| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
|---|
| 05/05/2004 | CN1148471C Electroplating machine |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6726825 Etching, anodizing |
| 04/27/2004 | US6726824 Closed loop monitoring of electroplating bath constituents using mass spectrometry |
| 04/22/2004 | WO2004033764A1 Liquid treatment apparatus and method of liquid treatment |
| 04/22/2004 | WO2002059398A3 Plating apparatus and method |
| 04/22/2004 | US20040074777 Cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical |
| 04/22/2004 | US20040074776 Method and device for the electrolytic coating of a metal strip |
| 04/15/2004 | WO2004008825A3 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 04/15/2004 | WO2003085173A3 Reference electrode calibration for voltammetric plating bath analysis |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072423 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 04/15/2004 | US20040069647 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | DE4421010B4 Verfahren zur Abreinigung von Gegenständen im Rahmen einer galvanotechnischen Behandlung von Gegenständen in einer galvanotechnischen Anlage und Anlagen für die Durchführung der Verfahren Method for cleaning of goods under a electroplating treatment of objects in an electroplating plant and equipment to carry out the method |
| 04/15/2004 | DE10246467A1 Deposition of alloys by electroplating, varies conditions under computer control to achieve homogenous deposit or deposit exhibiting concentration gradient in its thickness |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1407810A1 VIBRATINGLY STIRRING APPARATUS, AND DEVICE AND METHOD FOR PROCESSING USING THE STIRRING APPARATUS |
| 04/14/2004 | EP1407061A1 Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath |
| 04/14/2004 | EP1406739A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 04/08/2004 | US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues |
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | DE10304176B3 Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors |
| 04/08/2004 | DE10042002B4 Vorrichtung zur galvanischen Abscheidung eines Werkstoffes und deren Verwendung An apparatus for the galvanic deposition of a material and the use thereof |
| 04/07/2004 | EP1226426A4 Method and apparatus for determination of additives in metal plating baths |
| 04/07/2004 | CN2609941Y Zinc electrolytic cooling tower |
| 04/06/2004 | US6716334 Electroplating process chamber and method with pre-wetting and rinsing capability |
| 04/06/2004 | US6716332 Plating method and apparatus |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060436 Removing oxygen from a copper plating solution using hollow hydrophobic fiber membranes; intrusion of solution into membrane pores is avoided |
| 03/31/2004 | EP1402568A2 Method and apparatus for controlling a plating process |
| 03/25/2004 | US20040055890 ProvideS a film having a highly uniform thickness by plating; electric current limiting member limits horizontal flow of an electric current in the plating liquid between second electrode and substrate within plating vessel during plating |
| 03/25/2004 | US20040055888 Monitoring plating bath; quantitative, qualitative analysis |
| 03/25/2004 | US20040055877 Workpiece processor having processing chamber with improved processing fluid flow |
| 03/25/2004 | US20040055876 Cam driven paddle assembly for a plating cell |
| 03/24/2004 | EP1399385A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 03/24/2004 | CN1483860A Tumble-plating device |
| 03/23/2004 | US6709561 Cyclic voltammetric stripping analysis; comparing the electro-deposition rate parameters for solutions; separate analyses for hypophosphite and dimethylamineborane in baths by selective decomposition of the dimethylamineborane in acid |
| 03/18/2004 | WO2003093524A3 Apparatus and method for regulating the electrical power applied to a substrate during immersion |
| 03/18/2004 | US20040054231 Ionic liquids and their use |
| 03/18/2004 | US20040050682 Activated water apparatus and methods and products |
| 03/17/2004 | EP1397530A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/17/2004 | CN1142327C Composition and method for electroplating low-stress nickel |
| 03/11/2004 | US20040045837 Method for treating the surface of object and apparatus thereof |
| 03/11/2004 | US20040045813 Wafer processing apparatus, wafer stage, and wafer processing method |
| 03/11/2004 | US20040045502 Apparatus for and method of processing substrate |
| 03/10/2004 | EP1395690A4 Method and apparatus for electro-deposition of metal |
| 03/10/2004 | EP1395690A2 Method and apparatus for electro-deposition of metal |
| 03/10/2004 | EP1395522A2 Electrode ionization apparatus and method |
| 03/10/2004 | CN1141165C Device for cleaning fluid in form of vapor from duct |
| 02/26/2004 | WO2004016828A2 Antimisting agents |
| 02/26/2004 | WO2003023395A9 Enhanced detection of metal plating additives |
| 02/26/2004 | WO2003018878A3 Segmented counterelectrode for an electrolytic treatment system |
| 02/24/2004 | US6695961 Three elongate electric current conductors, disposed parallel to one another |
| 02/19/2004 | US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/12/2004 | WO2004013381A2 Insoluble anode loop in copper electrodeposition cell for interconnect formation |
| 02/12/2004 | US20040026373 Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs |
| 02/12/2004 | US20040026256 Electroplating integrated circuits using holder; prevent deposits on conveyor belt |
| 02/12/2004 | US20040026255 Plating substrate; electrolytic cell containing ion exchanging membrane |
| 02/12/2004 | DE10234285A1 Vorrichtung zur galvanischen Abscheidung prothetischer, metallischer Dentalformteile Apparatus for electrodepositing prosthetic, metallic, molded dental components |
| 02/11/2004 | CN1137858C Method for producing water treatment agent using metal plating waste water |
| 02/10/2004 | US6689686 System and method for electroplating fine geometries |
| 02/10/2004 | US6689216 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/05/2004 | US20040020781 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 02/05/2004 | DE10232612A1 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process |
| 02/05/2004 | DE10232220A1 Device for rinsing suction channels in installations operating according to galvanic or surface technology has rinsing units built into the device for rinsing the channels |
| 02/05/2004 | DE10229005A1 Vorrichtung und Verfahren zur elektrochemischen Metallabscheidung Apparatus and method for electro-chemical metal deposition |
| 02/04/2004 | EP1386984A1 Cathode cartridge for electroplating tester |
| 02/04/2004 | CN1473206A Plasma electroplating |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 01/29/2004 | WO2004009880A1 Method and apparatus for real time monitoring of industrial electrolytes |
| 01/29/2004 | WO2004009879A1 Plating device |
| 01/29/2004 | WO2004009875A2 Tilted electrochemical plating cell with constant wafer immersion angle |
| 01/29/2004 | WO2004008825A2 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 01/29/2004 | US20040018675 Nickel plating process having controlled hydrogen concentration |
| 01/29/2004 | US20040016649 Contacting a metal material article having electrical conductivity with phosphate chemical treatment bath and electrolytic treatment to form film containing phosphate compound is formed on the surface of article |
| 01/29/2004 | US20040016648 For immersing a substrate for plating operations |
| 01/29/2004 | US20040016645 Providing the component; placing the component in an electrolyte solution; and applying a plurality of pulses to the solution and component, wherein pulses have a pattern comprised of differentmagnitude portions |
| 01/29/2004 | US20040016644 Sampling, at a predetermined interval, a predetermined amount of plating liquid in a plating apparatus; analyzing components of the sampled plating liquid with an automatic analyzing device, and supplying component replenishing liquids |
| 01/29/2004 | US20040016637 Multi-chemistry plating system |
| 01/28/2004 | EP1384448A1 Apparatus for the electrolytic deposition on metallic prothetic dental elements |
| 01/27/2004 | US6684172 Sensor to predict void free films using various grating structures and characterize fill performance |
| 01/22/2004 | WO2004007811A2 Device and method for monitoring an electrolytic process |
| 01/22/2004 | US20040011655 For performing plating on a long conductive substrate |
| 01/21/2004 | EP1382705A1 Preparation of pre-coated aluminium alloy articles |
| 01/21/2004 | EP1381824A1 Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs |
| 01/21/2004 | EP1381474A1 Internal heat spreader plating methods and devices |
| 01/21/2004 | CN1468982A Gold-plating apparatus and gold-plating method |
| 01/20/2004 | CA2236393C Method and device for regenerating tin-plating solutions |
| 01/15/2004 | US20040007474 Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode |
| 01/15/2004 | US20040007473 Electrolyte/organic additive separation in electroplating processes |
| 01/15/2004 | DE10228400A1 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards |
| 01/13/2004 | US6676822 Method for electro chemical mechanical deposition |
| 01/08/2004 | DE10226224A1 Galvanikanlage und Verfahren zum Vernickeln von Gegenständen Electroplating plant and method for nickel objects |
| 01/07/2004 | CN1465750A Apparatus for cooling zinc electrolytic solution |
| 01/06/2004 | US6674533 Anodizing system with a coating thickness monitor and an anodized product |
| 01/06/2004 | US6673226 Voltammetric measurement of halide ion concentration |
| 01/06/2004 | US6673218 Cathode cartridge for electropating tester |
| 01/01/2004 | US20040000491 Neutralizing acid electrolyte in plating solution; electrolytic cell; permselective membrane |