| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 02/19/2004 | US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/19/2004 | US20040031461 Chrome plated engine valve |
| 02/18/2004 | CN1476740A Printed wiring board-use copper foil and copper clad laminated sheet using printed wiring board-use copper foil |
| 02/18/2004 | CN1476492A Method of copper-plating small-diameter holes |
| 02/18/2004 | CN1476116A Method for mfg. foamed metal substrate and electrode for alkali battery |
| 02/12/2004 | WO2004013382A1 Electrolytic baths for depositing tin or a tin alloy |
| 02/12/2004 | US20040029006 Smooth surfaces, fine crystal structure; tensile strength, elongation |
| 02/12/2004 | US20040026260 Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys |
| 02/12/2004 | US20040026259 Plating crushable zinc alloy; alkaline pH |
| 02/12/2004 | DE10006128B4 Plattierungsbad zum Abscheiden einer Sn-Bi-Legierung und dessen Verwendung The plating bath for depositing a Sn-Bi alloy and the use thereof |
| 02/11/2004 | CN1473963A Iron-manganese alloy plating liquid and method for plating parts |
| 02/11/2004 | CN1138021C Microcyanic acid plating brightener |
| 02/05/2004 | WO2004011698A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 02/05/2004 | WO2004011188A1 Brazing product and method of manufacturing a brazing product |
| 02/05/2004 | US20040022940 Can reinforce the thin portion of the seed layer and ensures complete filling with copper of the fine recesses, and which is so stable that its performance is not lowered after a long-term continuous use thereof. |
| 02/05/2004 | US20040020783 Copper bath and methods of depositing a matt copper coating |
| 02/05/2004 | US20040020567 For in-situ conversion coating to the surface of the substantially metallic coating |
| 02/05/2004 | CA2493037A1 Brazing product and method of manufacturing a brazing product |
| 02/04/2004 | CN1473089A Brazing product having low melting point |
| 02/04/2004 | CN1137511C Method for galvanically forming conductor structures of high-purity copper in production of integrated circuits |
| 01/29/2004 | WO2004009876A1 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same |
| 01/29/2004 | WO2003056061A3 Polymer derivatives for the treatment of metals |
| 01/29/2004 | US20040016646 Utilizing self assembly of surfactant-inorganic aggregates at solid-liquid interfaces wherein working electrode serves as a solid-liquid interface in a plating solution containing surfactant |
| 01/27/2004 | US6682642 Seed repair and electroplating bath |
| 01/27/2004 | US6681484 Method for manufacturing electronic component |
| 01/22/2004 | WO2004007809A2 Plain bearing having an overlay alloy layer |
| 01/22/2004 | US20040011654 Performing the regular electrolysis in a range of current density of 1 to 2 A/dm2 |
| 01/22/2004 | US20040011432 Metal alloy electrodeposited microstructures |
| 01/21/2004 | CN1469940A Copper electroplating using insoluble anode |
| 01/21/2004 | CN1468981A Electroplating method for aluminium alloy electroplating steel plate |
| 01/21/2004 | CN1468980A Electroplating solution |
| 01/20/2004 | US6679983 Bath, source of metal ions, an electrolyte comprising two or more acids and optional additive(s); fill of small features with less overplate; copper electroplating |
| 01/15/2004 | WO2004005589A1 Bath for gold electrodeposition |
| 01/15/2004 | WO2004005528A2 Pyrophosphoric acid bath for use in copper-tin alloy plating |
| 01/15/2004 | WO2003056062A3 Polymer derivatives for treating metals |
| 01/15/2004 | US20040007611 Asymmetric plating |
| 01/15/2004 | US20040007473 Electrolyte/organic additive separation in electroplating processes |
| 01/15/2004 | US20040007469 Forming three-dimensional multilayer structures by electroplating, ammonium citrate is included to improve anode dissolving, prevent deposits defect and short circuits, use low voltage; copper deposits has ductility, noncracking |
| 01/14/2004 | CN1468327A Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/14/2004 | CN1134558C Bright tin-copper alloy electroplating liquid and its preparation method |
| 01/14/2004 | CN1134557C Zinc plated steel plate and its producing method |
| 01/13/2004 | US6677233 Material deposition from a liquefied gas solution |
| 01/13/2004 | US6677057 Zinc(zn)-cobalt(co)-tungsten(w); tungsten plating is carried out with metallic tungsten; nonsludging electrolyte comprising zinc chloride, cobalt chloride, tungsten, citric acid, polyoxyethylene glycol, and an electroconductive aid |
| 01/13/2004 | US6677056 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 01/13/2004 | US6676992 Article protected by a diffusion aluminide coating applied by painting techniques |
| 01/13/2004 | US6676823 Fluoboric acid, alkane sulfonic acid, alkanol sulfonic acid, copper sulfate, chloride ion source and brightener; high speed; high current densities |
| 01/08/2004 | DE10227362A1 Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen Complexing agents for the treatment of metal and plastic surfaces |
| 01/07/2004 | EP1378590A1 Bath for gold electro deposition |
| 01/07/2004 | EP1377696A1 Back-end metallisation process |
| 01/07/2004 | CN1465753A Electroplating method for internal surface of crystallizer |
| 01/07/2004 | CN1465752A Copper electroplating solution and method |
| 01/02/2004 | EP1373336A2 Use of polyolefins with alkaline, aromatic substituents as auxiliaries in the electrolytic deposition of metal layers |
| 12/31/2003 | WO2004001823A1 Semiconductor device manufacturing method |
| 12/31/2003 | WO2004001101A2 Electrolytic bath for the electrodeposition of noble metals and their alloys |
| 12/31/2003 | WO2004001099A2 Complexing agent for treating metallic and plastic surfaces |
| 12/31/2003 | CN1464076A Rose metal coating |
| 12/31/2003 | CN1132967C Composite electroforming process of copper-base composite material |
| 12/31/2003 | CA2489916A1 Complexing agent for treating metallic and plastic surfaces |
| 12/30/2003 | US6669828 For the electrochemical reduction of organic compounds |
| 12/25/2003 | US20030234183 Electroplating metal with thin dense chromium by immersing the metal in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics |
| 12/24/2003 | WO2003048427A3 Pretreatment process for coating of aluminium materials |
| 12/24/2003 | CN1132239C Method of mfg. semiconductor device |
| 12/18/2003 | US20030233004 Process for the preparation of alkali metal tetraalkylaluminates and use thereof |
| 12/17/2003 | EP1371757A1 Leveler compound for copper plating baths |
| 12/17/2003 | EP1371653A1 Process for the preparation of alkalitetraalkylaluminates and use thereof |
| 12/11/2003 | WO2003102276A1 Method for producing organoaluminium complexes and the use thereof for producing electrolyte solutions for the electrochemical deposition of aluminium-magnesium alloys |
| 12/11/2003 | US20030228249 Stable aqueous suspension liquid of finely divided diamond particles, metallic film containing diamond particles and method of producing the same |
| 12/11/2003 | US20030227782 High temperature lighting bulb shield |
| 12/11/2003 | US20030226759 Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| 12/11/2003 | US20030226758 Tin plating method |
| 12/10/2003 | EP1368827A2 Electrochemical methods for polishing copper films on semiconductor substrates |
| 12/09/2003 | US6660633 Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed |
| 12/09/2003 | US6660154 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 12/09/2003 | US6660153 Seed layer repair bath |
| 12/09/2003 | US6660137 System for electrochemically processing a workpiece |
| 12/04/2003 | WO2003100137A2 Acid plating bath and method for the electolytic deposition of satin nickel deposits |
| 12/04/2003 | WO2003100136A2 Alkaline zinc-nickel bath with increased current efficiency |
| 12/04/2003 | US20030221969 Copper sulfate plating bath is used which contains a polyether containing at least five ether oxygen atoms in molecule, and a compound represented by formula of R1-S-(CH2O)n-R2-SO3M (wherein, R1 is a hydrogen atom, -(S)n-(CH2O)n-R2-SO3M, or |
| 12/04/2003 | US20030221966 A patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC |
| 12/03/2003 | EP1366219A2 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 12/03/2003 | EP0966556B1 Graded metal hardware component for an electrochemical cell |
| 12/03/2003 | CN1460135A Back-end metallisation process |
| 12/03/2003 | CN1460134A Copper-plating solution, plating method and plating apparatus |
| 11/27/2003 | WO2003098673A1 Polishing method and polishing system, and method for fabricating semiconductor device |
| 11/26/2003 | EP1364079A1 A process for electrochemical deposition of tantalum and an article having a surface modification |
| 11/26/2003 | EP1363683A1 Implant and process of modifying an implant surface |
| 11/26/2003 | EP1142041B1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
| 11/26/2003 | CN1458304A Tin plating method |
| 11/25/2003 | US6652914 Method for selective surface protection of a gas turbine blade which has previously been in service |
| 11/25/2003 | US6652731 Comprises 2,3,4-trihydroxybenzaldehyde for inhibiting consumption of plating additives; integrated circuits |
| 11/25/2003 | US6652730 Deposition of alkali tetraalkylaluminate, trialkylaluminum and magnesium component; reducing contact corrosion |
| 11/25/2003 | US6652728 Cyanide-free aqueous alkaline bath used for the galvanic application of zinc or zinc-alloy coatings |
| 11/25/2003 | US6652725 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus |
| 11/20/2003 | WO2003096776A1 Flexible printed wiring board for chip-on-film |
| 11/20/2003 | US20030213699 Nickel electroplating solution |
| 11/19/2003 | EP1285104B1 Electrolyte and method for depositing tin-silver alloy layers |
| 11/19/2003 | EP1257693B1 Composite copper foil and manufacturing method thereof |
| 11/19/2003 | CN1456710A Method for controlling tin loss in tin or tin alloys electroplating solution oxidation |
| 11/18/2003 | US6649038 Electroplating method |
| 11/18/2003 | US6649034 Electro-chemical metal alloying for semiconductor manufacturing |