| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 11/10/2004 | CN1544708A Electroplating apparatus with plating rack off-position caution device |
| 11/09/2004 | US6816756 Paint film thickness predicting method and system for actual car, and recording medium |
| 11/09/2004 | US6815315 Method for electrochemical oxidation |
| 11/09/2004 | US6814847 Method and apparatus for electro-deposition of metal |
| 11/04/2004 | WO2004094702A2 Multi-chemistry plating system |
| 11/04/2004 | WO2004094701A2 Method and apparatus for monitoring, dosing, and distribution of chemical compositions |
| 11/04/2004 | US20040219775 Lead free bump and method of forming the same |
| 11/04/2004 | US20040217008 Method for electrolytic copper plating |
| 11/04/2004 | US20040217007 High quality metal or alloy thin film deposition on magnetic head; dissolving hydrogen in solution; low cost impurity reduction |
| 11/04/2004 | US20040217006 Residue removers for electrohydrodynamic cleaning of semiconductors |
| 11/04/2004 | US20040217005 Method for electroplating bath chemistry control |
| 11/02/2004 | US6811672 Method for forming plating film and electronic component having plating film formed theron by same method |
| 11/02/2004 | US6811661 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 11/02/2004 | US6811591 Autonomous system and method for efficiently collecting fugitive airborne emissions from open vessels |
| 10/28/2004 | WO2002001610A3 Apparatus and method for electro chemical deposition |
| 10/27/2004 | EP1471348A1 Electrochemical method for determining a quantity of an organic component in an electroplating bath |
| 10/27/2004 | EP1471347A1 Method of determining organic additives in an electroplating bath |
| 10/27/2004 | EP1470268A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 10/27/2004 | EP1470267A1 Methods of anodizing sintered valve metal anodes |
| 10/26/2004 | US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing |
| 10/26/2004 | US6808611 Determination concentration of adjuvant; measuring electrochemistry response |
| 10/21/2004 | WO2004090200A1 Alloy deposition controlled by a characteristic diagram |
| 10/21/2004 | US20040206628 Electrical bias during wafer exit from electrolyte bath |
| 10/21/2004 | US20040206622 Apparatus for plating treatment |
| 10/21/2004 | US20040206373 Spin rinse dry cell |
| 10/14/2004 | WO2004088003A2 Method and device for controlling at least one operating parameter of an electrolytic bath |
| 10/14/2004 | US20040200725 Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| 10/14/2004 | DE10314279A1 Verfahren und Vorrichtung zum Steuern mindestens einer Betriebsgröße eines elektrolytischen Bades Method and apparatus for controlling at least one operating variable of an electrolytic bath |
| 10/13/2004 | CN1537326A Electrochemical oxidation |
| 10/13/2004 | CN1170965C Method for electro copperplating substrates |
| 10/12/2004 | US6802951 Methods of anodizing valve metal anodes |
| 10/12/2004 | US6802950 Apparatus and method for controlling plating uniformity |
| 10/12/2004 | US6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| 10/07/2004 | WO2004085715A1 Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product |
| 10/07/2004 | US20040198190 Method and apparatus for reduction of defects in wet processed layers |
| 10/07/2004 | US20040198081 Microelectronic spring contact elements |
| 10/07/2004 | US20040195111 Performs uniform electrodeposition and electroetching |
| 10/07/2004 | US20040195106 Plating method and plating apparatus |
| 10/07/2004 | US20040195090 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 10/06/2004 | EP1464734A2 Apparatus and method for manufacturing moulded parts |
| 10/06/2004 | EP1464732A1 An installation for the application of a coating to metal parts and method therefor |
| 10/06/2004 | EP1464731A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 10/06/2004 | EP1309740B1 Elastic contact element |
| 10/06/2004 | CN1535331A Apparatus for plating treatment |
| 10/06/2004 | CN1170010C Copper plated material, its manufacturing method and method for copper plating |
| 09/30/2004 | WO2003076694A3 Methods and apparatuses for analyzing solder plating solutions |
| 09/30/2004 | US20040192066 Method for immersing a substrate |
| 09/30/2004 | US20040188259 Design of deposits to ajust for defects in working surfaces; electrochemistry |
| 09/29/2004 | EP1142091B1 Power supply and method for producing non-periodic complex waveforms |
| 09/29/2004 | CN1169282C Electroplating current supply system |
| 09/29/2004 | CN1168854C System, device and method for electroplating semiconductor wafer |
| 09/28/2004 | US6797141 Removal of coagulates from a non-glare electroplating bath |
