| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 04/17/2003 | US20030070941 Apparatus and method for evaluating plating solution and apparatus and method for fabricating electronic device |
| 04/17/2003 | US20030070932 Plating apparatus and plating method |
| 04/17/2003 | US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact |
| 04/17/2003 | US20030070918 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 04/16/2003 | EP1302568A2 Chemical processing system |
| 04/16/2003 | CN2545218Y Current waveform and electricity controller for electroplating |
| 04/16/2003 | CN1411054A Semiconductor integrated circuit, method and apparatus for mfg. same |
| 04/15/2003 | US6547937 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 04/10/2003 | WO2003029779A2 Improved method for analysis of three organic additives in an acid copper plating bath |
| 04/10/2003 | WO2003028534A2 System and method for full field oscillating stimulus perimeter |
| 04/10/2003 | US20030066752 Measurement seed layer thickness; calibration |
| 04/03/2003 | WO2003027011A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 04/03/2003 | US20030062266 Uses measurements of the metal electrodeposition rate to determine the concentration of the leveler additive. |
| 04/03/2003 | DE20301606U1 Measuring device, used for measuring current densities during galvanizing of circuit boards, comprises an electrically conducting measuring surface and an electrically conducting contact on the rear side, and an electrical connection |
| 04/02/2003 | EP1298233A2 System and method for electroplating fine geometries |
| 04/02/2003 | CN1407335A X-ray coating thickness device |
| 04/01/2003 | US6542784 Plating analysis method |
| 03/27/2003 | WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 03/27/2003 | US20030057099 System and method for electroplating fine geometries |
| 03/27/2003 | US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated. |
| 03/27/2003 | DE20300070U1 Treatment device used for treating oil/water emulsions produced in a degreasing installation is connected to process and rinsing baths via pipe lines and is continuously charged with a determined amount of the liquid to be cleaned |
| 03/26/2003 | EP1295312A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/26/2003 | CN1405365A Method for producing soluble copper in the production of electrolytic copper foil |
| 03/20/2003 | WO2003023395A1 Enhanced detection of metal plating additives |
| 03/20/2003 | WO2002070144A9 Internal heat spreader plating methods and devices |
| 03/20/2003 | US20030052011 Plasma electroplating |
| 03/20/2003 | US20030051999 Elastic contact element |
| 03/20/2003 | US20030051995 Plating device and plating method |
| 03/13/2003 | US20030049850 Enhanced detection of metal plating additives |
| 03/12/2003 | EP1291455A1 Purification system and method used for a plating bath |
| 03/12/2003 | EP1290248A1 Regeneration of plating baths |
| 03/12/2003 | EP1252374A4 Process for the extended use of electrolytes |
| 03/12/2003 | CN1402419A Electroplating supply unit |
| 03/12/2003 | CN1401822A Coating method |
| 03/06/2003 | WO2003018879A1 Electroforming apparatus and electroforming method |
| 03/06/2003 | WO2003018878A2 Segmented counterelectrode for an electrolytic treatment system |
| 03/06/2003 | WO2003018874A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/06/2003 | WO2002097165A3 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/06/2003 | US20030042143 Purification system and method |
| 03/06/2003 | US20030042135 Electrodeposition coating film thickness calculating method, recording medium stored with film thickness calculating program and readable by means of computer, and electrodeposition coating film thickness simulation apparatus |
| 03/06/2003 | CA2456919A1 Electroforming apparatus and electroforming method |
| 03/06/2003 | CA2449807A1 Segmented counterelectrode for an electrolytic treatment system |
| 03/05/2003 | EP1288340A2 Galvanic apparatus |
| 03/04/2003 | US6528185 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate |
| 03/04/2003 | US6527934 Workpiece acts as a cathode in an electrolytic circuit and copper ions are electrolytically deposited as copper onto the workpiece; wherein in the copper plating solution generation step, the solid-state copper comprises scrap |
| 03/04/2003 | US6527920 Copper electroplating apparatus |
| 02/26/2003 | CN1399690A Process for the extended use of electrolytes |
| 02/20/2003 | WO2001081657A3 Elastic contact element |
| 02/20/2003 | US20030035305 Electroplating power supply apparatus |
| 02/18/2003 | US6521112 Paced chemical replenishment system |
| 02/18/2003 | US6521102 Perforated anode for uniform deposition of a metal layer |
| 02/13/2003 | WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 02/13/2003 | US20030031294 X-ray coating thickness gauge |
| 02/13/2003 | US20030029726 Measuring a potential of working electrode in sample of electroplating solution over time with constant current supplied; identifying whether electroplating solution is capable of obtaining bottom-up growth |
| 02/13/2003 | US20030029717 Treatment of circuit support with impulse excitation |
| 02/12/2003 | EP1283282A1 A method for Cu electroplating in integrated circuit fabrication |
| 02/12/2003 | CN1396110A Process and equipment for recovering useful substance from solution containing chloride |
| 02/11/2003 | US6517689 Plating device |
| 02/06/2003 | WO2003010366A1 Apparatus for plating treatment |
| 02/06/2003 | WO2003010359A1 Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method |
| 02/06/2003 | WO2002057514A3 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
| 02/06/2003 | US20030024821 Recovery system for platinum plating bath |
| 02/04/2003 | US6516233 Pulse plating rectifiers and methods, systems and computer program products for controlling pulse plating rectifiers in master/slave mode |
| 01/30/2003 | US20030022493 Cooling the copper electrolyte solution to below room temperature to increase the rate of self annealing grain growth, reducing the final resistivity of the copper lines |
| 01/29/2003 | EP1278899A1 Method and device for the electrolytic coating of a metal strip |
| 01/23/2003 | WO2003006715A1 Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath |
| 01/23/2003 | WO2003006193A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 01/23/2003 | US20030015433 Electrolytic copper plating method |
| 01/23/2003 | US20030015417 Pulsed Cyclic Galvanostatic Analysis method for extrapolatively calculating concentration; Plating potentials between reference and test electrodes are measured and plotted; organic additives to control copper electroplating |
| 01/23/2003 | DE10134074C1 Casting roller used for casting molten metal, especially molten steel, comprises a metallic rolling body having a metallic layer which is harder than the material of the rolling body |
| 01/23/2003 | CA2450564A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 01/22/2003 | CN1392294A Plating method of electrocytic copper |
| 01/21/2003 | US6508924 Control of breakdown products in electroplating baths |
| 01/16/2003 | WO2003005430A2 Method and apparatus for controlling a plating process |
| 01/16/2003 | US20030010644 Apparatus and process for producing zinc oxide film |
| 01/09/2003 | WO2003002784A2 Electrolysis cell for restoring the concentration of metal ions in electroplating processes |
| 01/09/2003 | US20030006135 Plating apparatus and plating method, and method of manufacturing semiconductor device |
| 01/09/2003 | DE29924395U1 Electrode for the regeneration of chromic acid solutions has a porous structure through which a chromic acid solution can pass |
| 01/08/2003 | EP1272692A1 Electro-plating apparatus and method |
| 01/07/2003 | US6503376 Electroplating apparatus |
| 01/03/2003 | WO2003000395A1 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030000893 For providing substrate such as a semiconductor wafer solution treatment |
| 01/02/2003 | US20030000843 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 01/02/2003 | US20030000842 Regulating the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system in an oxidized and in a reduced form |
| 01/02/2003 | US20030000841 For deposition of a metal layer onto a wafer or other substrate |
| 01/02/2003 | US20030000840 Electroplating apparatus and method |
| 01/02/2003 | EP1270766A2 Electrodeposition coating film thickness calculating method and electrodeposition coating film thickness simulation apparatus |
| 01/02/2003 | EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 01/01/2003 | CN1097643C Process for making copper foil |
| 12/31/2002 | US6500317 Plating apparatus for detecting the conductivity between plating contacts on a substrate |
| 12/26/2002 | US20020195334 Autonomous system and method for efficiently collecting fugitive airborne emissions from open vessels |
| 12/24/2002 | US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 12/19/2002 | US20020189951 Electrodeionization apparatus and method |
| 12/18/2002 | EP1266546A1 Treatment of circuit supports with impulse excitation |
| 12/18/2002 | CN2526331Y mA stage current sensor module for measuring current density in electroplating bath |
| 12/17/2002 | US6495211 Process for producing a substrate and plating apparatus |
| 12/17/2002 | US6495018 A single delivery channel is formed by, and between, inner wall 2 and baffle 3. electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. the upper part of the inner wall 2 of |
| 12/17/2002 | US6495011 Apparatus for determination of additives in metal plating baths |
| 12/11/2002 | EP1264918A1 Electrolytic copper plating method |