| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 08/26/2003 | US6610191 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate |
| 08/21/2003 | US20030155409 Fluxless brazing |
| 08/21/2003 | US20030155247 Electrolysis of copper compound; adjustment ph |
| 08/19/2003 | US6607844 Coating zinc, magnesium and/or alloys on metal sheets by electrolysis to form films having corrosion resistance |
| 08/19/2003 | US6607654 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect |
| 08/19/2003 | US6607653 Plating bath and process for depositing alloy containing tin and copper |
| 08/14/2003 | WO2003066936A2 Commercial process for electroplating nickel-phosphorus coatings |
| 08/14/2003 | US20030152705 Article protected by a diffusion aluminide coating applied by painting techniques |
| 08/14/2003 | US20030150743 Divalent tin ions; acid or complexing agent that forms a water-soluble salt or complex with the tin; one or more metals selected from elements of Groups IB to VB of the fourth to sixth periods |
| 08/14/2003 | US20030150742 Copper is plated on the printed wiring board from a bath containing nickel and copper, followed by plating nickel from the same bath |
| 08/13/2003 | CN1435514A Process for obtaining high-wear-resistant friction-reducing composite function nano-coating |
| 08/13/2003 | CN1117885C Hot-dip galvanizing bath and process |
| 08/12/2003 | US6605370 Joining product having a base substrate of an aluminium alloy comprising silicon; nickel layer; welding; fuel tanks; no need for a vacuum atmosphere nor a protective gas |
| 08/12/2003 | US6605204 Electroplating of copper from alkanesulfonate electrolytes |
| 08/07/2003 | US20030146102 Method for forming copper interconnects |
| 08/07/2003 | DE19981324C2 Verfahren zur Herstellung eines Sputtertargetmaterials A method for producing a Sputtertargetmaterials |
| 08/06/2003 | CN1117180C Process for conditioning copper or copper-alloy external surface of element of mould for continuous casting of metals |
| 08/06/2003 | CN1117179C Pd-Ni alloy and rare earth-Pd-Ni alloy plating materials for plating electric brush |
| 08/06/2003 | CN1117178C Technology process and equipment for depositing permalloy film electrically |
| 08/06/2003 | CN1117177C Main component of brightening agent for galvanization and brightening agent prepared from it |
| 08/05/2003 | US6602394 Alkali zinc nickel bath |
| 07/31/2003 | WO2003062502A1 METHOD FOR FORMING Re-Cr ALLOY COATING FILM THROUGH ELECTROPLATING USING Cr(IV)-CONTAINING BATH |
| 07/31/2003 | WO2003062501A1 METHOD FOR FORMING Re ALLOY COATING FILM HAVING HIGH Re CONTENT THROUGH ELECTROPLATING |
| 07/31/2003 | WO2003062500A1 METHOD FOR FORMING Re COATING FILM OR Re-Cr ALLOY COATING FILM THROUGH ELECTROPLATING |
| 07/31/2003 | US20030141195 Zinc, or alloy thereof, matte finishing; automobile protective coating |
| 07/31/2003 | US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
| 07/30/2003 | CN1433572A Novel chip interconnect and packaging deposition methods and structures |
| 07/30/2003 | CN1432666A Copper electroplating method |
| 07/30/2003 | CN1116789C Copper foil for printed circuit board and its manufacture, and stacked body and printed circuit board using the copper foil |
| 07/30/2003 | CN1116445C High current density zinc chloride electrogalvanizing process and composition |
| 07/30/2003 | CN1116444C Additive for electroplating satin face nickel |
| 07/30/2003 | CN1116443C Additive for electroplating satin face nickel |
| 07/30/2003 | CN1116442C Additive for electroplating satin face nickel |
| 07/30/2003 | CN1116441C Surface treating additive and its application |
| 07/29/2003 | US6599411 Method of electroplating a nickel-iron alloy film with a graduated composition |
| 07/24/2003 | WO2003060959A2 Method for applying metal features onto barrier layers using electrochemical deposition |
| 07/24/2003 | WO2003060198A1 A tubular member having an anti-galling coating |
| 07/24/2003 | US20030136683 Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density |
| 07/23/2003 | CN1432074A Electrolyte and method for depositing tin-silver alloy layers |
| 07/23/2003 | CN1431394A Method for repairing worn out cylinder liner of internal-combustion engines |
| 07/22/2003 | US6596413 Brazing product having a low melting point |
| 07/22/2003 | US6596410 Chrome-plated sliding member and manufacturing method thereof |
| 07/22/2003 | US6596151 Electrodeposition chemistry for filling of apertures with reflective metal |
| 07/22/2003 | US6596149 Making a semiconductor memory device |
| 07/17/2003 | WO2003058655A1 Material deposition from a liquefied gas solution |
| 07/17/2003 | WO2003056966A1 Decorative article having white coating and method for manufacture thereof |
| 07/17/2003 | US20030134142 Varying an electroplating current to electrodeposit alloy species with different properties in a controlled manner, e.g. the gold-tin alloy system; first alloy and second alloy species differ in stoichiometry, e.g., Au5n and AuSn |
| 07/17/2003 | US20030132122 Electroplating solution for high speed plating of tin-bismuth solder |
| 07/17/2003 | US20030131753 Electroplating solution for high speed plating of tin-copper solder |
| 07/16/2003 | CN1430683A Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 07/16/2003 | CN1430579A Palladium complex salt and use thereof for adjusting palladium concentration of electrolytic solution for deposit of palladium or its alloys |
| 07/16/2003 | CN1114720C Method of electrodeposition of multifunction metal-base composite |
| 07/16/2003 | CN1114719C Surface treated aluminium material with good processing sealing and connection and crossion-resisting |
| 07/10/2003 | WO2003056062A2 Polymer derivatives for treating metals |
| 07/10/2003 | WO2003056061A2 Polymer derivatives for the treatment of metals |
| 07/10/2003 | US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 07/10/2003 | US20030127015 Stabilizers for electroless plating solutions and methods of use thereof |
| 07/10/2003 | CA2472120A1 Polymer derivatives for treating metals |
| 07/10/2003 | CA2472116A1 Polymer derivatives for the treatment of metals |
| 07/09/2003 | EP1325972A1 Copper electroplating using insoluble anode |
| 07/09/2003 | EP1325175A1 Electrolyte and method for depositing tin-copper alloy layers |
| 07/09/2003 | EP1324979A2 Ionic liquids and their use as solvents |
| 07/09/2003 | CN1429283A Satin-finished nickel or nickel alloy coating |
| 07/09/2003 | CN1113982C Non-cyanide brass plating bath and method of making metallic foil having brass layer using the same |
| 07/09/2003 | CN1113981C Technology of palladium-plating electric brush for commutator of special miniature motor |
| 07/09/2003 | CN1113980C High fatigue ductility electrodeposited copper foil |
| 07/08/2003 | US6589413 Method of making a copper on INVAR® composite |
| 07/08/2003 | US6588408 Cylinder liner for diesel engines with EGR and method of manufacture |
| 07/03/2003 | US20030124840 Material deposition from a liquefied gas solution |
| 07/03/2003 | US20030121794 Method for the deposition of a chromium alloy |
| 07/03/2003 | US20030121789 Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil |
| 07/02/2003 | EP1323850A1 Electroplating method of printed circuit with pulsed current density |
| 07/02/2003 | EP1323849A1 Nickel electroplating solution |
| 07/02/2003 | EP1323848A1 Nickel electroplating solution |
| 07/02/2003 | EP1322591A2 Ionic liquids and their use |
| 07/02/2003 | CN1427901A Method of mfg. aluminium product |
| 07/02/2003 | CN1427094A Electroplating method |
| 07/01/2003 | US6586513 Aqueous dispersion for electrodeposition comprising selected inorganic particles having specified mean particle size and dielectric constant, and organic particles comprised of polyimide-based resin having charge on surface |
| 07/01/2003 | US6585877 Acid resistance; waterproof |
| 07/01/2003 | US6585812 High current density zinc sulfate electrogalvanizing process and composition |
| 06/26/2003 | US20030118742 Method for enhancing the solderability of a surface |
| 06/26/2003 | US20030116442 Method for applying a metal layer to a light metal surface |
| 06/26/2003 | US20030116441 Overcoating; prevention impedance, vibration; efficiency |
| 06/25/2003 | EP1321468A1 Hydantoin-based gold complex |
| 06/25/2003 | CN1425799A Stabilizing agent for chemical plating solution and using method for said stabilizing agent |
| 06/25/2003 | CN1112729C Electric connection structure in electronic device and forming method for conductor surface material |
| 06/24/2003 | US6582582 Polyiminodi-1,3-propylene malonamide reacted with phthalic anhydride as brightener |
| 06/20/2003 | CA2365749A1 An electrodeposition process and a layered composite material produced thereby |
| 06/19/2003 | WO2002033153A3 Copper bath and method of depositing a matt copper coating |
| 06/19/2003 | US20030111354 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte |
| 06/19/2003 | US20030111353 Gold complex |
| 06/19/2003 | US20030111352 Rhodium in dissolved form with an alkyl sulfate or sulfonate derivativewhitener |
| 06/19/2003 | US20030111351 Surface treatment method of copper foil with silane coupling agent |
| 06/19/2003 | US20030111349 Electrolytic processes with reduced cell voltage and gas formation |
| 06/18/2003 | EP1319093A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 06/17/2003 | US6579437 Acid resistance |
| 06/12/2003 | WO2003048429A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 06/12/2003 | WO2003048427A2 Pretreatment process for coating of aluminium materials |
| 06/12/2003 | US20030106802 Reaction product of amines with glycidyl ether or quaternary ammonium compound |
| 06/11/2003 | EP1102875B1 Alkali zinc nickel bath |