| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 09/07/2005 | CN1665965A Pyrophosphoric acid bath for use in copper-tin alloy plating |
| 09/06/2005 | US6939622 Chip-on-film use copper foil |
| 09/01/2005 | US20050191473 Wired circuit board |
| 09/01/2005 | US20050189233 electrochemical plating (ECP) electrolyte solutions comprising a bath solution and cationic polymer adjuvants, used for electrodeposition of metal layers on surfaces of semiconductor wafer substrates; optimizing gap filling |
| 09/01/2005 | US20050189232 Hardness, toughness, noncracking, adhesion; annealing; internal combustion engine cylinders |
| 09/01/2005 | US20050189231 Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| 09/01/2005 | US20050189230 Method for forming re alloy coating film having high re content through electroplating |
| 09/01/2005 | US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/01/2005 | DE102004019370B3 Production of optionally coated structurized hard chrome layer, used e.g. for decoration, protection or functional coating on printing roller or stamping, embossing or deep drawing tool uses aliphatic sulfonic acid in acid plating bath |
| 08/31/2005 | EP1568802A1 Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith |
| 08/31/2005 | EP1567695A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 08/31/2005 | CN2721852Y High wear-resisting and corrosive-proof sucker rod |
| 08/31/2005 | CN1662679A Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 08/31/2005 | CN1662117A Wired circuit substate |
| 08/31/2005 | CN1217564C Roughened copper foil and making method thereof |
| 08/31/2005 | CN1217035C Process of electricity sedimentation in aqueous solution for producing rare earth magnetic film alloy material |
| 08/31/2005 | CN1217034C Workpiece processor having processing chamber with improved processing fluid flow |
| 08/30/2005 | US6936925 Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface |
| 08/30/2005 | US6936155 electrollyzing a molten-salt in a electrolytic bath containing tantalum pentachloride, alkylimidazolium chloride, and an alkali metal or alkali earth metal fluoride to form tantalum film |
| 08/25/2005 | WO2005078163A1 Ternary and quaternary alloys to replace chromium |
| 08/25/2005 | WO2005078162A1 Diamond tool |
| 08/25/2005 | WO2005078161A1 Electroplating in presence of co2 |
| 08/25/2005 | US20050184369 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 08/25/2005 | US20050183961 Complex of silver with hydantoin or a substituted hydantoin; sulfamic, hydrofluoric, nitric, fluoboric, glycolic or lactic acid nonprecipitating electrolyte salts; pyridine, nicotinamide and dipyridyl for a mirror bright to brilliant deposit; surface active material is Hamposyl, Blancol, Rhodacal |
| 08/24/2005 | EP1565597A1 Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating |
| 08/24/2005 | EP1565596A1 Production of structured hard chrome layers |
| 08/24/2005 | CN1659315A Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 08/24/2005 | CN1216181C Chemical replacement silver plating additive, method for making same and use thereof |
| 08/18/2005 | WO2005075697A1 High-carbon steel wire with nickel sub coating |
| 08/18/2005 | WO2005075696A2 Low-carbon steel wire with nickel sub coating |
| 08/18/2005 | WO2005039647A3 Radium target and method for producing it |
| 08/18/2005 | WO2003035941A3 Electrolytic processes with reduced cell voltage and gas formation |
| 08/18/2005 | US20050181316 With improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process |
| 08/18/2005 | US20050181252 Polymer electrolyte membrane for electrochemical and other applications |
| 08/18/2005 | US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers |
| 08/17/2005 | EP1564314A1 Metal plating structure and method for production thereof |
| 08/17/2005 | CN1656256A Method for producing organoaluminium complexes and the uses thereof for producing electrolyte solutions for the electrochemical deposition of aluminium-magnesimm alloys |
| 08/17/2005 | CN1656255A Acid plating bath and method for the electolytic deposition of satin nickel deposits |
| 08/17/2005 | CN1214990C Palladium complex salt and use thereof for adjusting palladium concentration of electrolytic solution for deposit of palladium or its alloys |
| 08/16/2005 | US6930391 multilayer interconnection structure formed on a substrate, that includes a barrier layer, and a conductive seed layer, wherein the improvement includes an electroplated metal alloy layer including at least three elements, iron, cobalt, and nickel |
| 08/11/2005 | WO2005073438A1 Zinc or zinc alloy deposition installation |
| 08/11/2005 | WO2005073437A1 Composite chromium plating film, and sliding member having the film and method for manufacture thereof |
| 08/11/2005 | WO2005047570A3 Surface finishing method for silver and its alloys |
| 08/11/2005 | US20050173256 Used in the manufacture of an electrolytic copper foil that allows fine patterning and that is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures |
| 08/11/2005 | US20050173255 applying currents to electrolytic baths containing brighteners, ionic nickel, cobalt and boron, so that alloy are depositied on the cathode; electrodeposition/metals |
| 08/11/2005 | US20050173254 applying currents to electrolytic baths containing brighteners, ionic nickel, cobalt and boron, so that alloy are depositied on the cathode; electrodeposition/metals |