| 09/23/2004 | WO2004081261A2 Plating apparatus |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | US20040182715 Process and apparatus for air bubble removal during electrochemical processing |
| 09/23/2004 | US20040182712 Process and system for eliminating gas bubbles during electrochemical processing |
| 09/23/2004 | US20040182694 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/22/2004 | EP1458905A2 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/22/2004 | CN1530471A Apparatus and utilizing method for preventing electroplating depositing copper thin membrane generating cavity |
| 09/21/2004 | US6793794 Using an insoluble anode and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions; uniform primary current distribution between the cathode and anode; no particles produced from black film |
| 09/21/2004 | US6793792 Passing electrical current through conductive surface of metal and the adjacent electroplating solution to determine/maintain the voltage based on the current |
| 09/16/2004 | WO2004079057A1 Electrocoat management system |
| 09/16/2004 | WO2004079053A1 Process for producing electrolytic copper foil |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | US20040180516 Method for electrochemical oxidation |
| 09/16/2004 | US20040178058 Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film |
| 09/16/2004 | DE10153171B4 Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen Method and apparatus for electrolytic treatment of parts in continuous flow systems |
| 09/16/2004 | CA2518051A1 Electrocoat management system |
| 09/15/2004 | CN2641065Y Electroplating filtering machine with air agitating function |
| 09/15/2004 | CN1529903A Plating system with remote secondary anode for semiconductor manufacturing |
| 09/15/2004 | CN1529774A Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
| 09/15/2004 | CN1529642A Continuous casting roll for casting molten baths and method for producing same |
| 09/14/2004 | US6790377 Method for electrochemical fabrication |
| 09/14/2004 | US6790331 Electrodeposition coating film thickness calculating method, recording medium stored with film thickness calculating program and readable by means of computer, and electrodeposition coating film thickness simulation apparatus |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/09/2004 | DE10307170A1 Weighing device for use in a paint dipping installation, especially for continuous determination of the difference in weight of un-dipped and dipped auto components comprises a support for a part with weighing cells |
| 09/08/2004 | EP1455006A1 Method and apparatus for galvanizing components |
| 09/02/2004 | WO2004075266A2 Method for immersing a substrate |
| 09/02/2004 | WO2004074553A2 Plating using an insoluble anode and seperately supplied plating material |
| 09/02/2004 | US20040168925 Electrochemical system for analyzing performance and properties of electrolytic solutions |
| 08/31/2004 | US6784104 Method for improved cu electroplating in integrated circuit fabrication |
| 08/31/2004 | US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating |
| 08/26/2004 | US20040163948 Plating apparatus and method of managing plating liquid composition |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | DE10310071B3 Process for galvanizing components with metallic coatings comprises moving the component to be coated through process stations using a gripper (20), and immersing in galvanic baths |
| 08/25/2004 | CN1163639C Anodic oxygenation method and operation apparatus thereof |
| 08/25/2004 | CN1163638C Electrodeposit copper foil mfg method |
| 08/24/2004 | US6780253 Gradient dragout system in a continuous plating line |
| 08/19/2004 | US20040159551 dissolving metal particles in a plating system containing a cathode (especially a circuit board) and an insoluble anode and contacting with oxygen in the form of air bubbles, which is automatically or manually controlled; relatively low temperature |
| 08/19/2004 | US20040159550 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | CN1522464A Method and apparatus for controlling a plating process |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6777831 Power supply device, for supplying a controlled electrical signal in an operations such as plating, etching, etc. |
| 08/17/2004 | US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 08/12/2004 | WO2004067809A1 Method for regeneration of an electrolysis bath for the production of a compound i-iii-vi2 in thin layers |
| 08/12/2004 | US20040154927 Internal heat spreader plating methods and devices |
| 08/11/2004 | EP1445353A1 Method and device for surface treatment of treated object |
| 08/11/2004 | EP1444722A2 Method and system to provide electrical contacts for electrotreating processes |
| 08/11/2004 | EP1133589B1 Enhanced membrane electrode devices useful for electrodeposition coating |