secondary battery |
| 06/23/2005 | WO2005056885A1 Metal-plated steel sheet for battery case, battery case using the plated steel sheet for battery case and battery using the battery case |
| 06/23/2005 | WO2005056884A1 Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such composition |
| 06/23/2005 | WO2005056883A1 Electroplated coating of zinc alloy with excellent corrosion resistance and plated metal material having same |
| 06/23/2005 | WO2005035835A3 Workpieces coated with an aluminum/magnesium alloy |
| 06/23/2005 | US20050133376 Aqueous zinc-nickel electroplating alkaline bath, comprising water zinc compound, nickel compound, complexing agent and polyoxyalkylene nonionic surfactant; alloying; smoothness, ductility |
| 06/23/2005 | DE10354760A1 Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten A process for the deposition of nickel and chromium (VI) free metallic mat layers |
| 06/22/2005 | EP1543180A1 Method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys |
| 06/21/2005 | US6908534 Substrate plating method and apparatus |
| 06/16/2005 | US20050127518 Copper tungsten phosphide formed by electrodeposition of layers |
| 06/16/2005 | US20050126922 Alkali metal ion or alkali earth metal ion controls perrhenate ion; high temperature, corrosion resistance; irregular shapes at a thickness not possible with thermal spray; simple, low cost |
| 06/16/2005 | US20050126919 Plating method, plating apparatus and a method of forming fine circuit wiring |
| 06/16/2005 | US20050126427 Reaction product of an amino-containing polymer, a phenol or quinone or derivatives, an aldehyde; water or another solvent for dissolving, dispersing, suspending or emulsifying the polymer; deposition of metal or alloys on the plastic surface; corrosion resistance |
| 06/15/2005 | EP1541714A1 Method for repairing components using environmental bond coatings and resultant repaired components |
| 06/15/2005 | EP1540043A2 Pyrophosphoric acid bath for use in copper-tin alloy plating |
| 06/15/2005 | CN1206888C Method for preparing surface treated copper foil |
| 06/15/2005 | CN1206391C Method for preparing rare earth alloy through sweeping electric potential sedimentation |
| 06/14/2005 | US6905588 Forming chip connectors; electrolytic cells |
| 06/14/2005 | US6905587 Method for enhancing the solderability of a surface |
| 06/09/2005 | US20050121331 Depositing a tin-bismuth alloy skin layer on surfaces of a body, placing a solid tin metal and a solid bismuth metal in plating solution, electroconnecting anode; electrochemically alloying; increase in plating cycles, manufactured at a low cost, mounting reliability of a semiconductor |
| 06/09/2005 | US20050121330 Chromium-free antitarnish adhesion promoting treatment composition |
| 06/09/2005 | US20050121326 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 06/09/2005 | US20050121317 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 06/09/2005 | US20050121314 Electrolytic plating method and device for a wiring board |
| 06/09/2005 | US20050121114 Protective coating comprising a phenolic resin having triazine, urea and/or amine groups for metal or alloys having been deposition plastics surfaces; corrosion resistance; also including water or solvent, a surfactant, acids and metal compounds;printed circuits; used in pickling and passivation |
| 06/09/2005 | DE10355077A1 Verfahren zum abwasserarmen Betrieb eines alkalischen Zink-Nickel-Bades A method for operating a low-effluent alkaline zinc-nickel bath |
| 06/08/2005 | CN1624187A Technological method of steel wire overlay galfan alloy and its equipment |
| 06/08/2005 | CN1205626C High corrosion-resistant R-Fe-B-base bonded magnet and method of manufacturing the same |
| 06/08/2005 | CN1205360C Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| 06/07/2005 | US6902824 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/02/2005 | WO2005050721A1 Method for preparing ruthenium oxide-thin film using electrodeposition |
| 06/02/2005 | WO2005049895A1 Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil |
| 06/02/2005 | WO2005049584A1 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| 06/02/2005 | WO2004111288A3 Fabrication of titanium and titanium alloy anode for dielectric and insulated films |
| 06/02/2005 | US20050118452 Roll for metal rolling, and support for lithographic printing plate |
| 06/02/2005 | US20050118448 Laser ablation resistant copper foil |
| 06/02/2005 | US20050118364 Tubular member having an anti-galling coating |
| 06/02/2005 | US20050118341 Rolled product and corresponding production process |
| 06/02/2005 | DE102004051374A1 Galvanogeformtes Ionenimplantations-Strukturmaterial und Verfahren zur Herstellung des Strukturmaterials Electroformed ion implantation structural material and process for manufacturing the structural material |
| 06/02/2005 | CA2542356A1 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| 06/01/2005 | EP1536037A1 Multilayer plated fuel line parts for automobile |
| 06/01/2005 | CN1621571A Plating method for corrosion prevention by employing nano diamonds |
| 06/01/2005 | CN1621567A 电镀组合物 Electroplating composition |
| 05/31/2005 | US6899926 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 05/31/2005 | US6899802 Method for recycling of plating solutions |
| 05/26/2005 | WO2005047570A2 Surface finishing method for silver and its alloys |
| 05/26/2005 | WO2005014891A3 Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution |
| 05/26/2005 | US20050109633 System for electrochemically processing a workpiece |
| 05/26/2005 | US20050109629 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/26/2005 | US20050109628 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/26/2005 | US20050109627 Uniformity; using electrolytic cells; positioning seed layer of low conductivity |
| 05/26/2005 | US20050109625 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/25/2005 | EP1533858A2 Corrosion resistant conductive parts |
| 05/25/2005 | EP1533855A1 Thin film transistor, method for its manufacture, and circuit or electronic device/apparatus comprising it |
| 05/25/2005 | EP1533401A1 Electroplating of substrates followed by a diffusion step |
| 05/25/2005 | EP1533399A2 Method for obtaining a waste-water-low alkali zinc-nickel bath |
| 05/25/2005 | EP1533397A2 Process of depositing mat metallic layers free of nickel and chromium(VI) |
| 05/25/2005 | EP1533396A2 Method for repairing coated components using NiAl bond coats |
| 05/25/2005 | EP1532294A2 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam |
| 05/25/2005 | DE10347459B3 Radium-Target sowie Verfahren zu seiner Herstellung Radium target, and process for its preparation |
| 05/25/2005 | CN1620523A Polymer derivatives for treating metals |
| 05/25/2005 | CN1620485A Polymer derivatives for the treatment of metals |
| 05/25/2005 | CN1619856A Thin film transistor, method for its manufacture, and circuit or electronic device/apparatus comprising it |
| 05/25/2005 | CN1619013A Detin liquid and its preparation technology and use |
| 05/25/2005 | CN1619012A Process of depositing mat metallic layers free of nickel and chromium(VI) |
| 05/25/2005 | CN1618601A Electroplated CoWP composite structures as copper barrier layers |
| 05/24/2005 | US6897152 Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| 05/19/2005 | US20050106315 Method for repairing components using environmental bond coatings and resultant repaired components |
| 05/19/2005 | US20050104216 Electroplated CoWP composite structures as copper barrier layers |
| 05/19/2005 | US20050103638 and optionally magnesium oxide; use as chemically resistant components in chemical apparatuses or as inert apparatuses in the production of niobium suboxide powder or niobium suboxide anodes |
| 05/19/2005 | US20050103637 First layer of high mechanical strength and chemical resistance, and second layer has high electroconductivity, the layers adhered to each other at the interface via a composition gradient, or via a thin film of copper between them; rotary blade cutter |
| 05/19/2005 | DE19926102B9 Verfahren und Anlage zur Herstellung eines elektrolytisch beschichteten Warmbandes Method and apparatus for producing an electrolytically coated hot strip |
| 05/19/2005 | DE10347702A1 Sinterkörper auf Basis Niobsuboxid Sintered body based on niobium suboxide |
| 05/18/2005 | EP1531014A2 Roll for metal rolling, and support for lithographic printing plate |
| 05/18/2005 | EP1357989A4 Process for degassing an aqueous plating solution |
| 05/18/2005 | CN1202697C Method for filling through hole |