| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 08/11/2004 | CN1520384A ELectrodeionization appts. and method |
| 08/11/2004 | CN1520334A Vibratingly stirring appts., and device and method for processing using stirring appts. |
| 08/10/2004 | US6773569 Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives |
| 08/10/2004 | US6773559 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 08/05/2004 | WO2004053455A3 Plating bath composition control |
| 08/05/2004 | WO2002029137A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/04/2004 | CN1517453A Electroplating device, electroplating cup and cathode ring |
| 08/03/2004 | US6770184 Integrated de-ionized water pressure monitoring system for solder plating machines |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441048A2 Plating apparatus, plating cup and cathode ring |
| 07/27/2004 | US6767437 Electroplating apparatus and electroplating method |
| 07/22/2004 | WO2004061164A1 Work transfer device for immerse transfer electroplating apparatus |
| 07/22/2004 | US20040142566 Continuous bleed-and-feed process and equipment |
| 07/22/2004 | US20040140199 Plating apparatus, plating cup and cathode ring |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1438447A2 Method and conveyorized system for electrolytically processing work pieces |
| 07/21/2004 | EP1438446A2 System and method for electrolytic plating |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | US20040134774 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
| 07/14/2004 | CN1157504C Mixing device |
| 07/13/2004 | US6761812 Supplying electrical current to workpiece through contact portions contacting workpiece at different locations, measuring magnetic field of each portion to determine magnitude of current, individually adjusting current |
| 07/08/2004 | WO2004007811A3 Device and method for monitoring an electrolytic process |
| 07/08/2004 | US20040129575 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
| 07/08/2004 | US20040129384 Chemical treatment apparatus and chemical treatment method |
| 07/08/2004 | US20040129209 Phosphate film processing method and phospate film processing device |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/06/2004 | US6758955 Methods for determination of additive concentration in metal plating baths |
| 07/01/2004 | WO2003002784A3 Electrolysis cell for restoring the concentration of metal ions in electroplating processes |
| 07/01/2004 | US20040124089 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 07/01/2004 | US20040124084 Separation and counting of single molecules through nanofluidics, programmable electrophoresis, and nanoelectrode-gated tunneling and dielectric detection |
| 06/30/2004 | EP1278899B1 Method and device for the electrolytic coating of a metal strip |
| 06/30/2004 | CN1509350A Anodization device and anodization method |
| 06/30/2004 | CN1508296A Electroplating device and method thereof |
| 06/29/2004 | US6755960 Zinc-nickel electroplating |
| 06/29/2004 | US6755956 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 06/29/2004 | US6755955 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 06/29/2004 | US6755946 Clamshell apparatus with dynamic uniformity control |
| 06/24/2004 | WO2004053455A2 Plating bath composition control |
| 06/24/2004 | WO2004016828A3 Antimisting agents |
| 06/24/2004 | US20040118676 Plating apparatus and plating method |
| 06/23/2004 | EP1431424A2 Plating apparatus and plating method |
| 06/23/2004 | EP1430167A2 Plating apparatus and method |
| 06/23/2004 | CN1506502A Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/22/2004 | US6754090 AC/DC/HFAC/DC/AC power supply |
| 06/22/2004 | US6752916 Electrochemical planarization end point detection |
| 06/22/2004 | US6752855 For providing substrate such as a semiconductor wafer solution treatment |
| 06/17/2004 | US20040115932 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 06/17/2004 | DE10255702A1 Method for producing a nonferrous foil with required properties involves mixing of a nonferrous metal sulfate bath with an additional mixture of polypropylene glycol and phenol sulfone acid |
| 06/16/2004 | CN1153855C Method and device for regulating concentration of substaces in electrolytes |
| 06/16/2004 | CN1153852C Device and method for controlling electric power line distribution |
| 06/15/2004 | US6749692 Branching a portion of a water flow, which circulates through a rinsing water circuit associated with each of the washer units, off in form of a bypass stream, feeding the stream to a washer unit located upstream of a respective washer unit |
| 06/10/2004 | WO2004009875A3 Tilted electrochemical plating cell with constant wafer immersion angle |
| 06/10/2004 | US20040108224 Methods and apparatuses for analyzing solder plating solutions |
| 06/10/2004 | US20040108214 Methods for determination of additive concentration in metal plating baths |
| 06/10/2004 | US20040108213 Plating bath composition control |
| 06/10/2004 | US20040108199 Device for electrodepositing metallic, prosthetic, molded, dental components |
| 06/09/2004 | EP1426469A1 Method for electrolytic copper plating |
| 06/08/2004 | US6746589 Plating method and plating apparatus |
| 06/08/2004 | US6746579 Comprises continuously detecting deterioration state of gold sulfite complex plating solution |
| 06/08/2004 | US6746578 Selective shield/material flow mechanism |
| 06/03/2004 | US20040104123 Anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath |
| 06/03/2004 | US20040103921 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 06/03/2004 | DE69817077T2 Behandlungsverfahren und Vorrichtung, die eine chemische Reaktion verwenden Treatment method and device which use a chemical reaction |
| 06/02/2004 | EP1424406A1 Electroforming apparatus and electroforming method |
| 05/27/2004 | WO2004044924A1 A commutator, a gaz electrode, a method of electroplating and a method of initiating cold fusion |
| 05/27/2004 | WO2004044272A1 Measurement of the concentration of a reducing agent in an electroless plating bath |
| 05/27/2004 | US20040099533 Microelectronics; positioning contactors; concentric anodes; nozzles; electroplating |
| 05/27/2004 | US20040099532 Using insulating shield; electrochemical plating bath; uniform current distribution |
| 05/27/2004 | DE10130333B4 Galvanische Vorrichtung zur Abscheidung von Edelmetall Electroplating apparatus for separating noble metal |
| 05/26/2004 | CN1499992A Process for degassing queous plating solution |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740242 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/25/2004 | US6740164 Plating apparatus and method of manufacturing semiconductor device |
| 05/20/2004 | US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 05/19/2004 | EP1420087A2 Method for supplying zinc ions to alkaline zinc plating solution |
| 05/19/2004 | EP1419378A2 Improved method for analysis of three organic additives in an acid copper plating bath |
| 05/19/2004 | EP1419290A2 Segmented counterelectrode for an electrolytic treatment system |
| 05/19/2004 | CN1498290A Phosphate film processing method and film processing device |
| 05/19/2004 | CN1497830A Control power supply device for electroplating |
| 05/18/2004 | US6736945 Wafer plating apparatus |
| 05/13/2004 | WO2003006715A9 Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath |
| 05/13/2004 | US20040089555 Continuous metal plating and supplemental processing in one housing; substrate stage between cassette stage and pre-treatment unit; cleaning with pure water; drying |
| 05/13/2004 | US20040089553 Method for supplying zinc ions to alkaline zinc plating solution |
| 05/13/2004 | US20040089552 Electrochemical treating substrate by irradiating with light; lamp, stage, cathode, frame and seal |
| 05/13/2004 | US20040089551 Ion-depletion compartment; ion exchange resin; water purification |
| 05/13/2004 | US20040089538 Electrode, electrochemical cell, and method for analysis of electroplating baths |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495296A Electroplating method and device for wire stock, and electroplate wire stock |
| 05/11/2004 | US6733656 Automatic calibration of the reference electrode enabled by the present invention, saves labor, time and expense, and minimizes errors in the plating bath analysis. |
| 05/11/2004 | US6733650 Apparatus and process for producing zinc oxide film |
| 05/06/2004 | WO2002004711A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | US20040084316 Voltage applied between cathode electrode in contact with edge of substrate and vertically moveable anode; copper films of uniform thickness |
| 05/06/2004 | US20040084315 Plating apparatus and plating method |
| 05/06/2004 | US20040083855 Antimisting agents |
| 05/06/2004 | DE10043560B4 Verfahren und Vorrichtung zur Herstellung einer Metallschicht Method and apparatus for producing a metal layer |
| 05/05/2004 | CN1494462A Internal heat spreader plating methods and devices |