| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 04/17/2001 | US6217727 Electroplating apparatus and method |
| 04/17/2001 | CA2211184C Method and apparatus for delivering electromagnetic energy into a solution |
| 04/11/2001 | CN1291243A Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/11/2001 | CN1290771A Electroplating device and process for electroplating parts using said device |
| 04/10/2001 | US6214193 Semiconductor wafers |
| 04/10/2001 | CA2120177C Method for recovering and reproducing tinning liquid |
| 04/05/2001 | DE10045830A1 Removal of metal ions from aqueous solution, e.g. waste liquor, process bath or lixiviation solution, involves adjusting to suitable pH, adding solid organic chelant, stirring and removing metal complex formed |
| 04/04/2001 | EP1088121A2 Method for metal coating of substrates |
| 04/04/2001 | CN1290310A Plating apparatus and method |
| 03/29/2001 | WO2000036737A9 Power supply and method for producing non-periodic complex waveforms |
| 03/29/2001 | DE19932524C1 Verfahren und Vorrichtung zur elektrochemischen Behandlung Method and apparatus for electrochemical treatment |
| 03/29/2001 | DE10030717A1 Stationary measurement of entrainment of treatment solutions during transport of products on frames, in drums or other devices comprises maintaining and/or stabilizing operating parameters |
| 03/28/2001 | CN1288979A Technology process and equiment for depositing permalloy film electrically |
| 03/27/2001 | US6207034 Method of manufacture of polymer transistors with controllable gap |
| 03/27/2001 | US6207033 Process and apparatus for regeneration of chromium plating bath |
| 03/21/2001 | EP1085111A1 A replenishment process for metal electrodeposition baths |
| 03/20/2001 | US6203685 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 03/13/2001 | US6200450 Method and apparatus for depositing Ni-Fe-W-P alloys |
| 03/13/2001 | US6200436 Recycling consistent plating system for electroplating |
| 03/08/2001 | WO2001016405A1 Method for measuring leveler concentration of plating solution, and method and apparatus for controlling plating solution |
| 03/07/2001 | EP1081253A2 Double pressure vessel chemical dispenser unit |
| 03/07/2001 | EP1080253A2 Chemical mixing, replenishment, and waste management system |
| 03/07/2001 | EP1080252A1 Method for electro copperplating substrates |
| 03/07/2001 | CN1286323A Technology and equipment for cleaning electroplated parts without discharge of sewage |
| 02/27/2001 | US6193863 Product conveyance mechanism for electroplating apparatus |
| 02/27/2001 | US6193860 Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents |
| 02/13/2001 | US6187166 Integrated solution electroplating system and process |
| 02/13/2001 | US6187153 Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process |
| 02/13/2001 | US6186316 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems |
| 02/08/2001 | WO2001009409A1 Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process |
| 02/08/2001 | WO2001009399A1 Silver recovery from acidic brine solution by cementation |
| 02/01/2001 | DE19935337A1 Partially coating metallic workpieces comprises completely or partially removing the lacquer in the regions to be coated, and subjecting the workpiece to a cathodic electro-dip lacquering on the regions to be coated |
| 01/30/2001 | US6179984 Circuit arrangement for supplying pulse current to electrolytic cells connected in parallel; method is used for electroplating of printed circuit boards in vertical dipping systems and in vertical and horizontal feed through systems |
| 01/25/2001 | WO2000061498A3 System for electrochemically processing a workpiece |
| 01/24/2001 | EP1070772A2 Electroplating device, and process for electroplating work using the device |
| 01/24/2001 | CN1281517A Copper metallization of silicon wafers using insoluble anodes |
| 01/23/2001 | US6176993 Process for recycling reaction system of electroplating passivation of wafers |
| 01/23/2001 | US6176992 Method and apparatus for electro-chemical mechanical deposition |
| 01/16/2001 | US6174417 Electroplating machine |
| 01/10/2001 | CN1279303A Electrolytically processing method |
| 01/04/2001 | DE19925471A1 Treatment of waste water from an electrolytic bath using reverse osmosis and selective ion-exchange to allow metal recovery |
| 01/02/2001 | US6168693 Apparatus for controlling the uniformity of an electroplated workpiece |
| 12/28/2000 | WO2000079029A2 Method and apparatus for electro-deposition of metal |
| 12/28/2000 | DE19726510C2 Vorrichtung und Verfahren zur elektrolytischen Metallabscheidung mittels Pulsstrom Apparatus and method for electrolytic metal deposition by means of pulse current |
| 12/28/2000 | CA2377264A1 Method and apparatus for electro-deposition of metal |
| 12/27/2000 | EP1063324A2 A method of in-situ displacement/stress control in electroplating |
| 12/27/2000 | EP1063103A2 Electrolytic treatment method |
| 12/26/2000 | US6165330 Continuous plating apparatus |
| 12/21/2000 | DE19926019A1 Process for monitoring growing layers used in vacuum coating processes comprises directing a measuring beam before starting the layer growth into a galvanic bath and onto a layer substrate |
| 12/19/2000 | US6162361 Plating waste water treatment and metals recovery system |
| 12/13/2000 | EP1059367A2 Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board |
| 12/13/2000 | CN1276442A Electrodeposit copper foil and its mfg method, copper coated laminate and PC board |
| 12/13/2000 | CN1059475C Method and device for on-line control of organic additive in electrodeposition of metal |
| 12/07/2000 | WO2000036737A3 Power supply and method for producing non-periodic complex waveforms |
| 12/07/2000 | DE19911447A1 Brightening and leveling additive concentrations, especially in copper electroplating baths, are separately analyzed by titration and derivation from a previously determined calibration matrix |
| 12/06/2000 | EP1057902A2 Improved process for synthesizing a palladium replenisher for electroplating baths |
| 11/29/2000 | EP1055020A2 Plating apparatus and method |
| 11/28/2000 | US6153065 Internal stress testing device for high speed electroplating |
| 11/28/2000 | US6153064 Apparatus for in line plating |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 11/16/2000 | WO2000068468A1 Copper replenishment technique for precision copper plating system |
| 11/16/2000 | WO2000003073A3 Paced chemical replenishment system |
| 11/15/2000 | EP1052311A1 Plating machine |
| 11/15/2000 | EP1051541A2 Method for electrically regenerating contaminated rhodium solutions |
| 11/14/2000 | US6146515 Power supply and method for producing non-periodic complex waveforms |
| 11/08/2000 | EP1050607A2 A method and an equipment for the electrolytic deposition of gold or gold alloys |
| 11/08/2000 | CN1272956A Apparatus and methods for controlling workpiece surface exposure to processing liquids during fabrication of microelectronic components |
| 11/07/2000 | US6143146 Filter system |
| 11/02/2000 | EP1048757A1 Plating method and apparatus |
| 11/02/2000 | EP1048755A1 Plating device and method of confirming current feed |
| 10/31/2000 | US6139711 For measuring the throwing power of electroplating solutions. |
| 10/31/2000 | US6139703 Cathode current control system for a wafer electroplating apparatus |
| 10/31/2000 | CA2031028C Process for purification of nickel plating baths |
| 10/25/2000 | CN2402691Y Electro-deposition coating device |
| 10/19/2000 | WO2000061837A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 10/19/2000 | WO2000061498A2 System for electrochemically processing a workpiece |
| 10/18/2000 | CN1270642A Cathode current control system for a wafer electroplating apparatus |
| 10/17/2000 | US6132584 Process and circuitry for generating current pulses for electrolytic metal deposition |
| 10/12/2000 | WO2000059605A1 Device for cleaning a fluid in the form of a vapor from a circuit |
| 10/12/2000 | WO2000026443A3 Method and apparatus for electrochemical mechanical deposition |
| 10/11/2000 | CN1269432A Anodic oxygenation method and operation apparatus thereof |
| 10/04/2000 | EP1041178A2 Anodizing method and apparatus for performing the same |
| 10/04/2000 | CN2399403Y Alloyed launder |
| 10/03/2000 | US6126808 A reaction chamber holding an electrolyte for surface treating the head of aluminum pistons used in combustion engines |
| 09/28/2000 | WO2000056453A1 Method for producing a catalyst by means of electrodeposition |
| 09/28/2000 | DE19913273A1 Production of pearl chromium layers on metal workpieces uses a chromic acid bath in which the cathodic current density is adjusted proportionally to the temperature of the bath |
| 09/28/2000 | DE19912897A1 Katalysator und Verfahren zur Herstellung eines Katalysators Catalyst and process for the preparation of a catalyst |
| 09/28/2000 | CA2367893A1 Method for producing a catalyst by means of electrodeposition |
| 09/27/2000 | CN1267749A Lead-tin anode scavenger for chromium plating process |
| 09/26/2000 | US6123815 Plating apparatus |
| 09/26/2000 | CA2040809C Apparatus and process to regenerate a trivalent chromium bath |
| 09/20/2000 | EP1036222A1 Copper metallization of silicon wafers using insoluble anodes |
| 09/20/2000 | CN1267342A Method and device for regulating concentration of substaces in electrolytes |
| 09/19/2000 | US6120673 Method and device for regenerating tin-plating solutions |
| 09/14/2000 | WO2000020662A9 Submicron metallization using electrochemical deposition |
| 09/08/2000 | WO2000052229A1 Copper recovery process |
| 09/05/2000 | US6113769 Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal |
| 08/31/2000 | WO2000026445A3 Enhanced membrane electrode devices useful for electrodeposition coating |
| 08/30/2000 | CN1264757A Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
| 08/29/2000 | US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |