| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 01/12/2005 | CN1563502A Electrolytic copper foil in use for high accuracy lithium cell smaller than 12 micros and preparation method |
| 01/11/2005 | US6841189 Forming a plating base on the surfaces and introducing a modifying agent to the recess and which absorbs into the surface regions not covered by the plating base |
| 01/06/2005 | US20050000800 Gas liquid phase separator with improved pressure control |
| 01/06/2005 | US20050000600 Ultra high saturation moment soft magnetic thin film |
| 01/05/2005 | EP1493847A2 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 01/05/2005 | CN1561407A Electrolyte tank for electrochemical deposition of gold and its alloys |
| 01/05/2005 | CN1183814C Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board |
| 01/04/2005 | US6837981 Depositing a chromium alloy from chromic acid, sulfuric acid, an isopolyanion-forming molybdenum, vanadium, tungsten or niobium compound, a fluoride and a short chain sulfonic acid, a salt or a halogen derivative |
| 01/04/2005 | US6837980 Bond enhancement antitarnish coatings |
| 12/30/2004 | US20040262165 Plating method |
| 12/30/2004 | US20040262163 Allows electroforming at low temperature; for manufacturing a metal product |
| 12/29/2004 | EP1490675A2 Reference electrode calibration for voltammetric plating bath analysis |
| 12/29/2004 | EP1088650B1 Use of a antifouling material on marine arrangements |
| 12/29/2004 | CN1182571C High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate |
| 12/28/2004 | US6835294 Dummy electrolysis corrects reduction in via-holes filling |
| 12/23/2004 | WO2004111288A2 Fabrication of titanium and titanium alloy anode for dielectric and insulated films |
| 12/23/2004 | WO2004094333A3 Composite article comprising a ceramic coating |
| 12/23/2004 | WO2004053203A3 Method for the electrolytic deposition of magnesium or magnesium-zinc on galvanised sheet metal |
| 12/23/2004 | US20040259365 Polishing method polishing system and method for fabricating semiconductor device |
| 12/23/2004 | US20040256239 Tin plating method |
| 12/23/2004 | US20040256235 Removing one metal from an alloy plating solution containing two kinds of metals that differ in standard electrode potential, and preparing a single metal plating solution from the remaining other metal |
| 12/22/2004 | EP1489203A1 ELECTROLYTIC COPPER PLATING METHOD, PHOSPHORUS−CONTAINING ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER PLATED USING THEM AND HAVING FEW PARTICLES ADHERING TO IT |
| 12/22/2004 | EP1489201A2 Propanesulfonated or 2-hydroxy-propanesulfonated alkylamine alkoxylates, their preparation and use as additives for the electrolytic deposition of metallic layers |
| 12/22/2004 | EP1423557B1 Electrolytic solution for electrochemical deposition of gold and its alloys |
| 12/22/2004 | CN1556253A Preparation method of composite cladding material and equipment |
| 12/22/2004 | CN1181226C Bath for electrolysis depositing highly lustrous white rhodium coatings |
| 12/16/2004 | WO2004108995A1 Zinc and zinc-alloy electroplating |
| 12/16/2004 | WO2004042344A3 Fabrication of a high resolution biological molecule detection device with gold electrical conductors |
| 12/16/2004 | US20040253804 Electroplating compositions and methods |
| 12/16/2004 | US20040251143 Electrolytic tin-plating solution and method for plating |
| 12/16/2004 | US20040251140 Fabrication of titanium and titanium alloy anode for dielectric and insulated films |
| 12/15/2004 | EP1485522A1 High speed acid copper plating |
| 12/15/2004 | CN1555427A Process and composition for high speed plating of tin and tin alloys |
| 12/15/2004 | CN1554804A Applying tungsten base serial non crystal state alloy on electroplating layer for piston ring surface |
| 12/15/2004 | CN1180132C Process for preparing aluminium or aluminium alloy piece, aqueous plating liquid and its use, assembly and its preparing method |
| 12/14/2004 | US6830827 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 12/14/2004 | US6830674 Brightener additive and bath for alkaline cyanide-free zinc electroplating |
| 12/09/2004 | WO2004107833A1 Method for manufacturing copper foilfor printed circuit board |
| 12/09/2004 | US20040249177 For use in copper electroplating ; provides level or uniform metal deposits |
| 12/09/2004 | US20040247920 Rhodium Electroplated structures and methods of making same |
| 12/09/2004 | US20040247865 Using acidic electrolytic bath; containing mixture of thiourea and amino acid |
| 12/09/2004 | US20040245113 Electrochemical cell containing anolyte and catholyte compartments separated by a selective membrane that prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment; latent whiskering is minimized and/or eliminated |
| 12/08/2004 | EP1483430A1 Non-cyanide copper plating process for zinc and zinc alloys |
| 12/08/2004 | CN1178763C Method for making miniature cutter and stereo microstructure |
| 12/07/2004 | US6827834 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and |
| 12/02/2004 | WO2004105051A1 Zinc lanthanide sulfonic acid electrolytes |
| 12/02/2004 | US20040241489 Sliding member |
| 12/02/2004 | US20040238952 Asymmetric plating |
