| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
|---|
| 01/20/2000 | WO2000003073A2 Paced chemical replenishment system |
| 01/20/2000 | WO1999034035A3 Method for microplasma oxidation of valve metals and their alloys, and device therefor |
| 01/20/2000 | DE19835945C1 Installation for chemical and/or electrolytic coating of aluminum surfaces |
| 01/18/2000 | US6015462 Semiconductor processing workpiece position sensing |
| 01/13/2000 | WO2000001863A2 Method for recovering precious metals |
| 01/13/2000 | WO1999060188A3 Method for electro copperplating substrates |
| 01/12/2000 | EP0786021B1 Process for making copper foil |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/05/2000 | EP0969125A1 Process for bringing zinc into solution in a ZnNi-electrolyte |
| 01/05/2000 | EP0968325A2 A surface-treatment plant |
| 01/05/2000 | EP0871802B1 Method of removing acid formed during cathodic electrodip coating |
| 01/05/2000 | DE19829274A1 Verfahren zur Rückgewinnung von Edelmetallen A process for the recovery of precious metals |
| 01/05/2000 | CN1240241A Method and equipment for preparing and supplying electrolyte in electro-chemical processing device |
| 12/29/1999 | EP0966557A1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 12/29/1999 | CN1047809C Apparatus for solving zinc by using of electrolyte of acid containing liquid |
| 12/23/1999 | DE19923944A1 Process for placing and/or replenishing an electrolyte in an electrochemical treatment apparatus |
| 12/21/1999 | US6004447 Forming a layer of metal on interiors of axles |
| 12/21/1999 | US6004440 Cathode current control system for a wafer electroplating apparatus |
| 12/15/1999 | EP0963463A2 Method and device for making layer electrodes |
| 12/08/1999 | CN1237653A Non-dissolution anodic uniformly-coating method and its equipment |
| 12/07/1999 | US5998228 Method of testing semiconductor |
| 12/07/1999 | US5997712 Copper replenishment technique for precision copper plating system |
| 12/07/1999 | US5997711 Control agent for reducing metal acid mist emissions from electrolytic cell operations |
| 12/01/1999 | CN1237215A Circuitry and method for electroplating plant or etching plant pulse power supply |
| 11/25/1999 | WO1999060189A2 Method for metal coating of substrates |
| 11/25/1999 | WO1999060188A2 Method for electro copperplating substrates |
| 11/25/1999 | WO1999060179A1 Recovery of nickel from copper refinery tankhouse electrolyte |
| 11/25/1999 | CA2331757A1 Process for coating substrates with metals |
| 11/25/1999 | CA2331750A1 Method for electro copperplating substrates |
| 11/24/1999 | EP0959153A2 An electroplating machine |
| 11/24/1999 | EP0958411A1 Control agent for reducing metal acid mist emissions from electrolytic cell operations |
| 11/24/1999 | CN1236026A Electroplating machine |
| 11/18/1999 | DE19822075A1 Metallization of polymeric substrates for production of circuit boards |
| 11/16/1999 | US5983493 Method of temporarily, then permanently, connecting to a semiconductor device |
| 11/11/1999 | WO1999057340A2 Chemical mixing, replenishment, and waste management system |
| 11/11/1999 | DE19820770A1 Electrochemical coating of a substrate or an article, and an article with such a coating |
| 11/02/1999 | US5976341 Process and apparatus for electrolytic deposition of metal layers |
| 11/02/1999 | US5974662 Method of planarizing tips of probe elements of a probe card assembly |
| 10/28/1999 | WO1999054920A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 10/27/1999 | EP0868545B1 Process and circuitry for generating current pulses for electrolytic metal deposition |
| 10/21/1999 | DE19816708A1 Method for reconditioning of inorganic acids contaminated with metals |
| 10/20/1999 | EP0950728A2 Method and apparatus for anodizing objects |
| 10/20/1999 | EP0950130A1 Apparatus and method for electroforming |
| 10/14/1999 | WO1999041434A3 Plating apparatus and method |
| 10/13/1999 | CN2343173Y Recovering regenerator for electroplating liquid |
| 10/12/1999 | US5965820 Vibrational processing apparatus and method |
| 10/06/1999 | EP0946794A1 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductor foils in continuous systems |
| 09/30/1999 | WO1999040238A3 Method for electrically regenerating contaminated rhodium solutions |
| 09/30/1999 | DE19812005A1 Pulsed stream is used in the electrodialytic regeneration of process solutions in galvanic and other deposition processes |
| 09/29/1999 | CN1229859A Treatment process for dust |
| 09/22/1999 | EP0715660B1 Electrolytic treatment of material |
| 09/16/1999 | DE19810859A1 Treating galvanic bath |
| 09/01/1999 | CN1227284A Anodizing apparatus and method and porous substrate |
| 08/31/1999 | US5944918 Aircraft; applying phenolic resin, curing |
| 08/19/1999 | WO1999041434A2 Plating apparatus and method |
| 08/19/1999 | WO1999010563A3 Method and device for energy saving simultaneous electrolytic treatment of several workpieces |
| 08/18/1999 | CN2333717Y Movable bath filtering machine |
| 08/18/1999 | CN1226290A Control agent for reducing metal acid mist from electrolytic cell operation |
| 08/17/1999 | US5938913 Process and device for electrolytic treatment of continuous running material |
| 08/12/1999 | WO1999040238A2 Method for electrically regenerating contaminated rhodium solutions |
| 08/05/1999 | WO1999010564A3 Method and device for regulating the concentration of substances in electrolytes |
| 08/04/1999 | CN1044448C Medium temperature CO conversion catalyst and its producing process |
| 08/03/1999 | US5932081 Method and device for galvanizing plate-shaped products in horizontal continuous plants |
| 07/21/1999 | EP0930380A1 Electrolytic cell with removable electrode and its operating method |
| 07/13/1999 | US5922472 Method for preparing pre-coated aluminum alloy articles and articles prepared thereby |
| 07/08/1999 | WO1999034035A2 Method for microplasma oxidation of valve metals and their alloys, and device therefor |
| 07/01/1999 | DE19805589C1 Cleaning unit for rotating current roll of electrolytic strip coating installation |
| 06/30/1999 | EP0926269A2 Anodizing apparatus and method and porous substrate |
| 06/24/1999 | WO1999031304A1 Plating device and method of confirming current feed |
| 06/24/1999 | DE19804534C1 Impure rhodium solution is regenerated by anodic oxidation in a cell with a cation exchange membrane |
| 06/17/1999 | WO1999029933A1 Method of reducing defects caused by conductor roll surface anomalies using high volume bottom sprays |
| 06/16/1999 | EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 06/09/1999 | EP0746640B1 Method of electrolytically depositing metals from electrolytes containing organic additives |
| 06/02/1999 | CN2321789Y Chromium fog suppressor used in electric platting |
| 05/27/1999 | WO1999014401A9 Cathode current control system for a wafer electroplating apparatus |
| 05/27/1999 | WO1999010562A3 Maintenance method for continuous electroplating plants |
| 05/26/1999 | EP0838134B1 Procedure and device for the chemical and electrolytic treatment of printed circuit boards and films |
| 05/25/1999 | US5906725 Method for preparing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from zinc-containing waste articles having a nickel/copper electroplating layer |
| 05/12/1999 | EP0915190A2 Process and apparatus for supplying metal ions to alloy electroplating bath |
| 05/12/1999 | EP0915182A1 Plating method |
| 04/28/1999 | CN1215096A Plating method |
| 04/27/1999 | US5897756 Device for chemical or electroyltic surface treatment of plate-like objects |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/22/1999 | WO1999019544A1 Copper metallization of silicon wafers using insoluble anodes |
| 04/22/1999 | CA2305456A1 Copper metallization of silicon wafers using insoluble anodes |
| 04/08/1999 | WO1999017344A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components |
| 04/08/1999 | WO1999016936A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/07/1999 | CN1213019A Electroplating of low-stress nickel |
| 04/06/1999 | US5891343 Method for removing ferrous ions from acidic tinning electrolytes and tinning electrolyte recovery plant for iron using the same |
| 03/31/1999 | EP0904428A1 An electrolytic process for cleaning electrically conducting surfaces |
| 03/30/1999 | US5888373 Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof |
| 03/25/1999 | WO1999014401A1 Cathode current control system for a wafer electroplating apparatus |
| 03/23/1999 | US5885462 Process for reducing the concentration of multivalent cations in aqueous solutions |
| 03/23/1999 | US5885434 Measuring and storing surface topography of the workpiece during a first scan with a fine tip probe, then using the stored information to control probe position during a second scan in which an electrochemical reaction is performed |
| 03/23/1999 | US5884398 Mounting spring elements on semiconductor devices |
| 03/04/1999 | WO1999010564A2 Method and device for regulating the concentration of substances in electrolytes |
| 03/04/1999 | WO1999010563A2 Method and device for energy saving simultaneous electrolytic treatment of several workpieces |
| 03/04/1999 | WO1999010562A2 Maintenance method for continuous electroplating plants |
| 03/04/1999 | CA2301299A1 Method and device for regulating the concentration of substances in electrolytes |
| 03/03/1999 | EP0801883B1 Method and device for the treatment of plate-shaped workpieces having small holes |