Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
08/2000
08/29/2000US6110349 Method for recovering metallic tin from electroplating sludge
08/29/2000US6110345 Computer controlled process regulation and quality control for the metallization of integrated circuit semiconductor devices
08/29/2000CA2195737C Method and apparatus for thermal process control in the electroforming of stampers for production of cd/ld data carriers
08/24/2000WO2000049206A1 Continuous band plating device
08/23/2000EP1029954A1 Substrate plating device
08/23/2000EP1029342A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
08/22/2000US6106688 Method for manufacturing a suspension element for a magnetic head
08/16/2000EP1027481A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
08/15/2000US6103086 Method of forming reliable copper interconnects with improved hole filling
08/09/2000EP1025283A1 Cathode current control system for a wafer electroplating apparatus
08/08/2000US6099739 Cleaning apparatus for a magnetic filter and cleaning method thereof
08/08/2000US6099702 Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
08/02/2000CN1261632A Selective electrolytic metal chemical/electro plating device and method by using fluid head
08/01/2000US6096183 Method of reducing defects caused by conductor roll surface anomalies using high volume bottom sprays
07/2000
07/18/2000US6090711 Methods for controlling semiconductor workpiece surface exposure to processing liquids
07/18/2000US6090262 Plating a mixture of small pieces e.g., nuts, bolts, in a barrel to a optimal and consistant coating film thickness by labelling with a value automatically calculated by to obtain current value from a power source
07/18/2000US6090261 Method and apparatus for controlling plating over a face of a substrate
07/18/2000US6090260 While the object to be plated is being dipped in a plating bath and no electroplating is carried out, additional current is supplied so that the object always has cathode potential in the plating bath and no corrosion can occur; batches
07/13/2000DE19900715A1 Electrochemical treatment of aluminum-containing solution, e.g. spent aluminum surface treatment or rinsing solution, comprises electrolysis and electrodialysis in a divided cell containing a precious metal, oxide and/or mixed oxide anode
07/12/2000EP1018568A1 Plating device
07/12/2000CN1259592A Method of recovering metal plating waste water to make water treatment agent
07/06/2000DE19958741A1 Component transport method for circuit boards etc. in electroplating systems uses vibrators positioned on carrier bars near goods frame suspension
07/05/2000EP1015671A2 Method and device for energy saving simultaneous electrolytic treatment of several workpieces
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
07/05/2000EP1015667A2 Method and device for regulating the concentration of substances in electrolytes
07/04/2000US6083374 Process for maintaining a constant concentration of substances in an electroplating bath
06/2000
06/22/2000WO2000036737A2 Power supply and method for producing non-periodic complex waveforms
06/20/2000US6077359 With high precision and velocity by means of a treatment liquid
06/15/2000WO2000001863A3 Method for recovering precious metals
06/08/2000WO2000033356A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/08/2000WO2000032850A1 Plating machine
06/08/2000WO2000032849A1 Equipment for inline plating
06/08/2000CA2352942A1 Equipment for inline plating
06/08/2000CA2352160A1 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/07/2000EP1006213A2 Process for regenerating a processing solution
06/06/2000US6071399 Provision of a second contact surface positioned above the liquid level and electrically isolated from the first contact surface for making contact with the removable electrode when positioned in the housing
06/06/2000US6071387 Automatic plating method and apparatus thereof
06/06/2000US6071384 Arrangement for the electrogalvanic metal coating of strips
06/06/2000CA2155209C Process for making copper foil
05/2000
05/18/2000WO2000028115A1 Plating method and apparatus
05/18/2000DE19817092A1 Removal of undesirable metal ions in ion exchanger regeneration streams with separate ion exchangers.
05/17/2000CN1253598A Method and device for making layer electrodes
05/16/2000US6063252 Method and apparatus for enriching the chromium in a chromium plating bath
05/11/2000WO2000026445A2 Enhanced membrane electrode devices useful for electrodeposition coating
05/11/2000WO2000026443A2 Method and apparatus for electrochemical mechanical deposition
05/11/2000CA2349368A1 Enhanced membrane electrode devices useful for electrodeposition coating
05/10/2000EP0999296A2 Apparatus for removing a coating from objects
05/10/2000EP0999295A2 Arrangement for the electrogalvanic metal coating of strips
05/10/2000CN1252458A Device for electroplating metal film of strip
05/09/2000CA2052933C Process and apparatus for electrowinning of heavy metals from waste baths
05/04/2000WO2000006807A3 Alkali zinc nickel bath
05/04/2000WO2000003074A8 Plating device
05/04/2000DE19850235A1 Base metals are recovered from acidic process solutions, especially electroplating, pickling or waste solutions, by dosing into a circulating catholyte of a divided electrolysis cell
05/03/2000EP0997558A2 Process for operating a plant for the chemical or electrochemical treatment of aluminium surfaces and apparatus for the chemical or electrochemical treatment of aluminium surfaces
05/03/2000CN1052039C Recovery of tin plating liquid
05/02/2000US6056862 Process and apparatus for supplying metal ions to alloy electroplating bath
04/2000
04/27/2000WO2000023639A1 Installation for the collection of liquid residues applicable to the treatment of parts by electrolytic bath
04/27/2000DE19829768C1 Verfahren zum Lösen von Zink in einem ZnNi-Elektrolyten A method for dissolving zinc in a ZnNi electrolyte
04/25/2000US6054027 Edge brush for electrodes
04/20/2000DE19851180C1 Chemical reduction metal plating solution is regenerated using a weakly basic anion exchanger for hypophosphite ion recycle to the cathodic chamber of an electrodialysis cell
04/13/2000WO2000020662A1 Submicron metallization using electrochemical deposition
04/13/2000WO2000019936A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part
04/13/2000CA2345636A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part
04/12/2000EP0992062A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
04/12/2000CN1250489A A surface-treatment plant
04/11/2000CA2054201C Protection of lead-containing anodes during chromium electroplating
04/06/2000WO1999060189A3 Method for metal coating of substrates
04/06/2000WO1999054920A3 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
04/06/2000DE19845506A1 Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil Process for the preparation of prosthetic moldings for the dental field and Prosthetic molding
04/05/2000EP0990423A1 Method of manufacturing prosthetic elements for the dental field and prosthetic element
03/2000
03/29/2000EP0873435B1 Process for maintaining a constant concentration of substances in an electroplating bath
03/28/2000US6042712 Apparatus for controlling plating over a face of a substrate
03/22/2000CN1247910A Chrome mist checking body and chrome mist checking method for electroplating bath
03/16/2000WO2000014308A1 Substrate plating device
03/15/2000CN1247239A High speed electroplating method and appts. thereof
03/09/2000DE19937553A1 High speed coating of components involves delivery of a predetermined amount of electric current into a coating cell via a programmable rectifier reserved exclusively for this cell
03/09/2000DE19840471A1 Apparatus for removal of coating from an article comprises devices which monitor voltage and/or current or potential variation, and are electrically connected to the control system of the apparatus
03/07/2000US6032356 Wafer-level test and burn-in, and semiconductor process
02/2000
02/29/2000US6029344 Composite interconnection element for microelectronic components, and method of making same
02/23/2000EP0980918A1 Product conveyance mechanism of electroplating apparatus
02/22/2000US6027630 Method for electrochemical fabrication
02/16/2000CN2364058Y Automatic electroplate cleaning swinging device
02/15/2000US6024856 Copper metallization of silicon wafers using insoluble anodes
02/10/2000WO2000006810A1 Installation and method for multilayered immersion coating
02/10/2000WO2000006809A1 Method and apparatus for galvanizing a surface
02/10/2000WO2000006807A2 Alkali zinc nickel bath
02/10/2000CA2339144A1 Alkali zinc nickel bath
02/10/2000CA2338971A1 Installation and process for multiple coating by dipping
02/09/2000EP0828863A4 Preparation of pre-coated aluminum alloy articles
02/09/2000CN1243890A Process for extracting golf from waste gold-plating liquid
02/03/2000WO2000005438A1 Electrochemical conversion of transition metal cations to anions at a higher oxidation state
02/03/2000WO1999057340A3 Chemical mixing, replenishment, and waste management system
02/03/2000DE19834353A1 Alkalisches Zink-Nickelbad Alkaline zinc-nickel bath
02/03/2000DE19834245A1 Anlage und Verfahren zum Mehrfachbeschichten durch Tauchen System and method for multi-Dip Coating
02/03/2000CA2338400A1 Electrochemical conversion of transition metal cations to anions at a higher oxidation state
02/01/2000US6019886 Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process
01/2000
01/26/2000CN2360425Y Electroplating liquid temp. regulating device
01/25/2000US6017427 Apparatus for testing high speed electroplating
01/25/2000US6016817 Method and device for the treatment of plate-shaped workpieces having small holes
01/20/2000WO2000003074A1 Plating device
1 ... 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 ... 58