| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 12/11/2002 | EP1264010A1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof |
| 12/11/2002 | EP1264009A2 Method for applying a metal layer to a light metal surface |
| 12/05/2002 | WO2002097165A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/05/2002 | WO2002096807A2 Electrodeionization apparatus and method |
| 12/05/2002 | US20020179450 Selective shield/material flow mechanism |
| 12/05/2002 | US20020179121 Gradient dragout system in a continuous plating line |
| 12/04/2002 | EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 12/04/2002 | CN1382836A Maintenance method of electrolyte |
| 11/27/2002 | CN1381617A Anticorrosion method for electro-deposition coating device |
| 11/27/2002 | CN1381616A Electrolytic phosphate chemical treatment method |
| 11/26/2002 | US6485570 Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents |
| 11/20/2002 | CN1380915A Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in electrolysis apparatus |
| 11/14/2002 | US20020166772 Maintenance of an electrolyte |
| 11/13/2002 | CN1379829A Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| 11/07/2002 | US20020162752 Electrolytic phosphate chemical treatment method |
| 11/05/2002 | US6475369 Method for electrochemical fabrication |
| 11/05/2002 | US6475367 Electrodeposition method |
| 10/31/2002 | US20020160222 Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate |
| 10/31/2002 | US20020157960 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 10/30/2002 | EP1252374A1 Process for the extended use of electrolytes |
| 10/29/2002 | US6471845 Method of controlling chemical bath composition in a manufacturing environment |
| 10/24/2002 | WO2002084212A1 Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs |
| 10/24/2002 | WO2002083995A1 Method of and apparatus for controlling fluid flow |
| 10/24/2002 | US20020153254 Method and system for regenerating of plating baths |
| 10/24/2002 | US20020152955 Apparatus and method for depositing an electroless solution |
| 10/23/2002 | EP1250288A1 A method for treatment of hexavalent chromium compounds in waste water originating from processing of metals |
| 10/23/2002 | CN1093337C Process and circuitry for generating current pulses for electrolytic metal deposition |
| 10/23/2002 | CN1093180C One-step process of resin regeneration and chromium reduction for reclaiming chromium from electroplating waste water |
| 10/17/2002 | DE10118274A1 Process for measuring micro-galvanically produced components comprises forming a single or multiple layer component by galvanic metal deposition, inserting a photoresist region, removing and measuring the opening structure |
| 10/16/2002 | CN1092720C Anodizing apparatus, method and semiconductor substrate producing process |
| 10/10/2002 | US20020147519 Experimental management apparatus and experimental management program for electroplating |
| 10/10/2002 | US20020144894 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 10/09/2002 | EP1247881A1 Experimental management apparatus and experimental management program for electroplating |
| 10/09/2002 | EP1194616A4 Copper replenishment technique for precision copper plating system |
| 10/03/2002 | WO2002077328A1 Phosphate film processing method and phosphate film processing device |
| 10/03/2002 | US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member |
| 10/03/2002 | US20020139683 Using an insoluble anode and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions; uniform primary current distribution between the cathode and anode; no particles produced from black film |
| 10/03/2002 | US20020139678 Automatic process control, more particularly, controlling a material deposition process; electroplating; constructing a Jacobian sensitivity matrix of the effects on plated material thickness at each of a plurality of workpiece position |
| 10/03/2002 | US20020139663 Chemical treatment system |
| 10/02/2002 | EP1245038A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 10/02/2002 | CN1372019A Device and method for controlling electric power line distribution |
| 10/01/2002 | US6458262 Electroplating chemistry on-line monitoring and control system |
| 09/26/2002 | DE10111727A1 Vorrichtung und Verfahren zur Regenerierung chromsäurehaltiger Lösungen in elektrolytischen Verchromungsbädern Apparatus and method for regeneration of chromic acid solutions in electrolytic chromium plating baths |
| 09/25/2002 | EP1243673A1 Servicing of an electrolyte |
| 09/25/2002 | EP1243672A1 Plating device and plating method |
| 09/25/2002 | CN1371432A Copper replenishment technique for precision copper plating system |
| 09/24/2002 | US6454927 Electrodeposition |
| 09/19/2002 | WO2002072924A2 Device and method for regenerating solutions containing chromic acid in electrolytic chroming baths |
| 09/18/2002 | CN1369954A Electroplating current supply system |
| 09/17/2002 | US6451195 Imersing silicon wafers in electrolytic cells, applying direct current voltages, then stirring the solutions using a magnetic field; protective coatings having uniform thickness |
| 09/17/2002 | US6451194 Feeding a powdered electrolytic salt into a electrolytic bath, which is drawn by a vacuum created by a powder wetting device which supplies the salt directly into electrolytic solution which replenishes electrolyte consmed during plating |
| 09/12/2002 | WO2002070144A1 Internal heat spreader plating methods and devices |
| 09/12/2002 | US20020127829 Solution processing apparatus and solution processing method |
| 09/12/2002 | US20020125142 Includes a high performance liquid chromatography (HPLC) column configured to receive an electrolyte fluild supply, operates to separate various organic additive |
| 09/12/2002 | US20020125141 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 09/12/2002 | US20020125140 Apparatus and methods to control the uniformity of electroplated workpiece |
| 09/12/2002 | CA2433031A1 Internal heat spreader plating methods and devices |
| 09/11/2002 | EP1239061A2 Electroplating Installation |
| 09/10/2002 | US6447663 Programmable nanometer-scale electrolytic metal deposition and depletion |
| 09/06/2002 | WO2002045476A9 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 09/03/2002 | US6444481 Measuring a thickness of the process layer; and determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness. a processing line includes a plating tool, a metrology tool, |
| 09/03/2002 | US6444112 Manufacturing method of electrodeposited copper foil |
| 09/03/2002 | US6443167 Gradient dragout system in a continuous plating line |
| 08/29/2002 | WO2001096973A3 Pulse rectifiers in master/slave mode |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/28/2002 | EP1234896A1 Electrolytic phosphate chemical treatment method |
| 08/28/2002 | EP0837750B1 Wire bonding, severing, and ball forming |
| 08/27/2002 | US6440291 Applying voltage to silicon wafers or counterelectrodes prior to immersion in electrolytes, maintaining currents during a delay to prevent dissolution of copper layers, then increasing cell potential for electrodeposition; integrated circuits |
| 08/27/2002 | US6439758 Mixing apparatus |
| 08/22/2002 | US20020112967 Anodizing system with a coating thickness monitor and an anodized product |
| 08/22/2002 | US20020112952 Object plating method and system |
| 08/22/2002 | US20020112884 Circuit board and method of manufacturing the same |
| 08/21/2002 | EP1232828A1 Wire bonding, severing, and ball forming |
| 08/15/2002 | WO2002063072A1 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 08/15/2002 | WO2002063069A2 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 08/15/2002 | WO2002062446A1 Process for degassing an aqueous plating solution |
| 08/15/2002 | WO2002029875A3 Plating system with remote secondary anode for semiconductor manufacturing |
| 08/14/2002 | CN1089120C Plating method |
| 08/13/2002 | US6432282 Method and apparatus for supplying electricity uniformly to a workpiece |
| 08/08/2002 | US20020104761 Coated substrate and process for production thereof |
| 08/08/2002 | US20020104755 Electroplating current supply system |
| 08/07/2002 | EP1229154A1 Method and apparatus for electroplating |
| 08/07/2002 | EP1080252B1 Method for electro copperplating substrates |
| 08/07/2002 | CN2504283Y Edge cover auto tracking steel strip appts. for horizontal plating bath |
| 08/06/2002 | US6428673 Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
| 08/01/2002 | WO2002059398A2 Plating apparatus and method |
| 08/01/2002 | US20020102846 Plating apparatus and method of manufacturing semiconductor device |
| 07/31/2002 | EP1226426A1 Method and apparatus for determination of additives in metal plating baths |
| 07/31/2002 | EP1226290A1 Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process |
| 07/31/2002 | CN1361312A Object electroplating method and system |
| 07/30/2002 | CA2237710C Recovery of nickel from copper refinery tankhouse electrolyte |
| 07/25/2002 | WO2002057514A2 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
| 07/18/2002 | US20020092771 Electroplating methods including maintaining a determined electroplating voltage and related systems |
| 07/18/2002 | DE10100297A1 Vorrichtung und Verahren zur elektrochemischen Beschichtung Apparatus and Vera Hren for electrochemical coating |
| 07/17/2002 | EP0968325B1 Surface-treatment plants |
| 07/17/2002 | CN1087792C Cathode and anode reversible ion suppying method |
| 07/11/2002 | WO2002053809A1 Spouted bed apparatus for contacting objects with a fluid |
| 07/11/2002 | WO2002053806A2 Electrochemical coating device and method |
| 07/10/2002 | EP1221498A1 Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in the electrolysis apparatus |
| 07/09/2002 | US6416647 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |