| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 01/26/2005 | CN1571865A System and method for electrolytic plating |
| 01/25/2005 | US6846416 Using precipitation promoter; adjustment ph |
| 01/25/2005 | US6846392 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
| 01/25/2005 | CA2136703C Apparatus for dissolving zinc by means of acid-containing liquid electrolytes |
| 01/20/2005 | WO2004101863A3 Method and device for coating a substrate |
| 01/20/2005 | WO2004094701A3 Method and apparatus for monitoring, dosing, and distribution of chemical compositions |
| 01/19/2005 | CN2672085Y Ventilation heat radiator for electrolytic bath |
| 01/13/2005 | WO2005003411A1 Tin alloy electroplating system |
| 01/13/2005 | US20050010321 Electrocoat management system |
| 01/13/2005 | US20050006242 Void-free damascene copper deposition process and means of monitoring thereof |
| 01/12/2005 | CN1564941A Improved method for analysis of three organic additives in an acid copper plating bath |
| 01/11/2005 | US6841074 Method and apparatus of purifying an electrolyte |
| 01/06/2005 | US20050000820 Apparatus and method for processing a substrate |
| 01/05/2005 | CN1561409A Segmented counterelectrode for an electrolytic treatment system |
| 01/05/2005 | CN1182939C Method and apparatus for deposition on and polishing of semiconductor surface |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6837978 Actuator is connected to the holder and adjustably positions the substrate relative to the electrolyte cell; |
| 01/04/2005 | US6837973 Apparatus for electrically coating a hot-rolled steel substrate |
| 12/30/2004 | US20040262164 Method and apparatus for managing plating interruptions |
| 12/30/2004 | US20040262152 Electrochemical system for analyzing performance and properties of electrolytic solutions |
| 12/30/2004 | US20040262150 Plating device |
| 12/30/2004 | DE10325101A1 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs) Method for filling μ-blind vias (μ-BVs) |
| 12/30/2004 | DE10322321A1 Electrolytic arrangement and method for manufacturing moldings, especially for dental use as crowns or bridges, whereby a special raising and lowering assembly is provided for the anode and cathode |
| 12/29/2004 | WO2004097929A3 Method and apparatus for reduction of defects in wet processed layers |
| 12/29/2004 | EP1490675A2 Reference electrode calibration for voltammetric plating bath analysis |
| 12/29/2004 | EP1490663A1 A method and apparatus for automated analysis and characterization of chemical constituents of process solutions |
| 12/29/2004 | CN1558964A Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method |
| 12/29/2004 | CN1557999A Technology for treating electroplating effluent by biochemical process |
| 12/29/2004 | CN1182278C Method for producing soluble copper in the production of electrolytic copper foil |
| 12/29/2004 | CN1182277C Electrolytically processing method |
| 12/28/2004 | US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 12/28/2004 | US6835294 Dummy electrolysis corrects reduction in via-holes filling |
| 12/23/2004 | WO2004111313A1 Method for the recovery of gold and/or silver from a cyanide complexes solution of gold and/or silver |
| 12/23/2004 | US20040259354 Deposition stop time detection apparatus and methods for fabricating copper wiring using the same |
| 12/23/2004 | US20040258860 Electroforming apparatus and electroforming method |
| 12/23/2004 | US20040258847 Method of measuring component loss |
| 12/23/2004 | US20040256235 Removing one metal from an alloy plating solution containing two kinds of metals that differ in standard electrode potential, and preparing a single metal plating solution from the remaining other metal |
| 12/23/2004 | US20040256221 Electrolytic solution supply and recovery facility and liquid component replenishment apparatus |
| 12/23/2004 | DE10349392B3 Demetallizing contact devices in galvanizing plants used in production of circuit boards or foils comprises chemically etching auxiliary electrode during electrolytic metallization and simultaneously demetallizing |
| 12/22/2004 | EP1488025A1 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 12/22/2004 | CN1556253A Preparation method of composite cladding material and equipment |
| 12/21/2004 | US6833479 Triethanolamine modified propylene oxide/ethylene oxide adducts |
| 12/21/2004 | US6833124 Reacting a soluble non-toxic precipitating reagent with the hexavalent chromium to form an insoluble precipitate; reacting insoluble with an acidic solution to form insoluble precipitate and soluble chromium compound; recovering |
| 12/16/2004 | US20040251141 Capable of achieving reliable removal of bubbles from treatment liquid wherein substrate is placed to face plate and treatment liquid is jetted from plate; bubble discharge portion formed in plate discharges bubbles in treatment liquid, thereby reducing nonuniform treatment caused by bubbles |
| 12/16/2004 | US20040250981 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 12/16/2004 | DE4423630B4 Vorrichtung für die Behandlung von Gegenständen mit einer Behandlungsflüssigkeit im Zuge der galvanotechnischen Behandlung der Gegenstände Device for treatment of objects with a treatment liquid during the electroplating treatment of the articles |
| 12/15/2004 | EP1092338B1 Assembly of an electronic component with spring packaging |
| 12/15/2004 | CN2662978Y Diamond micropowder separator |
| 12/14/2004 | US6830673 Anode assembly and method of reducing sludge formation during electroplating |
| 12/14/2004 | US6830666 Device for supporting semiconductor in electroplating solution; electrical circuit, including electrode, for applying electrical potential across solution; control device to change distance between electrode and semiconductor |
