| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 02/26/2002 | US6350361 Real time control device for electroformation, plating and deplating processes |
| 02/20/2002 | EP1088121B1 Method for metal coating of substrates |
| 02/19/2002 | US6348138 Electroplating device for electroplating a work by rotation |
| 02/14/2002 | US20020017465 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/14/2002 | US20020017456 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 02/14/2002 | DE10037460A1 Process for recovering residues of aqueous treatment solutions comprises using an air stream to feed residues of rinsing water still adhering to drums into a rinsing sink having an overflow |
| 02/13/2002 | EP1179618A2 Plating apparatus and plating liquid removing method |
| 02/13/2002 | EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 02/13/2002 | CN1335419A Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
| 02/12/2002 | US6346222 Activating palladium, contacting with excess nitrate solution to make palladium nitrate, distilling at temperature below or equal to 115 degrees c., adding palladium sulfate, adding ammonium hydroxide to make palladium tetraammine sulfate |
| 02/07/2002 | US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis |
| 02/06/2002 | EP1178014A1 Process for treating chromate waste liquid |
| 02/06/2002 | CN1334359A Method and device for making multistage counterflow series water trough work |
| 02/05/2002 | US6344126 Electroplating apparatus and method |
| 02/05/2002 | US6344124 To obtain sharp boundaries between successive layers, voltage is switched from an electroplating substrate to a dummy electrode before power setting is changed, to allow the electrolyte to equilibrate |
| 02/05/2002 | US6344123 To obtain sharp boundaries between successive layers, voltage is switched from an electroplating substrate to a dummy electrode before power setting is changed, to allow the electrolyte to equilibrate |
| 01/31/2002 | WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 01/29/2002 | US6341998 Integrated circuit (IC) plating deposition system and method |
| 01/24/2002 | US20020008037 System for electrochemically processing a workpiece |
| 01/24/2002 | US20020008036 Multilayer; substrates, barrier on anode rod in tube, cyliner walls |
| 01/24/2002 | US20020008035 Method and apparatus for anodizing objects |
| 01/24/2002 | US20020008034 Using alkaline electrolyte bath; uniform overcoatings |
| 01/24/2002 | US20020008026 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 01/22/2002 | US6340426 Electrolytic treatment method |
| 01/17/2002 | WO2002004715A2 Deposition uniformity control for electroplating apparatus, and associated method |
| 01/17/2002 | WO2002004711A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 01/16/2002 | EP1171238A1 Method for producing a catalyst by means of electrodeposition |
| 01/16/2002 | CN2471797Y Cyclic filtering agitator for electrolysis |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020003084 Cathode current control system for a wafer electroplating apparatus |
| 01/09/2002 | EP1170402A1 Coated anode system |
| 01/09/2002 | CN2469978Y Improved internal-connected tube of exhaust valve of electroplating filtering machine |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/03/2002 | WO2002001610A2 Apparatus and method for electro chemical deposition |
| 01/03/2002 | WO2000061837A9 Workpiece processor having processing chamber with improved processing fluid flow |
| 01/03/2002 | US20020000379 Electroplating apparatus and electroplating method |
| 01/02/2002 | EP1165861A1 Copper recovery process |
| 01/02/2002 | CN1329681A Method and apparatus for electrochemical mechanical deposition |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/26/2001 | CN1328434A Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
| 12/26/2001 | CN1076762C Process for preparing aluminium alloy fastener and fastener |
| 12/20/2001 | WO2001096973A2 Pulse rectifiers in master/slave mode |
| 12/20/2001 | WO2001096632A2 A method and apparatus for conditioning electrochemical baths in plating technology |
| 12/20/2001 | US20010053562 Process for producing a substrate and plating apparatus |
| 12/19/2001 | EP1164209A2 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 12/19/2001 | EP1164208A2 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 12/18/2001 | US6331237 Method of improving contact reliability for electroplating |
| 12/13/2001 | WO2001094656A2 Plating apparatus with individually controllable anode segments and associated method |
| 12/06/2001 | WO2001092607A1 Regeneration of plating baths |
| 12/06/2001 | WO2001092604A2 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
| 12/05/2001 | EP1160846A2 Method of application of electrical biasing to enhance metal deposition |
| 12/05/2001 | CN1324959A Supplement method for bath |
| 11/29/2001 | WO2001091163A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 11/29/2001 | WO2001090434A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 11/29/2001 | US20010045360 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 11/28/2001 | EP1051541B1 Method for the electrolytic regeneration of contaminated rhodium solutions |
| 11/27/2001 | US6322689 Anodizing method and apparatus for performing the same |
| 11/27/2001 | US6322674 Cathode current control system for a wafer electroplating apparatus |
| 11/25/2001 | CA2349156A1 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 11/22/2001 | WO2001088228A1 Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in the electrolysis apparatus |
| 11/22/2001 | WO2001088211A2 Method for the treatment of work pieces with a palladium colloid solution |
| 11/22/2001 | US20010042694 Apparatus for determination of additives in metal plating baths |
| 11/22/2001 | US20010042690 Method and apparatus for electroplating and electropolishing |
| 11/22/2001 | US20010042687 Etching, anodizing |
| 11/22/2001 | US20010042686 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus |
| 11/22/2001 | CA2404620A1 Method for the treatment of work pieces with a palladium colloid solution |
| 11/20/2001 | US6319386 Submerged array megasonic plating |
| 11/15/2001 | US20010040100 Plating apparatus and method |
| 11/15/2001 | US20010039957 Method of and an apparatus for operating a multistage counter-flow cascade washer |
| 11/08/2001 | WO2001083857A1 Method and device for the electrolytic coating of a metal strip |
| 11/08/2001 | US20010039118 Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment |
| 11/08/2001 | CA2407660A1 Method and device for the electrolytic coating of a metal strip |
| 11/01/2001 | WO2001081657A2 Elastic contact element |
| 11/01/2001 | US20010035353 Flushing solution |
| 11/01/2001 | CA2402805A1 Elastic contact element |
| 10/31/2001 | EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 10/31/2001 | DE10019713A1 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems |
| 10/30/2001 | US6309518 Surface-treatment plant |
| 10/30/2001 | US6309517 Apparatus for inline plating |
| 10/25/2001 | WO2001079591A1 Apparatus and method for electrochemical processing of substrates |
| 10/25/2001 | WO2001079589A1 Method in and apparatus for etching or plating of substrates |
| 10/25/2001 | US20010032788 Divided housing |
| 10/25/2001 | DE10015349A1 Treatment method for wetting, removal of gas bubbles and improving material exchange in both through and blind holes in circuit boards by impulse generation |
| 10/23/2001 | US6306275 Providing plating bath containing electrolyte comprising water soluble nickel salt, polishing agent and alkylene oxide adduct; removing portion of electrolyte from electroplating bath; separating and adding adduct to bath and returning |
| 10/16/2001 | US6303401 Method for producing a metal layer with a given thickness |
| 10/11/2001 | DE10113767A1 Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine Electrolytic plating method and apparatus for a printed wiring board |
| 10/10/2001 | EP1142091A1 Power supply and method for producing non-periodic complex waveforms |
| 10/10/2001 | CN1316541A Guide roller scraper device of continuous molten metal electroplating equipment and method for preventing indentation |
| 10/09/2001 | US6299753 A fluid delivery system with particular application to electroplating. |
| 10/04/2001 | EP1138807A2 Perforated anode for uniform deposition of a metal layer |
| 09/27/2001 | WO2001072096A1 Treatment of circuit supports with impulse excitation |
| 09/27/2001 | WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 09/27/2001 | US20010023830 Electrolytic plating method and device for a wiring board |
| 09/27/2001 | DE10014710A1 Verfahren und Vorrichtung zum Betrieb einer mehrstufigen Gegenstromkaskadenspüle Method and apparatus for operating a multistage counter-current cascade rinsing |
| 09/27/2001 | CA2397078A1 Treatment of circuit circuit carriers with pulse like excitation |
| 09/26/2001 | EP1136595A1 Method for measuring leveler concentration of plating solution, and method and apparatus for controlling plating solution |
| 09/26/2001 | EP1136594A2 Apparatus and method for operating a multistage countercurrent cascade cleaning-system |
| 09/26/2001 | EP1136118A2 A mixing apparatus |
| 09/26/2001 | CN1314504A Liquid bath and weir piece |
| 09/26/2001 | CN1314503A Mixing device |