Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 21 - Processes for servicing or operating cells for electrolytic coating
Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
01/2004
01/01/2004US20040000489 Electrochemistry; forming three-dimensional multilayer structures; measurement voltage profile
01/01/2004US20040000485 Apparatus and method for electrochemical metal deposition
01/01/2004US20040000484 Determination concentration of adjuvant; measuring electrochemistry response
12/2003
12/31/2003WO2004001100A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/24/2003WO2002070144A8 Internal heat spreader plating methods and devices
12/23/2003US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics
12/23/2003US6666960 Electroplating current supply system
12/18/2003WO2003041209A3 Device and method for the temporally and spatially dependent measuring of an operating parameter of an electrochemical cell
12/18/2003WO2003027011B1 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
12/11/2003WO2000079029A3 Method and apparatus for electro-deposition of metal
12/10/2003EP1369505A2 Method and apparatus for recirculating of rinsing water and cleaning of a process bath
12/09/2003US6660139 Plating apparatus and method
12/09/2003US6660137 System for electrochemically processing a workpiece
12/04/2003US20030222667 Probe card assembly
12/04/2003US20030221953 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
12/03/2003EP1366806A2 A mixing apparatus
12/03/2003EP0828863B1 Preparation of pre-coated aluminum alloy articles
12/03/2003CN1460132A Method and apparatus for electro-deposition of metal
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
12/02/2003CA2085125C Improvement to current generation and control systems for electrolytic processes
11/2003
11/27/2003US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/25/2003US6652725 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus
11/25/2003US6652657 Method for electrochemically treating articles and apparatus and method for cleaning articles
11/20/2003WO2003096401A1 Method for electrochemical oxidation
11/20/2003WO2003095715A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plasting operations
11/20/2003WO2002072924A3 Device and method for regenerating solutions containing chromic acid in electrolytic chroming baths
11/19/2003EP1226290B1 Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process
11/19/2003EP1099010B1 Method for recovering precious metals
11/19/2003CN1456713A Cyclic reuse of waste water from chrome plating, nickling, cyanide electroplating and acid coppering
11/18/2003US6649037 Removing weakly ionizable species from water by dissociating pH at differenct levels to facilitate removal from the fluid in an electrodeionization device
11/18/2003US6649034 Electro-chemical metal alloying for semiconductor manufacturing
11/18/2003US6648938 Device for cleaning fluid in the form of vapor from a circuit
11/13/2003WO2003093524A2 Apparatus and method for regulating the electrical power applied to a substrate during immersion
11/13/2003WO2003036693A3 Method and system to provide electrical contacts for electrotreating processes
11/13/2003US20030209449 Flushing after electrodeposition; aeration with carbon dioxide; precipitation as carbonate
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209440 Pretreatment cleaning; applying voltage cycles; measuring concentration of adjuvant in plating solution
11/13/2003US20030209429 Method and apparatus for processing a substrate with minimal edge exclusion
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/13/2003DE10019713C2 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems
11/12/2003EP1360348A1 Method and apparatus for controlling thickness uniformity of electroplated layer
11/11/2003US6645364 Electroplating bath control
11/06/2003US20030205478 Object plating method and system
11/06/2003US20030205476 Electroplating bath control
11/05/2003EP1357989A1 Process for degassing an aqueous plating solution
11/05/2003CN1454265A Fountain bed with fluid contacting with substance
11/04/2003US6641710 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density
11/04/2003US6641709 Comprises gas discharge which connects the space in plating chamber with spout to improve gas removal; semiconductors
10/2003
10/30/2003WO2003029779A3 Improved method for analysis of three organic additives in an acid copper plating bath
10/30/2003US20030201184 Electroplating of a metal; seed layer immersion in an electrolyte; controlled trapping of air bubbles by positioning substrate
10/30/2003US20030201166 method for regulating the electrical power applied to a substrate during an immersion process
10/29/2003CN1451788A Cathode chuck of electroplating tester
10/28/2003US6638409 Stable plating performance in copper electrochemical plating
10/23/2003US20030196904 System and method for electrolytic plating
10/23/2003DE29924530U1 Alkaline zinc-nickel galvanic bath for producing zinc-nickel coatings has an ion exchange membrane separating the anode from the alkaline electrolyte
10/22/2003EP1354078A1 Spouted bed apparatus for contacting objects with a fluid
10/22/2003EP1354073A2 Method for the treatment of work pieces with a palladium colloid solution
10/16/2003WO2003085173A2 Reference electrode calibration for voltammetric plating bath analysis
10/16/2003WO2003027011A3 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
10/16/2003US20030192782 Cathode cartridge for electroplating tester
10/14/2003US6632346 Trapping the particles of zinc oxide precipitated in the bath by circulating or stirring before the formation of the zinc oxide film
10/09/2003WO2003083185A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/09/2003WO2003038159A3 Method and conveyorized system for electrolytically processing work pieces
10/09/2003US20030188977 Voltammetric reference electrode calibration
10/09/2003CA2469880A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/08/2003EP1351035A2 Paint film thickness predicting method and system for actual car with recording medium
10/07/2003US6630060 Device for carrying out an electro-chemical treatment
10/02/2003US20030183513 Plating system and method for management of plating solution using plating system
10/01/2003EP1348041A1 Plasma electroplating
09/2003
09/30/2003US6627066 Copper sulfate and sulfuric acid, a polymer liquid
09/30/2003US6627051 Cathode current control system for a wafer electroplating apparatus
09/25/2003US20030182006 Paint film thickness predicting method and system for actual car, and recording medium
09/24/2003CN1122119C Method and appts. for metal layer by electrolytic deposition
09/23/2003US6624648 Probe card assembly
09/18/2003WO2003076905A1 A method and apparatus for automated analysis and characterization of chemical constituents of process solutions
09/18/2003WO2003076694A2 Methods and apparatuses for analyzing solder plating solutions
09/18/2003WO2003033770A3 System and method for electrolytic plating
09/17/2003EP1344850A1 Alkaline zinc-nickel bath
09/17/2003EP1344849A1 ELECTROLYTIC COPPER PLATING METHOD, ELECTROLYTIC COPPER PLATING−USE PHOSPHORUS−CONTAINING COPPER ANODE AND SEMICONDUCTOR WAFER WITH LITTLE PARTICLES DEPOSITION PLATED BY USING THEM
09/16/2003US6619538 Nickel plating process having controlled hydrogen concentration
09/12/2003WO2003074768A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
09/11/2003US20030168345 In-situ monitor seed for copper plating
09/10/2003CN2571772Y Copper dissolving tank for production of electrolytic copper foil
09/09/2003US6616828 Low current density; loop circulating oxidation system
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/04/2003WO2002096807A3 Electrodeionization apparatus and method
09/04/2003US20030164291 Recovery system for platinum plating bath
09/02/2003CA2156407C Process and arrangement for the electrolytic deposition of metal layers
08/2003
08/28/2003WO2003071010A1 Method for storage of a metal ion supply source in a plating equipment
08/28/2003WO2003071008A2 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003071007A1 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2001088211A3 Method for the treatment of work pieces with a palladium colloid solution
08/28/2003US20030159937 Replacement of organic compound in electroplating baths
08/28/2003US20030159936 Method and apparatus for reducing organic depletion during non-processing time periods
08/28/2003CA2473054A1 Method for storage of a metal ion supply source in a plating equipment
08/26/2003US6610190 Anode, a shaping plate, a liquid electrolyte, and electrical contact members
08/26/2003US6610189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration
08/21/2003US20030155250 Method for the treatment of work pieces with a palladium colloid solution
08/19/2003US6607651 Flushing solution
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