| 12/09/2004 | WO2004107834A1 Process for filing micro-blind vias |
| 12/09/2004 | WO2004088003A3 Method and device for controlling at least one operating parameter of an electrolytic bath |
| 12/09/2004 | US20040245113 Electrochemical cell containing anolyte and catholyte compartments separated by a selective membrane that prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment; latent whiskering is minimized and/or eliminated |
| 12/09/2004 | US20040245111 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 12/09/2004 | US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus |
| 12/09/2004 | US20040245107 Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions |
| 12/09/2004 | US20040245106 Compact construction; baths; agitation means; liquid supply tunnels; discharging; plating |
| 12/09/2004 | US20040245094 Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
| 12/09/2004 | US20040245093 Method and conveyorized system for electorlytically processing work pieces |
| 12/09/2004 | DE10322120A1 Verfahren und Vorrichtungen zur Verlängerung der Nutzungsdauer einer Prozesslösung für die chemisch-reduktive Metallbeschichtung Methods and apparatus for extending the useful life of a processing solution for the chemical reductive metal coating |
| 12/08/2004 | EP1484431A2 Liquid tank |
| 12/08/2004 | EP1483212A1 Advanced electrodeionization for fluid recycling |
| 12/07/2004 | US6827839 Plating bath analysis |
| 12/07/2004 | US6827832 Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
| 12/02/2004 | WO2003063277A3 Combination liquid dispenser and electrochemical cell |
| 12/02/2004 | DE10323658A1 Verfahren und Vorrichtung zur Beschichtung eines Substrats Method and apparatus for coating a substrate |
| 12/01/2004 | EP1481116A1 Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 12/01/2004 | EP1481114A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/01/2004 | EP1264009B1 Method for applying a metal layer to a light metal surface |
| 12/01/2004 | CN1551931A Method and apparatus for controlling thickness uniformity of electroplated layers |
| 12/01/2004 | CN1550579A Improved electroplating liquid analysis |
| 12/01/2004 | CN1550578A Analysis method |
| 11/30/2004 | US6826440 Experimental management apparatus and experimental management program for electroplating |
| 11/30/2004 | US6824662 Electrodeionization apparatus and method |
| 11/25/2004 | WO2004101866A2 Method and devices for increasing the service life of a process solution for chemical-reductive metal coating |
| 11/25/2004 | WO2004101863A2 Method and device for coating a substrate |
| 11/25/2004 | WO2004101860A1 High purity electrolytic sulfonic acid solutions |
| 11/25/2004 | WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 11/25/2004 | US20040232091 Blocks off a portion of flow of liquid used in a flow process (e.g., plating solution for formimg a bump electrode), by using a partition plate whose lower end is in close contact with a bottom of a plating tank and whose upper end is at a position lower than a liquid surface |
| 11/25/2004 | US20040232005 For treating electric circuit boards and other circuit carriers, particularly those that demand very thin base layers; counterelectrodes are each subdivided into at least two electrode segments: a contact-near electrode segment and a contact-remote electrode, each fed by a separate current source |
| 11/25/2004 | US20040231994 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte |
| 11/25/2004 | US20040231993 Monitor includes a radiation source directed at the anodized substrate; a probe for capturing radiation reflected and refracted by the anodized coating, and a detector to process captured radiation to allow determination of the coating thickness |
| 11/25/2004 | DE10307170B4 Gewichtskraftbestimmung in Tauchlackierstraßen Weight determination in force Tauchlackierstraßen |
| 11/25/2004 | CA2525064A1 High purity electrolytic sulfonic acid solutions |
| 11/24/2004 | CN2658173Y Ulltrasonic cleaning device for electroplating production line |
| 11/23/2004 | US6821407 Anode and anode chamber for copper electroplating |
| 11/23/2004 | US6821404 Copper recovery process |
| 11/18/2004 | US20040226826 Electrolytic cells; immersion bath; wire mesh screen; variations in pattern density on substrate surface |
| 11/18/2004 | US20040226816 Plating processing device |
| 11/18/2004 | DE10210538B4 Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut Horizontal continuous flow system and method for electroplating treatment of treated |
| 11/17/2004 | EP1476590A1 Method for storage of a metal ion supply source in a plating equipment |
| 11/16/2004 | US6818115 For circuit boards; provides improved flow of electrolyte through holes of printed circuit boards, which generates improved throwing power of plating inside through holes and blind vias |
| 11/11/2004 | WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers |
| 11/11/2004 | WO2004096717A2 Method and apparatus for treating waste water |
| 11/11/2004 | WO2004075266A3 Method for immersing a substrate |
| 11/11/2004 | US20040222101 Removing impurities from plating bath; rotating support; circulation solutions; fluid flow over weir plate |
| 11/11/2004 | US20040222100 Process and system for providing electrochemical processing solution with reduced oxygen and gas content |
| 11/11/2004 | US20040222085 Configurations and methods of electrochemical lead recovery from contaminated soil |
| 11/10/2004 | EP1165861B1 Copper recovery process |
| 11/10/2004 | CN1545572A Electroforming apparatus and electroforming method |