| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 01/10/2002 | US20020004145 Crown compounds |
| 01/10/2002 | US20020003092 Refractory metal plates of are tightly, form-fittingly joined together back to back and coated with platinum on exposed surfaces by melt electrolysis, then separating plates; use as anodes in electrolytic and electroplating processes |
| 01/10/2002 | DE10129648A1 Production of a solderable layer and a contact layer on metal elements used in the production of leadframes and relay contacts comprises using an electrochemical coating process |
| 01/09/2002 | EP1170401A2 Process for the manufacture of one side platinised panels and expanded mesh sheets made of refractory metals |
| 01/09/2002 | CN1330733A Method for improving macro throwing power for nickel, zinc orzinc alloy electroplating baths |
| 01/09/2002 | CN1330509A Copper foil for printed circuit board and its surface treatment method |
| 01/09/2002 | CN1329969A Method for preparing one-sided platinum plated refractory metal plate and extended metal grid |
| 01/08/2002 | US6337145 Electroplating on overlay of lead-tin-copper from a ternary fluoroborate-free electroplating bath without brighteners and with non-ionic wetting agent and free alkyl sulfonic acid; heat treating galvanic overlay |
| 01/08/2002 | US6337007 Electroplating a bath containing water-soluble cobalt, iron, nickel salts and diethylenetriamine, alanine, glycine, glutamic acid and salts free of sulfur |
| 01/08/2002 | CA2228095C Electrode structural body, rechargeable battery provided with said electrode structural body, and process for the production of said electrode structural body and said rechargeable battery |
| 01/03/2002 | WO2000061837A9 Workpiece processor having processing chamber with improved processing fluid flow |
| 01/03/2002 | US20020002128 Aqueous solutions containing dithionic acid and/or metal dithionate |
| 01/03/2002 | US20020001712 Electronic component, method for producing electronic component, and circuit board |
| 01/03/2002 | US20020000382 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current |
| 01/03/2002 | DE10029837A1 Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen Process for the preparation of platinum-plated plates on one side and expanded metal grids made from refractory metals |
| 01/02/2002 | EP1167583A2 Copper-plating liquid, plating method and plating apparatus |
| 01/02/2002 | EP1167582A1 Metal alloy compositions and plating method related thereto |
| 01/02/2002 | EP1167580A1 Electrolytic copper foil |
| 01/02/2002 | EP1086262A4 Electroplating baths |
| 01/01/2002 | CA2222618C Gradient interface composites and methods therefor |
| 12/27/2001 | WO2001099217A1 Method of fabricating catalyzed porous carbon electrode for fuel cell |
| 12/27/2001 | WO2001051681A3 Lustrous metal surfaces |
| 12/27/2001 | US20010054557 Electroplating of metals using pulsed reverse current for control of hydrogen evolution |
| 12/26/2001 | CN1328434A Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
| 12/25/2001 | US6333560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/20/2001 | WO2001096631A1 Zinc-nickel electroplating |
| 12/20/2001 | US20010052466 Capacitor having electrode formed by electroplating and manufacturing method thereof |
| 12/19/2001 | EP0857226B1 Tin plating electrolyte compositions |
| 12/19/2001 | CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 12/19/2001 | CN1327090A Additive for electroplating satin face nickel |
| 12/19/2001 | CN1327089A Additive for electroplating satin face nickel |
| 12/19/2001 | CN1327088A Additive for electroplating satin face nickel |
| 12/18/2001 | US6331240 Tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, chelating agent, a caustic alkali; cyanide-free; smoothness |
| 12/13/2001 | WO2000029501A9 Radioactive coating solutions, methods, and substrates |
| 12/13/2001 | US20010050179 Single bath electrodeposition |
| 12/13/2001 | DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries |
| 12/13/2001 | DE10026956A1 Zink-Legierungsbad Zinc alloy bath |
| 12/12/2001 | EP1162289A1 Palladium electroplating bath and process for electroplating |
| 12/12/2001 | CN1326593A Battery sheath made of formed cold-rolled sheet and method for producing battery sheaths |
| 12/12/2001 | CN1326015A Tin electrolyte |
| 12/12/2001 | CN1326014A Surface treating additive and its application |
| 12/12/2001 | CN1325790A Copper film for TAB band carrier and TAB carried band and TAB band carrier |
| 12/11/2001 | US6329074 Alloy layer comprising copper, zinc, tin and nickel, chromate layer |
| 12/11/2001 | US6329071 Chrome plated parts and chrome plating method |
| 12/11/2001 | US6328871 Depositing a barrier layer comprising tantalum over the surface; annealing the barrier layer to form high conductance barrier layer; depositing a seed layer over the barrier layer |
| 12/06/2001 | WO2001092606A1 Electrolyte and method for depositing tin-silver alloy layers |
| 12/06/2001 | WO2001092605A1 Zinc alloy bath |
| 12/06/2001 | US20010049027 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding |
| 12/06/2001 | US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 12/06/2001 | DE10103445A1 Stahlwerkstoff mit hoher Ermüdungsfestigkeit sowie Verfahren zur Herstellung des Stahlmaterials Steel material having high fatigue resistance as well as methods for producing the steel material |
| 12/05/2001 | EP1036221B1 Electroplating formulation and process for plating iron directly onto aluminum or aluminum alloys |
| 12/04/2001 | US6325107 Metal pipeline having a protective coating layer for an automobile |
| 11/29/2001 | US20010045363 Mixture of platinum salt and carbonate |
| 11/28/2001 | EP1157076A1 Radioactive coating solutions, methods, and substrates |
| 11/28/2001 | EP0785584B1 Precoated steel sheet for positive electrode can of alkaline dry cell |
| 11/27/2001 | US6323120 Method of forming a wiring film |
| 11/27/2001 | US6322904 Copper foil for printed circuit boards |
| 11/27/2001 | US6322686 Tin electrolyte |
| 11/22/2001 | WO2001089024A1 Electrochemical methods and cells |
| 11/22/2001 | WO2001088228A1 Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in the electrolysis apparatus |
| 11/22/2001 | WO2001088227A1 Satin-finished nickel or nickel alloy coating |
| 11/22/2001 | WO2001088226A2 Method of manufacturing an aluminium product |
| 11/22/2001 | WO2001059185A8 Pre-plate treating system |
| 11/22/2001 | US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 11/22/2001 | US20010042686 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus |
| 11/21/2001 | EP0975823B1 Electrolytic high-speed deposition of aluminium on continuous products |
| 11/20/2001 | US6319621 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same |
| 11/20/2001 | US6319387 Copper alloy electroplating bath for microelectronic applications |
| 11/20/2001 | US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling |
| 11/20/2001 | US6319190 Medicinal radioactive ruthenium radiation sources with high dosage rate and method for producing the same |
| 11/14/2001 | EP1153430A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 11/14/2001 | EP0950128A4 Prevention of marine encrustation on bronze propellers |
| 11/08/2001 | WO2001083856A1 Surface treatment of parts of die-cast and extrusion machines |
| 11/08/2001 | WO2001083854A2 Electroplating bath composition and method of using |
| 11/07/2001 | EP1152071A1 Copper plating method |
| 11/07/2001 | EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 11/07/2001 | EP1151152A1 Solution of electrolytes and method for producing lead-tin layers |
| 11/07/2001 | CN1321205A Aqueous solution for electrodepositing tin-zinc alloys |
| 11/07/2001 | CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
| 11/07/2001 | CN1321061A Method for surface treatment of copper foil |
| 11/07/2001 | CN1320721A Nickel coated high-carbon steel wire for spring and making method thereof |
| 11/06/2001 | US6312580 Electroplating with an acid gold plating solution comprising: soluble alkali metal complex salt of gold an acid electrolyte where an adjusted ph range is 0.1-3.0; eliminates multistage stripping on chromium automobile emblems |
| 10/31/2001 | EP1149190A2 Solution and process for the electrodeposition of gold and gold alloys |
| 10/31/2001 | CN1319435A Process for preparation of broad-spectrum antibacterial compound coating |
| 10/30/2001 | US6309760 Bearing material |
| 10/30/2001 | US6309759 Lining overcoated with bismuth, or alloy thereof |
| 10/30/2001 | US6309529 Method for producing sputtering target material |
| 10/25/2001 | US20010032788 Divided housing |
| 10/24/2001 | EP1148156A2 Copper Electroplating |
| 10/24/2001 | CN1319225A Magnetoresistive devices, giant magnetoresistive devices and methods for making same |
| 10/24/2001 | CN1319148A Black ruthenium plating soluton |
| 10/24/2001 | CN1318655A Electroplating method |
| 10/23/2001 | US6306277 Platinum electrolyte for use in electrolytic plating |
| 10/23/2001 | US6306276 Aqueous electrodeposition of rare earth and transition metals |
| 10/23/2001 | US6306275 Providing plating bath containing electrolyte comprising water soluble nickel salt, polishing agent and alkylene oxide adduct; removing portion of electrolyte from electroplating bath; separating and adding adduct to bath and returning |
| 10/18/2001 | WO2001077418A1 The method for electrodepositing rare-earth and transition metal alloys |
| 10/18/2001 | WO2001077417A1 Electrolytic solution for electrochemical deposit of palladium or its alloys |
| 10/18/2001 | WO2001077025A1 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
| 10/18/2001 | US20010029689 Weapon barrel having a hard chromium inner layer |
| 10/17/2001 | EP1146148A2 Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating |