| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 04/25/2006 | US7033468 Elastic contact element |
| 04/20/2006 | US20060084196 Method for regeneration of an electrolysis bath for the production of a compound I-III-VI sb in thin layers |
| 04/19/2006 | CN1252322C Device and method for electrolytic metallization of workpiece |
| 04/12/2006 | EP1644558A1 High purity electrolytic sulfonic acid solutions |
| 04/12/2006 | EP1644557A1 Electrochemical processing cell |
| 04/12/2006 | CN1251319C Microelectronic component insert making method |
| 04/06/2006 | WO2005065436A3 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 04/06/2006 | DE19925373B4 Verfahren und Vorrichtung zum Galvanisieren Method and apparatus for electroplating |
| 04/04/2006 | US7022215 System and methods for analyzing copper chemistry |
| 04/04/2006 | US7022212 Micro structured electrode and method for monitoring wafer electroplating baths |
| 03/30/2006 | US20060065533 Grinding after applying the copper sulfate plating to the roll to attain a mirror surface finish state; copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to rotating roll and approached to to the lower surface of roll |
| 03/30/2006 | DE102004056158B3 Verfahren zum Überwachen eines elektrochemischen Behandlungsprozesses und für dieses Verfahren geeignete Elektrodenanordnung Method for monitoring an electrochemical treatment process and suitable for this process electrode arrangement |
| 03/29/2006 | EP1640480A1 Method for the recovery of gold and/or silver from a cyanide complexes solution of gold and/or silver |
| 03/29/2006 | EP1438446A4 System and method for electrolytic plating |
| 03/29/2006 | CN1247826C Electrolytic phosphate chemical treatment method |
| 03/29/2006 | CN1247825C Forming method of anode oxidation film on zipper tooth row and its forming equipment |
| 03/29/2006 | CN1247468C ELectrodeionization appts. and method |
| 03/28/2006 | US7020537 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/22/2006 | CN1749442A Improved plating method |
| 03/21/2006 | US7014679 Removing oxygen from a copper plating solution using hollow hydrophobic fiber membranes; intrusion of solution into membrane pores is avoided |
| 03/15/2006 | CN2765123Y Far infrared plated workpiece drying tunnel |
| 03/14/2006 | US7012333 Lead free bump and method of forming the same |
| 03/14/2006 | CA2241659C Method of maintaining constant concentrations of substances contained in an electrolytic treatment bath |
| 03/09/2006 | WO2002033150A3 Electrochemical processing power device |
| 03/09/2006 | US20060049054 The position sensor measures the vertical distances traveled by gripping device with respect to a reference; sound or electromagnetic waves beam produced in a reference line or plane and the passage of the anode in the beam is used to measure the distances; vertical replacement position is determined |
| 03/08/2006 | EP1181965B1 Device for cleaning a fluid in the form of a vapor from a circuit |
| 03/08/2006 | CN1743513A High-speed continuous electroplating non-soluble anode conducting surface ablation on-line identifying method |
| 03/08/2006 | CN1244720C Plating method of electrolytic copper |
| 03/02/2006 | US20060042932 Apparatus and method for electroplating a workpiece |
| 03/02/2006 | DE202004016142U1 Device for continuous external current-free determination of the deposition behavior of metallizing baths useful in electrodeposition of metals has selective metallizing regions on catalytically active substrate surface |
| 03/01/2006 | EP1629704A1 Process for filling micro-blind vias |
| 02/28/2006 | US7005046 Apparatus for electro chemical deposition |
| 02/23/2006 | WO2006018173A1 Device and method for removing foreign matter from process solutions |
| 02/23/2006 | WO2005042804A3 Method and apparatus for fluid processing a workpiece |
| 02/23/2006 | US20060037863 For producing aluminum by electrolysis of alumina in cell comprising chamber containing molten electrolyte comprising cryolite and alumina, covered by solid crust; thermocouples |
| 02/23/2006 | DE102004038693A1 Vorrichtung und Verfahren zur Entfernung von Fremdstoffen aus Prozesslösungen Apparatus and method for removing foreign substances from process solutions |
| 02/22/2006 | CN2760056Y Filtering machine having internal circulation system |
| 02/21/2006 | US7001497 Process and apparatus for positioning replacement anodes in electrolytic cells |
| 02/16/2006 | WO2006016603A1 Tin-zinc alloy electroplating method |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/09/2006 | WO2006013855A2 Method of electric tinning |
| 02/08/2006 | EP1623058A2 Method and devices for increasing the service life of a process solution for chemical-reductive metal coating |
| 02/08/2006 | EP1623056A2 Method and device for coating a substrate |
| 02/08/2006 | CN1732291A Lead free bump and method of forming the same |
| 02/02/2006 | WO2005065208A3 Apparatus and method for treating used electroless plating solutions |
| 02/01/2006 | CN2755109Y Two-in-one electrolytical filter |
| 01/31/2006 | US6991711 Cup type plating apparatus |
| 01/31/2006 | CA2179904C Method and device for electrolytically depositing metals from electrolytes containing organic additives |
| 01/26/2006 | DE10232220B4 Vorrichtung und Verfahren zur direkten Rückgewinnung der Chemikalien, die sich beim Betrieb von Anlagen der Galvano- Oberflächentechnik in Absauganlagen ablagern Apparatus and method for direct recovery of the chemicals that are deposited in the operation of facilities electroplating surface technology in extraction systems |
| 01/25/2006 | CN1724721A Full set new technology for implementing electroplating trade cleaning production |
| 01/25/2006 | CN1238570C Coating method |
| 01/19/2006 | WO2006006992A1 Chromium plating method |
| 01/19/2006 | US20060012044 Plating method |
| 01/19/2006 | DE102004030726A1 Process to etch manufacture printed circuit board by regulation of electrolytic cell voltage transverse to the direction of travel |
| 01/19/2006 | CA2579670A1 Chromium plating method |
| 01/18/2006 | CN1722374A Substrate proximity processing structures and methods for using and making the same |
| 01/18/2006 | CN1722372A Proximity head heating method and apparatus |
| 01/12/2006 | US20060006071 Reducing defects; adjust bioas voltage, current; overcoating substrate with metal seed layer |
| 01/12/2006 | US20060006060 Method and apparatus for processing a substrate with minimal edge exclusion |
| 01/12/2006 | DE10220172B4 Verfahren und Vorrichtung zur Überwachung des Betriebszustands einer elektrochemischen Vorrichtung Method and apparatus for monitoring the operating state of an electrochemical device |
| 01/11/2006 | CN1718871A New technology of cleaning plated object for realizing cleaning production of electroplating business |
| 01/10/2006 | US6984302 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors |
| 01/10/2006 | US6984300 Contacting a metal material article having electrical conductivity with phosphate chemical treatment bath and electrolytic treatment to form film containing phosphate compound is formed on the surface of article |
| 01/10/2006 | US6984299 Methods for determining organic component concentrations in an electrolytic solution |
| 01/05/2006 | WO2005076680A3 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate |
| 01/05/2006 | US20060000717 Method and apparatus for stabilizing plating film impurities |
| 01/05/2006 | US20060000716 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 01/05/2006 | US20060000704 Solution treatment apparatus and solution treatment method |
| 01/04/2006 | EP1611270A2 Method and device for controlling at least one operating parameter of an electrolytic bath |
| 01/04/2006 | CN1717153A Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 01/03/2006 | CA2320278C Plating apparatus and method |
| 12/29/2005 | WO2005123989A1 Plating apparatus |
| 12/29/2005 | WO2004094702A8 Multi-chemistry plating system |
| 12/29/2005 | US20050284769 Using electrolytic bath; overcoating plating chromium compound on substrates; controlling temperature, pH |
| 12/29/2005 | CA2568579A1 Plating apparatus |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | CN1233880C Cathode chuck of electroplating tester |
| 12/22/2005 | US20050279640 Method of forming a lead-free bump and a plating apparatus therefor |
| 12/22/2005 | US20050279639 Coating process and apparatus with improved resistance to bacteria |
| 12/21/2005 | EP1036222A4 Copper metallization of silicon wafers using insoluble anodes |
| 12/20/2005 | US6977035 using solution including a compound containing a structure of X S Y , wherein X and Y are chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and contacting solution with ozone |
| 12/17/2005 | CA2498169A1 Coating process and apparatus with improved resistance to bacteria |
| 12/15/2005 | WO2005118918A2 Efficient analysis of organic additives in an acid copper plating bath |
| 12/15/2005 | US20050274620 Copper replenishment system for interconnect applications |
| 12/15/2005 | US20050274619 Modified electroplating solution components in a low-acid electrolyte solution |
| 12/14/2005 | CN1707759A Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 12/14/2005 | CN1231290C Vibration stirring device, and device and method for processing using stirring device |
| 12/08/2005 | WO2005116303A1 Method for electroplating bath chemistry control |
| 12/08/2005 | WO2005116300A1 External palladium plating structure of semiconductor component and semiconductor device manufacturing method |
| 12/08/2005 | US20050270535 Methods and apparatuses for analyzing solder plating solutions |
| 12/08/2005 | US20050269212 Method of making rolling electrical contact to wafer front surface |
| 12/07/2005 | EP1602127A2 Plating apparatus |
| 12/07/2005 | CN1230573C Method for making multistage counterflow series water trough work |
| 12/01/2005 | US20050263399 No cell cleaning and rinsing between the analyses; reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated |
| 12/01/2005 | DE102004021214A1 Producing and maintaining a prescribed gas composition in the environment of a band material after immersion treatment comprises moving the band material in a sealed housing from an immersion bath |
| 11/30/2005 | EP1601006A2 An apparatus and a method for processing a fluid meniscus |
| 11/30/2005 | EP1599620A1 Electrocoat management system |
| 11/30/2005 | EP1488025B1 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 11/30/2005 | CN1703541A Measurement of the concentration of a reducing agent in an electroless plating bath |