| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 06/23/2004 | CN1507505A Copper plating bath and method for plating substrate by using the same |
| 06/23/2004 | CN1506501A Electroplating liquid |
| 06/23/2004 | CN1506499A Making process of electrolytic copper foil with great high-temperature elongation |
| 06/23/2004 | CN1155111C Method for producing solar cell precursor thin film and solar cell |
| 06/22/2004 | CA2201448C Copper or copper alloy surface preparation process for continuous casting elements, comprising nickel plating and nickel removal |
| 06/17/2004 | WO2004050960A1 Production of structured hard chrome layers |
| 06/17/2004 | WO2004050959A2 Reduction of surface oxidation during electroplating |
| 06/17/2004 | US20040115536 Method for producing electrical conductors, a solar collector, an electrochemical cell and use of conductors produced in this way |
| 06/17/2004 | US20040115468 Core sheet overcoated with aluminum alloy |
| 06/17/2004 | US20040112756 Using copper perfluoro(imidosulfonyl or sulfonyl) compound |
| 06/17/2004 | US20040111947 Nodular nickel boron coating |
| 06/17/2004 | DE10255853A1 Herstellung strukturierter Hartchromschichten Producing structured hard chromium coatings |
| 06/16/2004 | CN1505461A A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| 06/16/2004 | CN1505141A Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 06/16/2004 | CN1153854C Ferro-nickel alloy electroplating process for copper plate working surface of continuously casting crystallizer |
| 06/15/2004 | US6749953 Without using chemicals such as injurious sexivalent chrome affecting the environment |
| 06/10/2004 | WO2004048646A1 Electrolytic silver plating solution |
| 06/10/2004 | WO2004048645A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 06/10/2004 | US20040108217 Forming aperture in dielectric overcoating substrate; forming barrier; plating with copper alloy |
| 06/10/2004 | US20040108211 Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB) |
| 06/10/2004 | US20040108136 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
| 06/10/2004 | CA2506355A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 06/09/2004 | EP1426469A1 Method for electrolytic copper plating |
| 06/09/2004 | CN1502724A Method for working rotary axle holder |
| 06/09/2004 | CN1502430A Chain piece with gorgeous color surface and mfg mehtod thereof |
| 06/09/2004 | CN1152982C Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof |
| 06/03/2004 | US20040104124 Plating bath and method for depositing a metal layer on a substrate |
| 06/03/2004 | US20040104123 Anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath |
| 06/03/2004 | US20040104118 Adding to electrolyte mixture an additive, consisting of gelatin, hydroxyethyl Cellulose, and bis/sodiumsulfopropyl/disulfide, forming smooth surface, copper clad laminate for a printed circuit, lithium battery electrode |
| 06/03/2004 | US20040104117 copper sulfate electrolyte solution contains, a sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; a nonionic polyoxyalkylene glycol surfactant as additives |
| 06/03/2004 | DE10261852B3 Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
| 06/02/2004 | EP1424407A1 Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer |
| 06/02/2004 | EP1423557A1 Electrolytic solution for electrochemical deposition of gold and its alloys |
| 06/02/2004 | CN1501989A Improvements relating to metal finishes |
| 06/02/2004 | CN1500916A Gradient composite deposite for continuous casting crystallizer copper plate and production method thereof |
| 06/02/2004 | CN1500915A Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same |
| 06/02/2004 | CN1152444C Indium plating method for copper nail as negative pole current collector of mercury-free alkali Zn-Mn battery |
| 06/01/2004 | US6743950 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
| 06/01/2004 | US6743346 Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 05/27/2004 | WO2004044269A2 Brightener additive and bath for alkaline cyanide-free zinc electroplating |
| 05/27/2004 | US20040099533 Microelectronics; positioning contactors; concentric anodes; nozzles; electroplating |
| 05/27/2004 | US20040099340 Reduction of surface oxidation during electroplating |
| 05/26/2004 | EP1422320A1 Copper electroplating bath |
| 05/26/2004 | EP1352110B1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method |
| 05/26/2004 | EP1301655B1 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 05/26/2004 | EP1068374B1 Ductility agents for nickel-tungsten alloys |
| 05/26/2004 | CN1499992A Process for degassing queous plating solution |
| 05/25/2004 | US6740221 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 05/25/2004 | US6740220 Electrocatalytic cathode device of palladium and iridium on a high density or porous carbon support and a method for making such a cathode |
| 05/21/2004 | WO2004042344A2 Fabrication of a high resolution biological molecule detection device with gold electrical conductors |
| 05/20/2004 | US20040097755 Ionic liquids and their use as solvents |
| 05/20/2004 | US20040094518 Resistance welding method and structure of resistance welding part, and method for manufacturing electronic component and electronic component |
| 05/20/2004 | US20040093730 Decorative article having white coating and method for manufacture thereof |
| 05/19/2004 | EP1420087A2 Method for supplying zinc ions to alkaline zinc plating solution |
| 05/19/2004 | EP1420084A1 MEMBER EXCELLENT IN ANTIBACTERIAL AND/OR ANTIALGAE EFFECTS AND PROCESS FOR PRODUCING THE SAME |
| 05/19/2004 | EP1419378A2 Improved method for analysis of three organic additives in an acid copper plating bath |
| 05/19/2004 | EP1341951B1 Copper bath and method of depositing a matt copper coating |
| 05/19/2004 | CN1497070A Noncyanide electrolytic solution for gold plating |
| 05/19/2004 | CN1497069A Uniform-planar agent compound |
| 05/19/2004 | CN1497065A Anti-corrosion heat-resistant zine diffusion alloy claddiy material |
| 05/18/2004 | US6736956 Non-uniform etching of anode foil to produce higher capacitance gain without sacrificing foil strength |
| 05/18/2004 | US6736954 Plating bath and method for depositing a metal layer on a substrate |
| 05/18/2004 | CA2196744C Thermal barrier coating with improved underlayer and pieces coated with said thermal barrier |
| 05/14/2004 | CA2448892A1 Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same |
| 05/13/2004 | WO2004040044A1 Metal plating structure and method for production thereof |
| 05/13/2004 | WO2004040041A1 Electrolytic deposition method for nano-size metal cobalt fine particles |
| 05/13/2004 | US20040091385 Wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating |
| 05/13/2004 | US20040089557 Process for electrolytic copper plating |
| 05/13/2004 | US20040089556 Low-melting-temperatue tin and plating process |
| 05/13/2004 | US20040089553 Method for supplying zinc ions to alkaline zinc plating solution |
| 05/13/2004 | DE10103445B4 Stahlwerkstoff mit hoher Ermüdungsfestigkeit sowie Verfahren zur Herstellung des Stahlmaterials Steel material having high fatigue resistance as well as methods for producing the steel material |
| 05/12/2004 | EP1075553B1 Zinc and zinc alloy electroplating additives and electroplating methods |
| 05/12/2004 | CN1149305C Chromium plating from baths catalyzed with alkanedisulfonic-alkanesulfonic compounds with inhibitors such as aminealkane sulfonic and heterocyclic bases |
| 05/11/2004 | US6734317 Trialkylaluminum is reacted with solution of alkali metal ethoxide in hydrocarbon; electroplating and electrolysis of aluminum; salt formation |
| 05/11/2004 | US6733656 Automatic calibration of the reference electrode enabled by the present invention, saves labor, time and expense, and minimizes errors in the plating bath analysis. |
| 05/11/2004 | US6733651 Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths |
| 05/06/2004 | WO2004039137A1 Plasma display panel-use copper foil and production method therefor |
| 05/06/2004 | WO2004038070A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 05/06/2004 | US20040086697 Metal alloy compositions and plating methods related thereto |
| 05/06/2004 | US20040084322 Brightener additive and bath for alkaline cyanide-free zinc electroplating |
| 05/06/2004 | EP1415365A1 Polymer electrolyte membrane for electrochemical and other applications |
| 05/06/2004 | EP1415021A1 Copper on invar composite and method of making |
| 05/05/2004 | CN1494606A Bath for galvanic deposition of gold and gold alloys, and use thereof |
| 05/05/2004 | CN1494388A Ornament having white coating film and mfg. method thereof |
| 05/05/2004 | CN1148469C Vulcanized elastic material product, article and its reinforcing structure |
| 05/05/2004 | CN1148463C Roll forming structure steel profiles with galvanised coating |
| 05/04/2004 | US6730209 Using polyol additive |
| 05/04/2004 | CA2222759C Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof |
| 04/29/2004 | WO2004035875A2 Method for bronze galvanic coating |
| 04/29/2004 | WO2004035874A1 Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith |
| 04/29/2004 | WO2004016829A3 Electrolytic copper plating solutions |
| 04/29/2004 | US20040082489 Electroplating or electroless deposition of a metal or alloy from a solution containing free dithionic acid |
| 04/28/2004 | EP1412560A1 Electrolytic process for depositing a layer of copper on a steel wire |
| 04/27/2004 | US6726827 Electroplating solution for high speed plating of tin-bismuth solder |
| 04/22/2004 | WO2004034421A2 Method for electric field assisted deposition of films of nanoparticles |
| 04/22/2004 | WO2004033762A1 Method for electrolytic coating of materials with aluminium, magnesium or aluminium and magnesium alloys |
| 04/22/2004 | WO2003041661A9 Surface treatment of titanium and its alloys, dental applications |
| 04/22/2004 | US20040074778 Plating bath and method for depositing a metal layer on a substrate |
| 04/22/2004 | US20040074775 Acid copper solutions is used for applying copper to decorative articles, such as aluminium alloy automotive wheels and plastic parts for automotive use. The benefits include an improved thickness distribution of the copper |
| 04/21/2004 | EP1410451A2 Electrochemical cells and an interchangeable electrolyte therefore |