Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
06/2007
06/02/2007CA2528759A1 Method and apparatus for plating automotive bumpers
05/2007
05/30/2007CN1970847A Plating barrel stop alarming system in plating production line
05/29/2007US7223328 A polycrystalline tin oxide film produced by electrolytic deposition of a tin film on a dielectric support in an electrochemical cell, followed by oxidation; fine grains with good adhesion; improved sensitivity
05/29/2007US7223323 Multi-chemistry plating system
05/24/2007WO2007058605A1 Master electrode and method of forming it
05/24/2007WO2007058603A1 Method of forming a multilayer structure
05/24/2007US20070114132 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes
05/24/2007DE102005055851A1 Cleaning device for cleaning electroplating tools used for producing vehicle parts comprises a robot arranged in a cleaning cabin for manipulating a high pressure jet arrangement
05/23/2007CN2903097Y Electroplating rinsing water on line recovering equipment
05/23/2007CN1317814C Control power supply device for electroplating
05/18/2007WO2007055223A1 Method for forming metal film and method for forming metal pattern
05/18/2007WO2005108970A3 Detection of an unstable additive breakdown product in a plating bath
05/16/2007EP1784527A1 Chromium plating method
05/16/2007CN1965227A Method of assessing the risk of whiskers appearing on the surface of a metallic deposit
05/16/2007CN1962956A System and method for electrolytic plating
05/16/2007CN1962239A Acrylic rubber and cast iron direct joint method
05/16/2007CN1316557C Method and system to provide electrical contacts for electrotreating processes
05/10/2007US20070102301 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
05/10/2007US20070102285 Apparatus for managing a plating liquid
05/09/2007CN1958873A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
05/09/2007CN1958872A Method for retrieving electroplating solution brought by workpieces and clamp
05/09/2007CN1958871A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
05/09/2007CN1958865A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
05/09/2007CN1314580C Process and equipment for recovering useful substance from solution containing chloride
05/03/2007DE19834245B4 Vorrichtung zum elektrolytischen Beschichten Apparatus for electrolytic coating
05/02/2007CN1957115A Method for electroplating bath chemistry control
05/02/2007CN1957113A External palladium plating structure of semiconductor component and semiconductor device manufacturing method
05/01/2007US7211186 Forming conductive layers on a semiconductor wafer surface without losing space on the surface by clamping; a relative motion, rotational and lateral, established between the contacts and the wafer surface; consistancy
04/2007
04/26/2007WO2007047215A2 Contact assembly cleaning in an electro-chemical mechanical processing apparatus
04/26/2007US20070089991 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
04/26/2007US20070089990 Adjustable dosing algorithm for control of a copper electroplating bath
04/25/2007EP1776489A1 Device and method for removing foreign matter from process solutions
04/25/2007CN1954099A Wireless electrolytic cell monitoring powered by ultra low bus voltage
04/25/2007CN1954098A Monitoring electrolytic cell currents
04/25/2007CN1952217A Process for applying waste and old zinc to continuous zinc coating of steel plate
04/25/2007CN1951673A Method for direct joint of ethylen-propylene rubber and cast iron
04/19/2007US20070084729 Contact assembly cleaning in an electrochemical mechanical processing apparatus
04/18/2007CN2890095Y Automatic classification treatment device for heavy metal in discharged electroplating solution
04/17/2007US7204916 Plating apparatus and plating method
04/12/2007US20070080057 Plating apparatus, plating cup and cathode ring
04/11/2007CN1310312C Semiconductor integrated circuit, method and apparatus for mfg. same
04/11/2007CN1309878C Continuous processing device for plate processing element and electric contact method
04/10/2007US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
04/10/2007US7200930 Probe for semiconductor devices
04/05/2007US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts
04/04/2007EP1552415A4 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
04/04/2007EP1540046A4 Method and apparatus for real time monitoring of industrial electrolytes
04/04/2007CN1308664C Electrode cartridge and a system for measuring internal stress of an electroplated film
03/2007
03/29/2007US20070068820 Electrolytic copper process using anion permeable barrier
03/29/2007US20070068818 Electroplating systems and methods
03/29/2007US20070068801 System for plating
03/28/2007EP1767674A1 Process for removing phosphates from acetate or lactate buffered solutions
03/28/2007EP1534880B1 Electrochemical coating device and method
03/27/2007US7196221 Reaction product of quaternary ammonium salt and metal compound; electrolyte, catalyst
03/27/2007US7195702 Tin alloy electroplating system
03/21/2007EP1644558A4 High purity electrolytic sulfonic acid solutions
03/21/2007CN1306072C Maintenance method of electrolyte
03/14/2007CN2878414Y Plating solution uniform dispersion apparatus for assembly electric plating production
03/14/2007CN1928160A Method for electrically plating Ti-Cu-Zn three alloys meeting three-prevention demand
03/13/2007US7189318 Automatic process control, more particularly, controlling a material deposition process; electroplating; constructing a Jacobian sensitivity matrix of the effects on plated material thickness at each of a plurality of workpiece position
03/13/2007US7189146 Method for reduction of defects in wet processed layers
03/08/2007WO2002029137A9 Method and associated apparatus for tilting a substrate upon entry for metal deposition
03/08/2007US20070051632 Polishing method, polishing apparatus, plating method, and plating apparatus
03/08/2007DE10322321B4 Anordnung und Verfahren zur Herstellung von Formteilen Arrangement and method for the production of moldings
03/07/2007CN1303261C Liquid tank
03/06/2007US7186326 No cell cleaning and rinsing between the analyses; reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated
03/01/2007WO2007024331A1 Close loop electrophoretic deposition of phosphors on semiconductor substrates
03/01/2007US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
03/01/2007DE10229005B4 Vorrichtung und Verfahren zur elektrochemischen Metallabscheidung Apparatus and method for electro-chemical metal deposition
02/2007
02/28/2007EP1407810B1 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus
02/28/2007CN1920105A Method and apparatus for fluid processing a workpiece
02/27/2007US7183787 Contact resistance device for improved process control
02/21/2007EP1753897A1 Method for electroplating bath chemistry control
02/21/2007CN2871562Y Continuous electrolytic purifier for assembled electroplating production
02/21/2007CN2871561Y Continuously-circulating filter for assembled electroplating production
02/15/2007US20070034516 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
02/14/2007CN1300385C Method for recycling of plating solutions
02/07/2007CN1299548C Method for metal coating of substrates
02/06/2007US7172684 Performing extrusion via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken; pattern of deposition may vary over the course of deposition by including relative motion
02/06/2007US7172683 Method of managing a plating liquid used in a plating apparatus
02/01/2007US20070023277 Plating apparatus, plating cup and cathode ring
01/2007
01/31/2007EP1747449A2 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
01/31/2007EP1747305A2 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
01/30/2007US7169283 Anodization device and anodization method
01/30/2007US7169269 Plating apparatus, plating cup and cathode ring
01/24/2007EP1490675A4 Reference electrode calibration for voltammetric plating bath analysis
01/24/2007CN2861189Y Electroplating control system for RMB forme
01/24/2007CN2861188Y Real-time control device of metal electrodeposition for preparation template of three-dimensional texture artificial plate
01/24/2007CN1296524C Container, reactor and method for electrochemically processing workpiece
01/23/2007US7166206 Generating a stream of bubbles containing a source of the material, and applying a potential difference across the cathode and anode so that the resulting glow discharge forms a plasma of ionised gaseous molecules within the bubbles
01/23/2007US7166204 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
01/17/2007EP1743159A1 Method of assessing the risk of whiskers appearing on the surface of a metallic deposit
01/17/2007CN2858675Y Enhanced oil and water separating system for electroplating pretreatment
01/17/2007CN2858674Y Oil and water separating system for electroplating pretreatment
01/16/2007US7163614 Methods of and apparatus for making high aspect ratio microelectromechanical structures
01/11/2007US20070010034 Deposition stop time detection apparatus and methods for fabricating copper using the same
01/10/2007EP1741806A1 Apparatus and process for electroplating treatment of foils from roller to roller
01/10/2007CN1894442A Method and apparatus for fluid processing a workpiece
01/09/2007US7161689 Apparatus and method for processing a microelectronic workpiece using metrology
01/09/2007US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion
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