| 08/11/2005 | US20050173252 electroplating the copper ions from the plating solution directly onto the barrier layer of a microelectronic workpiece; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 08/04/2005 | US20050170201 wear resistant coating for air plane parts; low compressive residual stress, adhesion to ferrous, nickel alloys, low fatigue debit, corrosion resistant crack free structure; meets or exceeds engineering properties of hard chromium plating; no chemicals restricted by Environmental Protection Agency |
| 08/04/2005 | US20050167282 Method for forming Re-Cr alloy film through electroplating process using bath containing Cr(VI) |
| 08/04/2005 | US20050167265 System for electrochemically processing a workpiece |
| 08/04/2005 | US20050166790 Pyrophosphoric acid bath for use in copper-tin alloy plating |
| 08/03/2005 | CN1649676A Minimizing whisker growth in tin electrodeposits |
| 08/03/2005 | CN1213645C Method for producing surface treated copper foil |
| 08/03/2005 | CN1213173C Satin-finished nickel or nickel alloy coating |
| 08/02/2005 | US6923899 Acidity solution containing hydroxybenzenesulfonic acid oxidation resistance |
| 08/02/2005 | US6923898 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 08/02/2005 | US6923897 Coating nickel with a cobalt containing layer in a galvanic process; low electrical contact resistance between cathode and inside of the cupular battery shell |
| 07/28/2005 | WO2005068688A2 Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
| 07/28/2005 | WO2005068685A1 Alloy coating for diffusion barrier, method for forming same, and high-temperature device member |
| 07/28/2005 | US20050164498 Plating method and plating apparatus |
| 07/28/2005 | US20050164495 Method to improve planarity of electroplated copper |
| 07/27/2005 | CN1646904A Reference electrode calibration for voltammetric plating bath analysis |
| 07/27/2005 | CN1645570A Method for removing particles from wafer surface |
| 07/27/2005 | CN1644763A Composite coating containing carbon/molybdenum disulfide nanometer tube and its preparation |
| 07/27/2005 | CN1644761A Composite coating layer containing rare earth fluorine nano material with similar Fuller olefin structure and its preparation |
| 07/27/2005 | CN1644138A Wear-resistant unsticky cook |
| 07/27/2005 | CN1212425C Non-cyanide gold imitation electro plating method of flowers and plants |
| 07/27/2005 | CN1212086C Personal ornament having white coating film and mfg. method thereof |
| 07/26/2005 | CA2233329C Method for electrolytic deposition of metal coatings |
| 07/21/2005 | WO2005066391A1 Copper electrodeposition in microelectronics |
| 07/21/2005 | WO2005065436A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 07/21/2005 | WO2005065430A2 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material |
| 07/21/2005 | WO2005017971A3 Nanomachined and micromachined electrodes for electrochemical devices |
| 07/21/2005 | US20050157475 Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| 07/21/2005 | US20050155869 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis |
| 07/21/2005 | US20050155866 additive consumption inhibiting alcohol and brightener degradation inhibitor compound in copper plating bath; increases the life of the plating bath and improves the efficiency of the plating |
| 07/21/2005 | US20050155864 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece |
| 07/21/2005 | US20050155514 Additive for plating bath |
| 07/20/2005 | EP1555335A2 Additive for plating bath |
| 07/20/2005 | CN1643185A Gold plating solution and gold plating method |
| 07/20/2005 | CN1211506C Method for repairing worn out cylinder liner of internal-combustion engines |
| 07/19/2005 | US6919014 Satin-finished nickel or nickel alloy coating |
| 07/19/2005 | US6919012 Method of making a composite article comprising a ceramic coating |
| 07/19/2005 | CA2224382C An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys |
| 07/14/2005 | WO2005038095A3 Electrolytic method for phosphating metal surfaces and phosphated metal layer |
| 07/14/2005 | US20050153188 Component of a fuel cell unit |
| 07/14/2005 | US20050151195 Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus |
| 07/14/2005 | US20050150774 Contains quarternary ammonium compound and polyether with strongly hydrophobic side chain; long periods of operation or heating and cooling cycles; gloss finish; reduced sensitivity to wetting agents |
| 07/14/2005 | US20050150770 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 07/14/2005 | DE10358458A1 Bauelement einer Brennstoffzelleneinheit Component of a fuel cell unit |
| 07/13/2005 | EP1553211A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 07/13/2005 | CN1637174A Electrolytic stripping method |
| 07/13/2005 | CN1637169A Electroplating method for a semiconductor device |
| 07/12/2005 | US6916741 Capture compounds for electronic plating compositions and electronic packaging device manufacture |
| 07/12/2005 | US6916412 Divided housing |
| 07/12/2005 | CA2238061C Protective coating for metallic parts offering good corrosion resistance in salt air, and the metallic parts covered with such a protective coating |
| 07/07/2005 | WO2005060379A2 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 07/07/2005 | WO2004061924A8 Method of producing thin films of compound i-iii-vi, promoting the incorporation of iii elements in the film |
| 07/07/2005 | WO2003006360A3 Brightener for zinc-nickel plating bath |
| 07/07/2005 | US20050145503 Platinum aluminide coating and method thereof |