Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 21 - Processes for servicing or operating cells for electrolytic coating
Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
08/2003
08/14/2003US20030150743 Divalent tin ions; acid or complexing agent that forms a water-soluble salt or complex with the tin; one or more metals selected from elements of Groups IB to VB of the fourth to sixth periods
08/14/2003US20030150736 Apparatus and method for removing contaminants from semiconductor copper electroplating baths
08/14/2003US20030150735 Method and apparatus for treating an aqueous electroplating bath solution
08/14/2003US20030150734 Electroplating solution composition control
08/14/2003US20030150715 Anode assembly and method of reducing sludge formation during electroplating
08/13/2003EP0879902B1 Treating method and apparatus utilizing chemical reaction
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/07/2003WO2003064731A1 Methods of anodizing sintered valve metal anodes
08/07/2003WO2003064331A1 Recovery process for wastes containing hexavalent chromium
08/07/2003US20030146101 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness
08/07/2003CA2472155A1 Methods of anodizing sintered valve metal anodes
08/06/2003EP1332243A2 Method and apparatus for electrodeposition or etching of uniform films with minimal edge exclusion on substrate
08/06/2003CN1117178C Technology process and equipment for depositing permalloy film electrically
08/05/2003US6602394 Alkali zinc nickel bath
07/2003
07/31/2003WO2003063277A2 Combination liquid dispenser and electrochemical cell
07/31/2003WO2003062505A1 Anodization device and anodization method
07/31/2003WO2003062504A1 Liquid treating device, and liquid treating method
07/31/2003WO2003062150A1 Advanced electrodeionization for fluid recycling
07/31/2003US20030143137 Recovery process for wastes containing hexavalent chromium
07/31/2003US20030141193 Sintered wet electrolyte high voltage capacitors; insertable medical devices
07/30/2003CN1433487A Method and apparatus for electrodeposition or etching of uniform film with miniml edge exclusion on substrate
07/30/2003CN1433049A Processing liquid compounding and supplying method and device
07/29/2003US6600629 Thin film magnetic head having gap layer made of nip and method of manufacturing the same
07/29/2003US6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
07/24/2003US20030136763 Processing solution preparation and supply method and apparatus
07/24/2003US20030136666 Combination liquid dispenser and electrochemical cell
07/24/2003DE10215463C1 Continuous plant for electrolytic metallization of printed circuit boards, includes precautions reducing electrical potential between adjacent workpieces
07/22/2003US6597182 Detector for detecting contact resistance anomaly of cathode electrode in electroplating machine
07/22/2003US6596148 Regeneration of plating baths and system therefore
07/17/2003WO2003057946A1 A method for the manufacture of electrodes
07/16/2003CN1429934A Forming method of anode oxidation film on chain tooth row and its forming equipment
07/15/2003US6592737 Method and apparatus for determination of additives in metal plating baths
07/15/2003US6592736 Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
07/10/2003WO2003056609A2 Apparatus and method for electroplating a wafer surface
07/10/2003US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces
07/10/2003US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/10/2003US20030127334 Method for determining a concentration of conductive species in an aqueous system
07/09/2003CN2559656Y Water-saving device for electroplating equipment
07/09/2003CN1429284A Elastic contact element
07/08/2003US6589593 Method for metal coating of substrates
07/08/2003US6589400 Apparatus for metal coating of bands by electroplating
07/03/2003WO2003055285A1 Applications for activated fluids
07/03/2003US20030122292 Chemical processing system
07/03/2003US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/02/2003EP1323186A2 Plating system with remote secondary anode for semiconductor manufacturing
07/02/2003EP1322591A2 Ionic liquids and their use
07/02/2003EP1015669A4 Article, method, and apparatus for electrochemical fabrication
07/01/2003US6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
06/2003
06/26/2003US20030116442 Method for applying a metal layer to a light metal surface
06/26/2003US20030116440 Rinsing substrate in holder; retractable shutter
06/25/2003CN1426495A Electro-plating apparatus and method
06/24/2003US6582578 Method and associated apparatus for tilting a substrate upon entry for metal deposition
06/19/2003WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
06/19/2003US20030111346 Micro structured electrode and method for monitoring wafer electroplating baths
06/19/2003US20030111339 Plating system
06/11/2003EP1102875B1 Alkali zinc nickel bath
06/10/2003US6576111 Process for the copper plating of substrates
06/10/2003US6576110 Use with metal film plating; having a planar electric field generating portion coated with an inert material such as tantalum that is impervious to electrolyte solution and an electrolyte solution chemical reaction portion
06/04/2003CN2554188Y Internal circulation loop structure of electroplating filter
06/04/2003CN1110585C Control method of concentration of electroplating liquid components in continuous electroplating
06/04/2003CN1110583C Waste liquid treatment pocess for aluminium material surface treatment
06/03/2003US6572753 Method for analysis of three organic additives in an acid copper plating bath
06/03/2003US6572742 Apparatus for electrochemical fabrication using a conformable mask
05/2003
05/28/2003EP1125007A4 Submicron metallization using electrochemical deposition
05/28/2003CN2552946Y Device for recoverying useful material from chloride solution
05/28/2003CN1420212A Small plated body electroplating device
05/27/2003US6569307 Object plating method and system
05/27/2003US6569297 Workpiece processor having processing chamber with improved processing fluid flow
05/22/2003WO2003042434A1 Method and device for surface treatment of treated object
05/22/2003US20030094375 Comprises continuously detecting deterioration state of gold sulfite complex plating solution
05/22/2003US20030094373 Comprises grooved cathode for uniformly concentrating electric fields; microelectronics
05/22/2003US20030094372 Mist trap mechanism and method for plating apparatus
05/20/2003US6565734 Electrochemical process using current density controlling techniques
05/20/2003US6565729 Using alkaline electrolyte bath; uniform overcoatings
05/20/2003US6565722 Installation and method for multilayered immersion coating
05/15/2003WO2003041209A2 Device and method for the temporally and spatially dependent measuring of an operating parameter of an electrochemical cell
05/15/2003US20030089622 The anode includes an active material stable at acid pH and at high electrical potential and selectively degrades organic compounds by electrochemical oxidation; the separator allowspreferentially passage of protons over other ions;
05/14/2003EP1309740A2 Elastic contact element
05/14/2003CN2550381Y Cooling pipe for electrolytic solution
05/14/2003CN1418454A Treatment of circuit supports with impulse excitation
05/14/2003CN1418265A Method and device for regulation of concentration of metal ions in electrolyte and use thereof
05/14/2003CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating
05/14/2003CN1418050A Manufacture of wiring substrate
05/14/2003CN1108399C Method and apparatus for regenerating sulfate electrolyte in galvanization of band steel
05/14/2003CA2362244A1 Method of treating an electroplating bath
05/13/2003US6562223 Using electrolyte solutions; for aluminum
05/08/2003WO2003038159A2 Method and conveyorized system for electrolytically processing work pieces
05/08/2003WO2003005430A3 Method and apparatus for controlling a plating process
05/08/2003US20030085129 Method of forming zinc oxide film, method of producing semiconductor element substrate using same, and method of producing photovoltaic element
05/08/2003CA2454267A1 Method and conveyorized system for electrolytically processing work pieces
05/01/2003WO2003036693A2 Method and system to provide electrical contacts for electrotreating processes
05/01/2003WO2003035943A1 Electrolytic copper plating method, electrolytic copper plating-use phosphorus-containing copper anode and semiconductor wafer with little particles deposition plated by using them
05/01/2003US20030079683 Chemical vapor deposition; silicon carbide films; dielectrics
04/2003
04/29/2003US6554976 Electroplating apparatus
04/24/2003WO2003033774A1 Submerged transfer plating device with plating fluid jetting tube
04/24/2003WO2003033770A2 System and method for electrolytic plating
04/24/2003US20030075451 Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof
04/24/2003US20030075449 Method for controlling field flow decouple plating and a device thereof
04/23/2003CN1106459C Process and device for electrolytic treatment of continuous running materials
04/17/2003WO2003018874A3 Apparatus and methods for electrochemical processing of microelectronic workpieces
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