| 12/02/2004 | US20040238078 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 12/01/2004 | EP1264009B1 Method for applying a metal layer to a light metal surface |
| 12/01/2004 | CN1551710A Copper foil for fine pattern printed circuits and method of production of same |
| 12/01/2004 | CN1551259A Method for forming outer electrode of electronic element and said electronic element |
| 12/01/2004 | CN1551247A Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 12/01/2004 | CN1550579A Improved electroplating liquid analysis |
| 12/01/2004 | CN1550577A Improved tin plating method |
| 11/30/2004 | US6824668 Method for electroplating Ni-Fe-P alloys using sulfamate solution |
| 11/30/2004 | US6824597 Stabilizers for electroless plating solutions and methods of use thereof |
| 11/25/2004 | WO2004101860A1 High purity electrolytic sulfonic acid solutions |
| 11/25/2004 | WO2004101859A1 Low surface roughness electrolytic copper foil and process for producing the same |
| 11/25/2004 | US20040232000 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium |
| 11/25/2004 | US20040231999 Aqueous solution of a gold cyanide complex, an organotin complex; and 2,2'-dipyridyl present in an amount effective to allow codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the metal complexes |
| 11/25/2004 | US20040231998 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 11/25/2004 | US20040231995 Contains a pyridinium, bipyridinium, phenanthrolinium, quinolinium or phenazinium salt in the form of onium with an N-alkyl, N-aralkyl, N-aryl, N-alkylene or N-aralkylene moiety; each via-hole is filled totally with the conductive material |
| 11/25/2004 | CA2525064A1 High purity electrolytic sulfonic acid solutions |
| 11/24/2004 | EP1479793A2 Plating method |
| 11/24/2004 | EP1356136B1 Method for producing electrical conductors and use thereof for solar collector and electrochemical cell |
| 11/24/2004 | CN1549876A Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 11/24/2004 | CN1549875A Electrolytic tin-plating solution and method for electroplating |
| 11/24/2004 | CN1176762C High-precision ultra-thin very-wide cold-rolled steel band, chrome-plated steel band for shield of optical fibre cable and technology thereof |
| 11/23/2004 | US6821681 Aqueous solution containing adjuvant; antideposit agent |
| 11/23/2004 | US6821406 Method for surface treatment of gold-plated body and surface-treated product, and process for producing gold-plated body and gold-plated body, and method for immobilization of sulfur-containing molecules |
| 11/18/2004 | US20040229077 Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 11/18/2004 | US20040229068 Nodular nickel boron coating |
| 11/18/2004 | US20040226745 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| 11/18/2004 | DE10238284B4 Verfahren zum Herstellen einer schaumförmigen Metallstruktur, Metallschaum sowie Anordnung aus einem Trägersubstrat und einem Metallschaum A method of manufacturing a foam-like metal structure, metal foam as well as arrangement of a supporting substrate and a metal foam |
| 11/17/2004 | EP1477588A1 Copper Electroplating composition for wafers |
| 11/17/2004 | EP1477587A2 Improved tin plating method |
| 11/17/2004 | EP1477586A2 A movable joint and method for coating movable joints |
| 11/16/2004 | US6818116 Immersion of aluminum alloy in electrolytic cells |
| 11/12/2004 | CA2467033A1 A movable joint and method for coating movable joints |
| 11/11/2004 | WO2004001099A3 Complexing agent for treating metallic and plastic surfaces |
| 11/11/2004 | US20040222104 Electroplating composition |
| 11/11/2004 | US20040222102 A template is provided having at least two conductive regions separated by a non-conductive region |
| 11/11/2004 | US20040222085 Configurations and methods of electrochemical lead recovery from contaminated soil |
| 11/11/2004 | US20040221796 Electrically conductive polycrystalline diamond and particulate metal based electrodes |
| 11/11/2004 | DE102004015827A1 Gleitteil Slide |
| 11/10/2004 | EP1475463A2 Reverse pulse plating composition and method |
| 11/10/2004 | EP1153430B1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 11/10/2004 | EP1117856B1 Method for coating workpieces |
| 11/10/2004 | CN1544705A Polishing agent for alkaline non-cyanide zincate zinc plating and process for preparing polishing agent composition |
| 11/10/2004 | CN1544695A Chemical replacement silver plating additive, method for making same and use thereof |
| 11/10/2004 | CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
| 11/09/2004 | US6815086 Methods for fluxless brazing |
| 11/09/2004 | US6814850 Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same |
| 11/09/2004 | US6814841 Controlling aperture valve in response to pressure |
| 11/04/2004 | WO2004094699A1 Nano invar alloys and a process of producing the same |
| 11/04/2004 | WO2004094333A2 Composite article comprising a ceramic coating |
| 11/04/2004 | US20040219775 Lead free bump and method of forming the same |
| 11/04/2004 | US20040217009 Copper filled submicron apertures free of pits and voids; ion source, electrolyte and polyalkylene oxide random copolymers; printed wiring boards, integrated circuits |
| 11/04/2004 | US20040217008 Method for electrolytic copper plating |