Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
08/2005
08/10/2005EP1562412A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
08/10/2005EP1561844A2 Electrode cartridge and a system for measuring internal stress of an electroplated film
08/10/2005CN1651884A Electrode cartridge and a system for measuring internal stress of an electroplated film
08/10/2005CN1214133C Method and apparatus for electrochemical mechanical deposition
08/04/2005WO2002004715A3 Deposition uniformity control for electroplating apparatus, and associated method
08/04/2005US20050167275 Method and apparatus for fluid processing a workpiece
08/04/2005US20050167274 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167273 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167266 ECMP system
08/04/2005US20050167265 System for electrochemically processing a workpiece
08/03/2005EP1558794A1 Measurement of the concentration of a reducing agent in an electroless plating bath
08/02/2005US6923898 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet
07/2005
07/28/2005US20050160977 Method and apparatus for fluid processing a workpiece
07/28/2005DE19621242B4 Verfahren und Einrichtung zur Rückgewinnung von durch Tauchtrommeln ausgeschleppten Behandlungslösungen Method and apparatus for recovering the dragged by immersion drums treatment solutions
07/27/2005CN1646904A Reference electrode calibration for voltammetric plating bath analysis
07/26/2005US6921551 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits
07/26/2005US6921472 Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process
07/21/2005WO2005065436A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
07/21/2005WO2005065430A2 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
07/21/2005WO2005065208A2 Apparatus and method for treating used electroless plating solutions
07/21/2005WO2004101866A3 Method and devices for increasing the service life of a process solution for chemical-reductive metal coating
07/21/2005WO2004078411A3 Method and apparatus for local polishing control
07/21/2005US20050155865 Electrolytic processing apparatus and method
07/21/2005US20050155864 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
07/21/2005US20050155514 Additive for plating bath
07/20/2005EP1555335A2 Additive for plating bath
07/20/2005CN1643186A Conveyorized plating line and method for electrolytically metal plating a workpiece
07/20/2005CN1642863A Advanced electrodeionization for fluid recycling
07/20/2005CN1640557A Preparation of aluminium alloy part with precoating
07/14/2005WO2004081261B1 Plating apparatus
07/13/2005EP1552415A2 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
07/13/2005CN1637171A Plating apparatus and method
07/13/2005CN1637168A Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method
07/12/2005US6916412 Divided housing
07/07/2005US20050148197 Substrate proximity processing structures and methods for using and making the same
07/07/2005US20050145500 Plating apparatus, plating method, and manufacturing method of semiconductor device
07/07/2005US20050145498 Apparatus and method for treating used electroless plating solutions
07/07/2005US20050145482 Apparatus and method for processing substrate
07/06/2005CN1636266A Method and system to provide electrical contacts for electrotreating processes
07/06/2005CN1636086A Method for storage of a metal ion supply source in a plating equipment
07/06/2005CN1209493C Plasma electroplating
07/05/2005US6913686 Titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis. faster and more accurate determination of component concentrations in solder plating solutions.
07/05/2005US6913680 Applying a voltage between anode and plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface.
