| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 09/02/2004 | US20040168928 Using a metal compound; polymerization inhibitor ,promoter and electrolyte; heating, controlling temperature |
| 09/02/2004 | DE4429911B4 Spiralkompressor Scroll compressor |
| 09/02/2004 | DE10306823A1 Anti-rust metal high speed galvanisation process for e.g. automotive industry with zinc and manganese alloy |
| 09/02/2004 | DE102004005868A1 Kupferbadzusammensetzung zur stromlosen und/oder elektrolytischen Füllung von Durchkontaktierungen und Leiterbahnen bei der Herstellung von integrierten Schaltungen Kupferbadzusammensetzung for electroless and / or electrolytic filling of vias and conductive traces in the manufacture of integrated circuits |
| 09/02/2004 | CA2516053A1 Process for coating a surface |
| 09/01/2004 | EP1452628A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 09/01/2004 | EP1452627A2 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 09/01/2004 | EP1451392A2 Pretreatment process for coating of aluminium materials |
| 09/01/2004 | CN1525492A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 08/31/2004 | US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating |
| 08/31/2004 | US6783653 Providing substrate with a low emissivity surface; depositing a nanostructured selective absorption layer atop low emissivity surface; applying a sol-gel precursor overcoating to absorption layer; curing sol-gel precursor overcoating |
| 08/31/2004 | US6782650 Self lubricating firearm having at least one component coated with nodular nickel coating wherein the nodular nickel coating is an electroless deposited nickel boron coating |
| 08/26/2004 | WO2004072320A2 Use of n-allyl substituted amines and their salts as brightening agents in nickel plating baths |
| 08/26/2004 | US20040163842 Flexible printed wiring board for chip-on-film |
| 08/25/2004 | EP1449939A2 Rolled product and corresponding production process |
| 08/25/2004 | EP1449269A1 Current collector structure and methods to improve the performance of a lead-acid battery |
| 08/25/2004 | CN1524136A Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 08/25/2004 | CN1523951A Chip-on-film use copper foil |
| 08/25/2004 | CN1163994C Base plate for electrode base of secondary cell, secondary cell electrode base, process for producing same and electrode and cell producing therefrom |
| 08/25/2004 | CN1163638C Electrodeposit copper foil mfg method |
| 08/19/2004 | WO2004055246A8 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 08/19/2004 | US20040161627 a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns |
| 08/18/2004 | EP1448036A1 Copper foil for fine pattern printed circuits and method of production same |
| 08/18/2004 | EP1448035A1 Chip-on-film use copper foil |
| 08/18/2004 | EP1446262A1 Improvements in fluxless brazing |
| 08/18/2004 | EP1446261A1 Product and method for low temperature fluxless brazing |
| 08/18/2004 | EP1446260A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 08/18/2004 | CN1522316A Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same |
| 08/18/2004 | CN1162571C Plating solution for electrodepositing bright Zn-Fe alloy with low Fe content from sulfate system |
| 08/18/2004 | CN1162570C Brightening agent for cyaniding silvering |
| 08/17/2004 | US6776893 Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| 08/17/2004 | US6776891 Plating alloy using electrolytic cells |
| 08/12/2004 | US20040157080 Copper foil for fine pattern printed circuits and method of production of same |
| 08/12/2004 | US20040154930 Copper foil for high frequency circuit and method of production of same |
| 08/12/2004 | US20040154928 Use of N-allyl substituted amines and their salts as brightening agents in nickel plating baths |
| 08/12/2004 | US20040154926 Multiple chemistry electrochemical plating method |
| 08/12/2004 | DE10196930T5 Elektroplattierungschemie zum Füllen von Submikro-Merkmalen von VLSI/ULSI Verbindungen mit Kupfer Elektroplattierungschemie for filling sub-micron features of VLSI / ULSI compounds with copper |
| 08/12/2004 | DE10059139B4 Verwendung einer organischen Schwefelverbindung in einem sauren Elektrolyten zur Abscheidung von Zinn-Kupfer-Legierung Use of an organic sulfur compound in an acidic electrolyte for deposition of tin-copper alloy |
| 08/10/2004 | US6773827 Multilayer exterior electrodes |
| 08/10/2004 | US6773573 Plating bath and method for depositing a metal layer on a substrate |
| 08/10/2004 | US6773568 Metal alloy compositions and plating methods related thereto |
| 08/10/2004 | US6773247 Die used for resin-sealing and molding an electronic component |
| 08/05/2004 | WO2004065663A1 Tin-containing plating bath |
| 08/05/2004 | US20040152303 Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| 08/05/2004 | US20040149588 Electrolytic cooper plating method, phosphorus-containing anode for electrolytic cooper plating, and semiconductor wafer plated using them and having few particles adhering to it |
| 08/05/2004 | US20040149587 Oxidation inhibition; using at small excess to minimize agglomeration; stannous and/or lead(II) plating |
| 08/05/2004 | US20040149583 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same |
| 08/04/2004 | EP1442160A2 Electrolysis bath for electrodepositing silver-tin alloys |
| 08/04/2004 | EP1363683B1 Implant and process of modifying an implant surface |
| 08/04/2004 | CN1160487C Process for plating flexible graphite products with thick silver layer |
| 08/03/2004 | US6770185 Zinc and tin ions, aliphatic carboxylic acids and salts, and nonionic and anionic surfactants |
| 08/03/2004 | US6769160 Sn plating layer as the outermost layer of an outer electrode; avoid the formation of whiskers |
| 07/29/2004 | US20040144656 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid |
| 07/29/2004 | DE10303649A1 Coating of objects such as plastic sprays comprises application of a layer of copper, nickel or a copper-nickel alloy, mechanical surface treatment of at least the outer applied layer and application of a nickel-tungsten layer |
| 07/28/2004 | CN1516754A Mixture for use as brightening agent in electrodeposit solution of silver gold orone of their alloys |
| 07/28/2004 | CN1515703A Method for electroforming nickel-cobalt alloy |
| 07/27/2004 | US6767817 Asymmetric plating |
| 07/22/2004 | WO2004061924A1 Method of producing thin films of compound i-iii-vi, promoting the incorporation of iii elements in the film |
| 07/22/2004 | WO2004061162A1 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 07/22/2004 | US20040140220 Aluminium electroplating formulations |
| 07/22/2004 | US20040140219 Electroplating; electrical current is passed through solution and substrate to cause electroconductive material to deposit on substrate under electromotive force caused by electrical current; alloys on semiconductors |
| 07/21/2004 | CN1514889A Copper plating solution and method for copper plating |
| 07/20/2004 | US6765757 Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | WO2004059041A1 Electrodeposition of biaxial textured films |
| 07/15/2004 | WO2004059040A1 Copper electrolytic solution containing quaternary amine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith |
| 07/15/2004 | US20040138075 Reaction product of a organohalogen compound and modified ether compound |
| 07/15/2004 | US20040137162 Copper plating solution and method for copper plating |
| 07/15/2004 | DE19512196B4 Kupferfolien für Basismaterial von gedruckten Schaltungen sowie Verfahren zur Oberflächenbehandlung der Kupferfolien Copper foil for the base material of printed circuits as well as method for surface treatment of the copper foils |
| 07/15/2004 | DE10060127B4 Elektrolytisches Eisenabscheidungsbad und Verfahren zum elektrolytischen Abscheiden von Eisen und Anwendungen des Verfahrens Electrolytic Eisenabscheidungsbad and method for the electrolytic deposition of iron and applications of the method |
| 07/14/2004 | CN1511976A Method for producing anti-folding electrolytic copper foil |
| 07/14/2004 | CN1157502C Gold electroplatic method for flowers |
| 07/08/2004 | WO2004057061A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 07/08/2004 | US20040132299 Method for depositing lead-free tin alloy |
| 07/07/2004 | CN1510174A Method for depositing non-lead tin alloy |
| 07/01/2004 | WO2004055246A1 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 07/01/2004 | WO2004038070A3 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 07/01/2004 | WO2004034421A3 Method for electric field assisted deposition of films of nanoparticles |
| 06/30/2004 | EP1432848A1 Process and composition for high speed plating of tin and tin alloys |
| 06/30/2004 | CN1509351A Copper electroplating method, phosphorus-copper anode for copper electroplating, and semiconductor wafer with minimal particle adhesion plated by using them |
| 06/30/2004 | CN1509204A Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof |
| 06/30/2004 | CN1508296A Electroplating device and method thereof |
| 06/30/2004 | CN1508294A Additive for electroplating liquid and its use in tin-lead alloy plating |
| 06/30/2004 | CN1155739C Brightening agent for electroplated Sn-Bi alloy and its preparing process |
| 06/30/2004 | CN1155738C Brightening agent for cyanated silver plating |
| 06/29/2004 | US6756134 Into nickel metal or alloy electrodeposited layer; gas turbine engines |
| 06/29/2004 | US6755960 Zinc-nickel electroplating |
| 06/29/2004 | US6755958 For a copper alloy surface; electroplated barrier layer consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, or rhodium. |
| 06/24/2004 | WO2004054016A2 Electrochemical cell suitable for use in electronic device |
| 06/24/2004 | WO2004053203A2 Method for the electrolytic deposition of magnesium or magnesium-zinc on galvanised sheet metal |
| 06/24/2004 | WO2004053202A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 06/24/2004 | WO2004053193A1 Peel strength enhancement of copper laminates 102426-201 |
| 06/24/2004 | WO2004053182A2 Nodular nickel boron coating |
| 06/24/2004 | US20040118699 Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118691 Electroplating method |
| 06/24/2004 | US20040118676 Plating apparatus and plating method |
| 06/24/2004 | CA2505282A1 Electrochemical cell suitable for use in electronic devices |
| 06/23/2004 | EP1431424A2 Plating apparatus and plating method |
| 06/23/2004 | EP1430166A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |