| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 05/12/2005 | WO2005035836B1 Volume measurement apparatus and method |
| 05/12/2005 | WO2001096632A3 A method and apparatus for conditioning electrochemical baths in plating technology |
| 05/10/2005 | US6890416 Copper electroplating method and apparatus |
| 05/10/2005 | US6890414 Plating electrolytic cell; configuration to removal by-products |
| 05/10/2005 | US6890413 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 05/05/2005 | US20050092610 Uniform thickness and rate of metal deposition |
| 05/04/2005 | EP1527215A2 Apparatus and method for electroplating a wafer surface |
| 05/04/2005 | CN1200145C Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
| 04/28/2005 | US20050089645 Flexible member can be used to provide a uniform force to securely retain the workpiece to be positioned in a process module resulting in uniform coatings; for fluid processing (e.g. electrodeposition) of substrates e.g. semiconductor wafers |
| 04/27/2005 | CN1610769A 电镀装置 Plating equipment |
| 04/27/2005 | CN1609281A Method for electrolytic copper plating |
| 04/27/2005 | CN1609011A Electrolytic bath for processing waste liquid containing high concentration cyanide |
| 04/26/2005 | US6885727 Apparatus and method for measuring thickness and composition of multi-layered sample |
| 04/26/2005 | US6884333 A mechanical cell having a plurality of cathodic or anodic regions, each can measuring different currents and voltages while simultaneously electrodepositing, quality control |
| 04/26/2005 | US6884332 Method and apparatus for treating an aqueous electroplating bath solution |
| 04/21/2005 | WO2005035836A1 Volume measurement apparatus and method |
| 04/21/2005 | US20050084987 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/21/2005 | US20050083048 Plating system with integrated substrate inspection |
| 04/21/2005 | US20050082172 Copper replenishment for copper plating with insoluble anode |
| 04/21/2005 | US20050082163 Plating apparatus and method |
| 04/21/2005 | DE19723975B4 Kontinuierliches, rechnergesteuertes Verfahren zur Herstellung von schwarzchromatierten oberflächenfehlerfreien, komplettierbaren Spritzgußteilen aus Magnesiumlegierungen mit elektrisch leitfähigen und optimal haftfähigen Oberflächenbereichen, und Anwendung dieses Verfahrens Continuous, computer controlled process for preparing schwarzchromatierten surface defects free, komplettierbaren injection molded parts made of magnesium alloys with electrically conductive adhesive, and optimally surface regions, and application of this method |
| 04/20/2005 | EP1524338A1 Plating device |
| 04/14/2005 | WO2005033655A2 Electrode assembly for analysis of metal electroplating solutions |
| 04/14/2005 | WO2005033377A2 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface |
| 04/14/2005 | US20050077185 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 04/14/2005 | US20050077182 Automatic determine the volume of electroplating solution in the vessel with ultrasonic signal: precisely determine the volume prior feeding into an electrochemical processing system; use in depositing conductive materials on integrated circuit substrates |
| 04/14/2005 | US20050077181 Modified electroplating solution components in a low-acid electrolyte solution |
| 04/14/2005 | US20050077180 Reduce electrodepositing defects, and reduce within die thickness variations; adjusting the concentrations of suppressor, a leveler and chloride accelerator; depositing copper, silver, gold and alloys on integrated circuit; wafer semiconductors |
| 04/14/2005 | US20050076837 Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 04/13/2005 | EP1521868A2 Device and method for monitoring an electrolytic process |
| 04/13/2005 | CN1197443C Assembly of an electronic component with spring packaging |
| 04/13/2005 | CN1196815C Method and equipment for preparing and supplying electrolyte in electro-chemical processing device |
| 04/12/2005 | US6878258 Apparatus and method for removing contaminants from semiconductor copper electroplating baths |
| 04/12/2005 | US6878245 Method and apparatus for reducing organic depletion during non-processing time periods |
| 04/07/2005 | US20050072680 Rotating about axis passing through surface to be plated and moving wafer such that its axis rotates about second axis of rotation |
| 04/06/2005 | EP1381824B1 Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs |
| 04/06/2005 | CN1603474A Method for preventing displacement reaction in tin bismuth electroplating system |
| 04/06/2005 | CN1603472A Manufacturing method of catelectrode |
| 04/06/2005 | CN1195879C Method of recovering metal from metal-containing sludge |
| 04/05/2005 | US6875539 Combination liquid dispenser and electrochemical cell |
| 03/31/2005 | WO2005028717A1 Insoluble anode with an auxiliary electrode |
| 03/31/2005 | US20050067304 Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism |
| 03/31/2005 | US20050067290 Electroplating tool and controller; chemical mechanical polishing |
| 03/31/2005 | US20050067288 Barrier separates inlet/outlet area, as inlet lines terminate closely beneath liquid surface; plating tool/reactor |
| 03/31/2005 | DE10341998A1 Galvanizing or coating applicator has non-self priming pump with secondary self priming pump between process chamber and discharge tank |
| 03/24/2005 | WO2005026688A2 Sampling management for a process analysis tool to minimize sample usage and decrease sampling time |
| 03/24/2005 | WO2002053806A3 Electrochemical coating device and method |
| 03/24/2005 | US20050064281 Combination liquid dispenser and electrochemical cell |
| 03/24/2005 | US20050061659 Plating apparatus and plating method |
| 03/23/2005 | EP1516076A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 03/22/2005 | US6869516 Spraying a vapor mixture of isopropyl alcohol and nitrogen to effectively remove electrolyte residue from the contact ring |
| 03/17/2005 | US20050056538 Insoluble anode with an auxiliary electrode |
| 03/16/2005 | CN2685355Y Fore-and-aft treatment jetter for electroplating machine |
| 03/10/2005 | WO2004013381A3 Insoluble anode loop in copper electrodeposition cell for interconnect formation |
| 03/10/2005 | WO2003056609A3 Apparatus and method for electroplating a wafer surface |
| 03/10/2005 | US20050053522 Sampling management for a process analysis tool to minimize sample usage and decrease sampling time |
| 03/10/2005 | US20050051434 Method and apparatus for controlling electrolytic solution |
| 03/10/2005 | US20050051433 System for monitoring, dosing and distribution of a chemical composition in a material treatment process, the chemical composition containing at least one additive for maintaining quality of the chemical treatment process; particularly directed to the field of management of electroplating bath solutions |
| 03/10/2005 | US20050051425 Electroplating apparatus with functions of voltage detection and flow rectification |
| 03/10/2005 | DE202004018048U1 Device for electrochemically processing workpieces comprises a cleaning unit consisting of a permeable flexible tube and through which contaminated electrolyte is conveyed under pressure, and a filtering auxiliary layer |
| 03/09/2005 | EP1148976B1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 03/03/2005 | WO2004096717A3 Method and apparatus for treating waste water |
| 03/03/2005 | US20050048769 Method of manufacturing a semiconductor device |
| 03/03/2005 | US20050045482 Produces heat energy in excess of electricity supplied; lithium deuteroxide dissolved deuterium oxide; palladium and/or gold particles deposited on cathode |
| 03/03/2005 | US20050045252 Composite alloy having a three-dimensional periodic hierarchical structure and method of producing the same |
| 03/02/2005 | EP1322591B1 Ionic liquids and their use |
| 03/02/2005 | CN1191605C Method and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | US20050040115 Engineered and optimized performance as current density; spacers include diagonally woven screens to provide optimized flow; optimized fluid distribution and flux for high ion separation efficiency; optimized cell compartments |
| 02/23/2005 | EP1419290B1 Segmented counterelectrode for an electrolytic treatment system |
| 02/23/2005 | CN1584129A Method and apparatus for separating copper from copper-containing waste liquid |
| 02/23/2005 | CN1191003C Device and method for treating circuit supports with impulse excitation |
| 02/23/2005 | CN1190274C Preparation of aluminium alloy part with precoating |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | DE10163017B4 Verfahren zum Betreiben eines Reaktionsbehälters A method for operating a reaction vessel |
| 02/16/2005 | EP1506329A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations |
| 02/16/2005 | CN1580334A Electroplating cleaning process and its apparatus |
| 02/16/2005 | CN1580333A Poaching water non-discharge process and apparatus for electroplating automatic line |
| 02/15/2005 | US6854347 Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs |
| 02/09/2005 | EP1505640A1 Method for electrochemical oxidation |
| 02/09/2005 | EP1504140A2 Combination liquid dispenser and electrochemical cell |
| 02/09/2005 | CN1578853A Method and conveyorized system for electorlytically processing work pieces |
| 02/09/2005 | CN1576400A Electroplating apparatus and method for electronic parts, and the same electronic parts |
| 02/09/2005 | CN1188088C Method for producing prosthetic moulded parts for dental use |
| 02/08/2005 | US6852207 Using galvanic deposition by pulse-plating, characterized in that gold or a gold alloy is deposited from a gold sulphite bath at a pulse current density of between 0.2 A/dm2 and 50 A/dm2 |
| 02/03/2005 | US20050023143 Impedance analyzer having a quartz crystal and a constant-current power supply unit; soaking the measuring device in an electrodeposition paint and calculating a film thickness ( mu m) to an applied voltage under electrodeposition painting in accordance with measured resonant frequency and/or resistance |
| 02/03/2005 | US20050023142 Electrodeposition characteristic measuring device, evaluation method, and control method |
| 02/03/2005 | DE10331616A1 Process for coating a workpiece, e.g. a cylinder lining of a cylinder block, comprises determining the actual geometry of the workpiece, comparing with a predetermined theoretical geometry, and coating in a controlled manner |
| 02/02/2005 | EP1503169A2 Electrodeposition characteristic measuring device, evaluation method, and control method |
| 02/02/2005 | CN1572917A Method for recycling of plating solutions |
| 02/02/2005 | CN1572914A Liquid tank |
| 02/02/2005 | CN1572910A Plating machine and process for producing film carrier tapes for mounting electronic parts |
| 02/02/2005 | CN1187479C Electroplating device and process for electroplating parts using said device and annular adhesive magnet |
| 02/01/2005 | US6848457 Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment |
| 01/27/2005 | WO2005007933A1 Electrochemical processing cell |
| 01/27/2005 | US20050016857 Electrochemical plating cell: a fluid basin containing an electrolyte plating solution, an anolyte fluid and a catholyte fluid, a tank to supply the solution and a stabilization device in fluid communication with the fluid tank; absorbant material leaches excess solution additive |
| 01/27/2005 | US20050016856 Determining the quantity of brightener and leveler in a metal plating bath using plating bath samples of known and different quantity of the brightener and the leveler, but where the quantity differs from the quantity in the other bath samples |
| 01/27/2005 | DE19723980B4 Kontinuierliches, rechnergesteuertes Verfahren zur Herstellung von schwarzverchromten, oberflächenfehlerfreien, komplettierbaren Spritzgußteilen aus Magnesiumlegierungen mit elektrisch leitfähigen und optimal haftfähigen Oberflächenbereichen und Anwendung dieses Verfahrens A continuous computer-controlled process for the preparation of black chrome, surface error-free, komplettierbaren injection molded parts made of magnesium alloys with electrically conductive and optimal adhesive surface areas and use of this method |
| 01/26/2005 | EP1499759A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 01/26/2005 | CN2673885Y Agitator for electroplating jewelry |