| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 02/07/2006 | US6994919 Core sheet overcoated with aluminum alloy |
| 02/02/2006 | WO2006011922A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 02/02/2006 | US20060024250 Electroless method comprising mixing an acidified metal halide salt solution with a supersaturated sol where the ssalt is reduced and cerystallized to form monodispersed single crystal metal platetets; gold; silica sols; drug delivery vehicles; cosmetics; nail polishes; eye liners |
| 02/01/2006 | EP1287184B1 Satin-finished nickel or nickel alloy coating |
| 02/01/2006 | CN1729312A Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 02/01/2006 | CN1728347A Apparatus and method for plating semiconductor wafers |
| 02/01/2006 | CN1727519A Army green passivation technology for weldness steel tube in high precision |
| 02/01/2006 | CN1239752C Method for electroforming nickel-cobalt alloy |
| 02/01/2006 | CN1239751C Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/26/2006 | US20060016694 Tin-plated film and method for producing the same |
| 01/26/2006 | US20060016693 For use in copper electroplating ; provides level or uniform metal deposits |
| 01/26/2006 | US20060016692 Reduction of surface oxidation during electroplating |
| 01/26/2006 | DE102005030371A1 Coating for ignition bridge of detonator of pyrotechnic charge comprising nickel coating with zirconium particles |
| 01/25/2006 | EP1619274A2 Leveler Compounds |
| 01/25/2006 | EP1112125B1 Metallization structures for microelectronic applications and process for forming the structures |
| 01/25/2006 | CN1726310A Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 01/25/2006 | CN1726309A Copper electrolytic solution and electrolytic copper foil produced therewith |
| 01/25/2006 | CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer |
| 01/25/2006 | CN1724720A Preparation technology of carbon nanometer pipe nickel base friction resistant heat resistant composite coating layer |
| 01/25/2006 | CN1724717A Method of repair nickel coating no metal coated piece |
| 01/25/2006 | CN1724456A Metallized ceramic for microwave megnetron and it production method |
| 01/25/2006 | CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 01/25/2006 | CN1238891C Novel chip interconnect and packaging deposition methods and structures |
| 01/24/2006 | US6989199 Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board |
| 01/24/2006 | US6989087 Electrodeposition of chromium; pretreatment with silver, or alloy thereof; corrosion resistance finish |
| 01/19/2006 | WO2006006992A1 Chromium plating method |
| 01/19/2006 | WO2006006114A1 Electronic component having tin rich deposit layer and the process for depositing the same |
| 01/19/2006 | US20060011488 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same |
| 01/19/2006 | US20060011483 Process for electroplating metals into microscopic recessed features |
| 01/19/2006 | US20060011482 Electrocodeposition of lead free tin alloys |
| 01/19/2006 | DE10148045B4 Reparaturverfahren für strukturierte und/oder glatte Stahloberflächen auf Endlosbändern oder Pressblechen Repair method for structured and / or smooth steel surfaces of endless belts or press plates |
| 01/19/2006 | CA2579670A1 Chromium plating method |
| 01/18/2006 | EP1027722B1 Plating system for semiconductor materials |
| 01/18/2006 | CN1721579A Method for preparing stable and dispersed composite plating solution used for carbon nanotube electro brush plating |
| 01/18/2006 | CN1721052A Waterpower liquid |
| 01/18/2006 | CN1236845C Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof |
| 01/17/2006 | US6986838 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode |
| 01/12/2006 | WO2006004299A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2006004298A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2005040459A3 Electroplating compositions and methods for electroplating |
| 01/12/2006 | DE10347145B4 Verfahren zur Herstellung einer Verschleißschutzschicht A method for producing a wear-resistant layer |
| 01/11/2006 | CN1720355A Metal plating structure and method for production thereof |
| 01/11/2006 | CN1720354A Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
| 01/11/2006 | CN1720350A Peel strength enhancement of copper laminates |
| 01/11/2006 | CN1718867A Electronic element and electroplating method thereof |
| 01/10/2006 | US6984456 Flexible printed wiring board for chip-on flexibles |
| 01/10/2006 | US6984453 Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil |
| 01/10/2006 | US6984299 Methods for determining organic component concentrations in an electrolytic solution |
| 01/05/2006 | WO2006001594A1 Method for manufacturing black surface- treated copper foil for emi shield and copper foil the same and the composite material using it |
| 01/04/2006 | CN1715457A Surface coarsening method and surface coarsening liquid for copper foil |
| 01/04/2006 | CN1234917C Continuous nickel plating apparatus for fine metal wire |
| 01/04/2006 | CN1234915C Copper foil coated with stable layer, coating method and laminate piece including insulation substrate and copper foil |
| 01/03/2006 | US6982030 Reduction of surface oxidation during electroplating |
| 12/29/2005 | WO2005124905A1 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/29/2005 | US20050284769 Using electrolytic bath; overcoating plating chromium compound on substrates; controlling temperature, pH |
| 12/29/2005 | US20050284766 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 12/29/2005 | CA2571131A1 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/28/2005 | EP1227884B1 Process for preparing an electrocatalyst |
| 12/28/2005 | CN1714176A Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 12/28/2005 | CN1714170A Reduction of surface oxidation during electroplating |
| 12/28/2005 | CN1233879C Nano carbon tube composite electroplating zinc film preparing method |
| 12/27/2005 | US6979393 Method for plating copper conductors and devices formed |
| 12/27/2005 | US6979392 Method for forming Re—Cr alloy film or Re-based film through electroplating process |
| 12/22/2005 | US20050282371 Sequential station tool for wet processing of semiconductor wafers |
| 12/22/2005 | US20050280498 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/22/2005 | US20050279643 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
| 12/22/2005 | US20050279640 Method of forming a lead-free bump and a plating apparatus therefor |
| 12/22/2005 | US20050279638 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode |
| 12/22/2005 | US20050279637 Methods of forming target/backing plate assemblies comprising ruthenium, methods of electrolytically processing ruthenium, and container-shaped physical vapor deposition targets comprising ruthenium |
| 12/21/2005 | EP1608209A1 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/21/2005 | EP1607495A1 Copper electrolytic solution containing quaternary amine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith |
| 12/21/2005 | EP1606107A2 Composite article comprising a ceramic coating |
| 12/21/2005 | CN1709797A Copper plating material, and copper plating method |
| 12/20/2005 | US6977223 Three dimensional microfabrication |
| 12/20/2005 | US6977035 using solution including a compound containing a structure of X S Y , wherein X and Y are chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and contacting solution with ozone |
| 12/15/2005 | WO2005118918A2 Efficient analysis of organic additives in an acid copper plating bath |
| 12/15/2005 | WO2005118917A1 Electroplating solution for alloys of gold with tin |
| 12/15/2005 | US20050274622 Plating chemistry and method of single-step electroplating of copper on a barrier metal |
| 12/15/2005 | US20050274620 Copper replenishment system for interconnect applications |
| 12/14/2005 | EP1604051A1 Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents |
| 12/14/2005 | EP1240365B1 Method for producing an electrolytically coated cold rolled strip and battery sheath produced therefrom |
| 12/13/2005 | US6974767 Chemical solution for electroplating a copper-zinc alloy thin film |
| 12/13/2005 | US6974636 Protective coating for turbine engine component |
| 12/13/2005 | US6974533 Platinum electrode and method for manufacturing the same |
| 12/08/2005 | WO2005093133B1 Baths, systems and processes for electroplating zinc-nickel ternary and higher alloys and articles so electroplated |
| 12/08/2005 | US20050272947 Reacting a lower trialkylaluminum with an ammonium or group 1a metal alkanolate to form a complex of ammonium or a group 1a metal (M), aluminum (Al) and four alkyl groups, MAIR4 in an aromatic hydrocarbon solvent; ready-for-use electrolyte |
| 12/08/2005 | US20050272253 Method for alloy-electroplating group IB metals with refractory metals for interconnections |
| 12/08/2005 | US20050271904 Electrodeposition of FeCoNiV films with high resistivity and high saturation magnetization |
| 12/08/2005 | US20050271895 Platinum surface coating and method for manufacturing the same |
| 12/08/2005 | US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 12/08/2005 | DE10223622B4 Alkalisches Zink-Nickelbad sowie entsprechende Galvanisierungsverfahren mit erhöhter Stromausbeute Alkaline zinc-nickel bath as well as corresponding with increased plating current efficiency |
| 12/07/2005 | EP1601924A2 Nodular nickel boron coating |
| 12/07/2005 | CN1230575C Continuous nickel plating process for stainless steel wire |
| 12/01/2005 | US20050263403 Method for electrodeposition of bronzes |
| 12/01/2005 | US20050263399 No cell cleaning and rinsing between the analyses; reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated |
| 12/01/2005 | DE102004021926A1 Verfahren zur Herstellung einer Beschichtung sowie Anode zur Verwendung in einem solchen Verfahren A process for preparing a coating and anode for use in such a method |
| 11/30/2005 | CN1703540A Method for electrodeposition of bronzes |
| 11/30/2005 | CN1229525C Gradient composite plating coat for continuous casting crystallizer copper plate and production method thereof |
| 11/24/2005 | WO2005111275A2 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
| 11/24/2005 | WO2005110287A2 Electroplating solution for gold-tin eutectic alloy |