07/05/2005US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
06/2005
06/30/2005US20050142846 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
06/30/2005US20050139477 Method for storage of a metal ion supply source in a plating equipment
06/30/2005US20050139476 Anodizing system with a coating thickness monitor and an anodized product
06/30/2005US20050139159 Anodizing system with a coating thickness monitor and an anodized product
06/30/2005DE10355802A1 Reactor for electrochemical machining or coating of a workpiece involving production of a voltage between the workpiece and electrode generally useful electrochemical machining or coating of metal workpieces
06/29/2005CN1633525A Conveyorized horizontal processing line and method of wet-processing a workpiece
06/29/2005CN1632914A Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers
06/28/2005US6911137 Strip forms cathode and is moved in its longitudinal direction relative to anode, an electrolyte flowing between strip and anode, flow of electrolyte influenced by holding body between strip and anode
06/28/2005US6911136 Method for regulating the electrical power applied to a substrate during an immersion process
06/28/2005US6910926 Electronic connector terminal
06/23/2005US20050133374 Method and apparatus for acid and additive breakdown removal from copper electrodeposition bath
06/22/2005EP1481114A4 Apparatus and methods for electrochemical processing of microelectronic workpieces
06/22/2005CN1630739A Apparatus and method for electroplating a wafer surface
06/21/2005US6908515 Treatment of circuit support with impulse excitation
06/16/2005WO2001090434A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
06/16/2005US20050126919 Plating method, plating apparatus and a method of forming fine circuit wiring
06/15/2005EP1541720A2 An electroplating machine
06/15/2005EP1541719A2 An electroplating machine
06/15/2005EP1540046A1 Method and apparatus for real time monitoring of industrial electrolytes
06/15/2005EP1483212A4 Advanced electrodeionization for fluid recycling
06/14/2005US6905608 Advanced electrodeionization for fluid recycling
06/14/2005CA2258088C Control agent for reducing metal acid mist emissions from electrolytic cell operations
06/09/2005WO2005052220A1 Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
06/09/2005US20050121314 Electrolytic plating method and device for a wiring board
06/09/2005DE20320939U1 Process for cleaning a process bath comprises evaporating a part of the process bath used in the process until phase separation into a lower phase, a middle phase and an upper phase occurs, and removing the upper and lower phases
06/09/2005DE10355077A1 Verfahren zum abwasserarmen Betrieb eines alkalischen Zink-Nickel-Bades A method for operating a low-effluent alkaline zinc-nickel bath
06/09/2005DE10352708A1 Galvanizing device comprises a process bath container, electrodes arranged in the container, a unit for continuously filtering the bath, and a circulating unit for producing circulating currents between the electrodes
06/08/2005CN1625611A Method and apparatus for controlling deposition on predetermined portions of a workpiece
06/08/2005CN1624208A Electroplate device, electroplate method and method for manufacturing semiconductor device
06/02/2005DE10345379B3 Vorratstank für Prozessflüssigkeiten mit einer reduzierten Menge an Blasen und Verfahren zum Betreiben desselben Of the same storage tank for process liquids with a reduced amount of bubbles and method for operating
06/01/2005EP1534880A2 Electrochemical coating device and method
06/01/2005EP1264010B1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof
06/01/2005CN1623012A Method and associated apparatus for tilting a substrate upon entry for metal deposition
06/01/2005CN1204300C Circuitry and method for electroplating plant or etching plant pulse power supply
05/2005
05/31/2005US6899803 Electrochemically reversible redox system in which excess quantities of the oxidized substances are reduced at the auxiliary cathode, reducing formation of ions of the metal to be deposited
05/31/2005US6899802 Method for recycling of plating solutions
05/26/2005WO2004081261A3 Plating apparatus
05/26/2005US20050110512 Contact resistance device for improved process control
05/26/2005US20050109636 Generation. conditioning , reuse of metal containing electrolytes; surface treatment; ion exchanging
05/26/2005US20050109633 System for electrochemically processing a workpiece
05/26/2005US20050109629 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109628 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109625 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109624 On-wafer electrochemical deposition plating metrology process and apparatus
05/25/2005EP1533399A2 Method for obtaining a waste-water-low alkali zinc-nickel bath
05/25/2005EP1533398A1 Process for producing an electrolyte ready for use out of waste products containing metal ions
05/25/2005CN1619021A Large capacity titanium alloy pulse micro arc anode oxidation dynamic control power source
05/25/2005CN1619013A Detin liquid and its preparation technology and use
05/24/2005US6896784 Method for controlling local current to achieve uniform plating thickness
05/19/2005US20050106474 Method for controlling linewidth in advanced lithography masks using electrochemistry
05/18/2005EP1357989A4 Process for degassing an aqueous plating solution
05/18/2005CN2700345Y Radiating type electrode electrolytic cell
05/18/2005CN1617953A Combination liquid dispenser and electrochemical cell
05/18/2005CN1202612C Electroplating power supply unit
05/17/2005US6893548 Method of conditioning electrochemical baths in plating technology
05/12/2005WO2005042804A2 Method and apparatus for fluid processing a workpiece
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